Journal ArticleDOI
Air Flow Resistance of Wire Nettings in Natural Convection
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This article is published in Journal of Fluids Engineering-transactions of The Asme.The article was published on 1987-12-01. It has received 14 citations till now. The article focuses on the topics: Natural convection.read more
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Journal ArticleDOI
Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
Yoji Kitamura,Masaru Ishizuka +1 more
TL;DR: In this paper, the authors used three models of notebook PC that have two kinds of heat sources and the box was inclined 0 to 90 degrees up from the horizontal plane to increase the capability of natural air-cooling.
Journal ArticleDOI
Study on the chimney effect in natural air‐cooled electronic equipment casings under inclination: Proposal of a thermal design correlation that includes the porosity coefficient of an outlet opening
TL;DR: In this article, the effect of increased inclination and porosity coefficient of outlet openings on the cooling capability of a thin laptop PC was investigated, and the experimental data were reduced to a Nusselt number-Rayleigh number correlation, by using a modified reference length.
Journal ArticleDOI
Study on the natural air cooling of electronic equipment casings: Effects of the outlet vent and the power heater locations on the cooling capability
TL;DR: In this article, the effect of the size and the location of the outlet vent as well as the relative distance from the outlet to the ground station on the natural cooling of electronic equipment casings is investigated.
Proceedings ArticleDOI
Application of a semi-empirical approach to the thermal design of electronic equipment
TL;DR: In this paper, a semi-empirical approach to the thermal design of electronic equipment is presented, based on a lumped model, and experimental data of the flow resistance coefficient and heat transfer coefficient.
Journal ArticleDOI
Application of a semi-empirical approach to the thermal design of electronic equipment
M Ishizuka,S Hayama +1 more
TL;DR: In this article, a semi-empirical approach based on a lumped model and experimental data on the flow resistance coefficient and heat transfer coefficient is presented for the thermal design of electronic equipment.