Proceedings ArticleDOI
An Integer Programming Application for PCB Stack-up Arrangement
Jiayi He,Adam R. Klivans,Zurab Kiguradze,Arun Chada,Bhyrav M. Mutnury,Jay Reddy,James L. Drewniak,Jun Fan +7 more
- pp 432-436
TLDR
The general rules in stack-up arrangement are transformed to equalities and inequalities using mathematical programming techniques and the integer programming solver can solve the stack- up arrangement problem very efficiently for a PCB with 20 layers or more.Abstract:
This paper introduces an integer programming application for PCB stack-up arrangement. The general rules in stack-up arrangement are transformed to equalities and inequalities using mathematical programming techniques. Then the integer programming solver can solve the stack-up arrangement problem very efficiently for a PCB with 20 layers or more.read more
Citations
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Proceedings ArticleDOI
ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
Hyun-Jin Chae,Bhyrav M. Mutnury,Keren Zhu,Douglas E. Wallace,Douglas S. Winterberg,Daniel de Araujo,J. Sai Balaji Reddy,Adam R. Klivans,David Z. Pan +8 more
TL;DR: In this paper , a machine learning-assisted hyper-parameter optimization method is proposed to automate stack-up design with a new framework, ISOP, using machine learning for inverse stackup optimization for advanced package design.
Proceedings ArticleDOI
ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
TL;DR: In this article , a machine learning-assisted hyper-parameter optimization method is proposed to automate stack-up design with a new framework, ISOP, using machine learning for inverse stackup optimization for advanced package design.
Fast PCB Stack-Up Optimization Using Integer Programming
Jiayi He,Ling Zhang,Zurab Kiguradze,Arun Chada,Adam R. Klivans,Bhyrav M. Mutnury,Erping Li,Jun Fan +7 more
TL;DR: In this article , a flexible and efficient methodology to optimize stack-up for multilayer printed circuit boards (PCBs) with enormous search space and various design constraints is presented.
References
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Proceedings ArticleDOI
Accurate characterization of PCB transmission lines for high speed interconnect
TL;DR: In this paper, VNA measurements with innovative de-embedding approaches, including those that utilize only one “2X-Thru” calibration standard are studied, and the 2X- thwarts method is first shown to be correlated to existing TRL calibration method.
Proceedings ArticleDOI
A Comprehensive and Practical Way to Look at Crosstalk for Transmission Lines with Mismatched Terminals
TL;DR: This paper re-define the far-end crosstalk (FEXT) as a combination of several components generated by different coupling and reflection mechanisms, and a new set of crosStalk estimation formulas is developed to calculate the contribution of each component.
Proceedings ArticleDOI
PCB stack-up design and optimization for next generation speeds
TL;DR: In this article, an empirical simulation tool was presented to predict the transmission line performance of coupled differential microstrip and strip lines, based on the Artificial Neural Network (ANN) method, the predicted transmission line performances were accurate and were suitable for printed circuit board (PCB) stack-up design.
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