Patent
Die paddle enhancement for exposed pad in semiconductor packaging
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TLDR
In this paper, a new design for the die-paddle that is used as part of a package for packaging semiconductor devices is presented, which creates a space between the ground ring of the diepaddle and the surface over which the ground paddle is mounted.Abstract:
A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the die-paddle and the surface over which the ground paddle is mounted. The new design further comprises an S-shaped segment between the ground ring and the center of the die-paddle, the S-shaped segment provides stress relieve between the ground ring and the center of the die-paddle.read more
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References
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Patent
Thermally and electrically enhanced PBGA package
TL;DR: In this article, the die and the substrate are interconnected by means of signal transferring means. And the die is attached to the substrate by a die paddle and a power ring is formed around the die paddle on the surface of the substrate.
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