Journal ArticleDOI
Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges†
Markku Leskelä,Mikko Ritala +1 more
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TLDR
The self-limiting growth mechanism characteristic to atomic layer deposition (ALD) facilitates the control of film thickness at the atomic level and allows deposition on large and complex surfaces, which makes ALD a very promising technique for future integrated circuits.Abstract:
New materials, namely high-k (high-permittivity) dielectrics to replace SiO2, Cu to replace Al, and barrier materials for Cu, are revolutionizing modern integrated circuits. These materials must be deposited as very thin films on structured surfaces. The self-limiting growth mechanism characteristic to atomic layer deposition (ALD) facilitates the control of film thickness at the atomic level and allows deposition on large and complex surfaces. These features make ALD a very promising technique for future integrated circuits. Recent ALD research has mainly focused on materials required in microelectronics. Chemistry, in particular the selection of suitable precursor combinations, is the key issue in ALD; many interesting results have been obtained by smart chemistry. ALD is also likely to find applications in other areas, such as magnetic recording heads, optics, demanding protective coatings, and micro-electromechanical systems, provided that cost-effective processes can be found for the materials required.read more
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Journal ArticleDOI
TiO2 nanotubes: synthesis and applications.
TL;DR: This review attempts to cover all aspects, including underlying principles and key functional features of TiO(2), in a comprehensive way and also indicates potential future directions of the field.
Journal ArticleDOI
Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process
TL;DR: In this paper, the surface chemistry of the trimethylaluminum/water ALD process is reviewed, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials.
Journal ArticleDOI
A brief review of atomic layer deposition: from fundamentals to applications
TL;DR: Atomic layer deposition (ALD) is a vapor phase technique capable of producing thin films of a variety of materials as discussed by the authors, including metal oxides such as Zn1−xSnxOy, ZrO2, Y2O3, and Pt.
Journal ArticleDOI
Crystallinity of inorganic films grown by atomic layer deposition: Overview and general trends
TL;DR: Puurunen et al. as discussed by the authors summarized the two-reactant ALD processes to grow inorganic materials developed to-date, updating the information of an earlier review on ALD.
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