Journal•ISSN: 0360-3164
Plating and Surface Finishing
National Association for Science Fiction
About: Plating and Surface Finishing is an academic journal. The journal publishes majorly in the area(s): Plating & Electroplating. It has an ISSN identifier of 0360-3164. Over the lifetime, 1002 publications have been published receiving 6853 citations.
Topics: Plating, Electroplating, Corrosion, Coating, Copper
Papers published on a yearly basis
Papers
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TL;DR: In this article, a process was developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current, which was brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution.
Abstract: A process has been developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current. The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution. The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath. The reduction then occurs only at the surface of the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.
392 citations
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TL;DR: A review of mechanisms by which additives have been postulated to affect the rate of deposition of metals and their alloys can be found in this article, where the possible role of electrode filming in electrodeposition of difficult-to-plate metals is discussed, as well as anomalous and induced codeposition of alloys, and deposition of stoichiometric alloys.
Abstract: This review is of mechanisms by which additives have been postulated to affect the rate of deposition of metals and their alloys. Emphasis is on recent work in our laboratories, where mechanisms have been tested by choosing systems expected to exhibit the appropriate chemical behavior. Mechanisms chosen for study include: (a) ion bridging, (b) ion pairing, (c) changes in interfacial tension, (d) hydrogen evolution effects, (e) hydrogen adsorption, and (f) electrode filming. The possible role of electrode filming in electrodeposition of difficult-to-plate metals is discussed, as well as anomalous and induced codeposition of alloys, and deposition of stoichiometric alloys, such as the nickel-tin system
122 citations
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TL;DR: In this paper, the authors compare avantages et des inconvenients des trois types of depot in phase vapeur (evaporation, pulverisation, depot ionique).
Abstract: Principes de base des procedes de depot physique en phase vapeur (evaporation, pulverisation, depot ionique). Comparaison des avantages et des inconvenients des trois types de depot. Applications actuelles de chacun d'eux et perspectives d'applications futures et de developpement
95 citations
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TL;DR: In this article, a phase diagram for electroless nickel alloys including two non-equilibrium phases is presented, and the effect of structure on physical properties is described, including internal stress, magnetic response, ductility, corrosion resistance, passivity, porosity, hardness, wear resistance and strength.
Abstract: A new phase diagram for electroless nickel alloys includes two non-equilibrium phases. The effect of structure on physical properties is described, including internal stress, magnetic response, ductility, corrosion resistance, passivity, porosity, hardness, wear resistance and strength.
63 citations
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TL;DR: This article showed that polyethylene glycol (PEG) forme a barriere adsorbee au depot de cuivre, which is an epaisseur de monocouche.
Abstract: Le courant en fonction du potentiel et l'impedance d'une electrode a disque de cuivre dans une solution d'acide sulfurique et de sulfate de cuivre ont ete etudies en presence de diverses fractions moleculaires de polyethylene glycol (PEG). Les resultats suggerent que PEG forme une barriere adsorbee au depot de cuivre. Cette barriere a une epaisseur de monocouche. Les courants de depot de cuivre sont de plus en plus inhibes lorsque la masse molaire de PEG augmente. En presence d'ions chlorure, toutes les fractions de masses moleculaires de PEG inhibent les courants, beaucoup plus fortement qu'en presence de PEG seul
61 citations