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Proceedings ArticleDOI

Enhanced optical inspectability of patterned EUVL mask

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TLDR
In this article, the authors describe the overall EUVL mask inspection strategy and present a comprehensive discussion on mask optimization in materials selection and modification for high inspectability, which greatly improves the optical inspectability of EUVL masks to a level similar to conventional transmission mask.
Abstract
For optical inspection of Extreme Ultraviolet Lithography (EUVL) masks using Deep Ultraviolet (DUV) light, contrast from reflected light is used to form the image of the mask and detect the defects. The inspectability of a patterned mask depends on the optical properties, surface conditions and thickness of absorber and buffer layer. The issue in EUVL mask inspection is the relatively low image contrast in the inspection tool because both the EUV-reflective and EUV-absorbing regions reflect DUV light. The need of a buffer layer to protect the multilayer (ML) reflector during mask processing and defect repair necessitates two inspections for a patterned mask: one with the buffer layer on to find the defect for repair and one with the buffer layer removed to qualify a final mask. Since the ML appears bright at DUV inspection wavelengths, the buffer layer is also chosen to give high reflectivity. Therefore, the absorber reflectivity must be low enough to provide high image contrast and to avoid the edge interference effect. Recently, we have developed a surface treatment process to reduce the reflectivity of absorber layer and result in a DUV contrast approaching 90 percent. This greatly improves the optical inspectability of EUVL mask to a level similar to conventional transmission mask. In this paper, we describe the overall EUVL mask inspection strategy and present a comprehensive discussion on mask optimization in materials selection and modification for high inspectability. We report the reflectivity of Mo-Si multilayer, buffer layers using SiO2 and Ru, and absorber layers of Cr and TaN. We will demonstrate with DUV inspection images of the optimized EUVL masks that the image contrast and quality from reflected light are close to those of conventional photo-masks with transmitted light. This greatly enhanced EUVL mask inspectability will increase defect detectability for inspection tools and simplify image rendering in die-to-database inspection.

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Journal ArticleDOI

Extreme ultraviolet lithography: A review

TL;DR: In this paper, a broad range of topics, including history, tools, source, metrology, condenser and projection optics, resists, and masks, are thoroughly reviewed over a broad variety of topics.
Proceedings ArticleDOI

EUVL masks: requirements and potential solutions

TL;DR: Significant progress has been made in developing mask fabrication processes for extreme ultraviolet lithography (EUVL) masks as mentioned in this paper, which consists of a low thermal expansion material substrate having a square photomask form factor that is coated with Mo/Si multilayers.
Proceedings ArticleDOI

Demonstration of damage-free mask repair using electron beam-induced processes

TL;DR: In this article, the first commercial E-beam mask repair tool is presented. And the defect sites on chrome-on-glass masks are characterized with 193nm AIMS to quantify the edge placement precision as well as optical transmission loss.
Proceedings ArticleDOI

Evaluation of the capability of a multibeam confocal inspection system for inspection of EUVL mask blanks

TL;DR: In this article, a multibeam confocal inspection (MCI) system was proposed to detect phase defects in extreme ultraviolet (EUV) mask substrate and blank inspection, which is a defect type unique to EUVL masks.
Proceedings ArticleDOI

EUV mask pattern defect printability

TL;DR: In this article, the authors performed extensive studies of pattern defect printability for EUV masks with a high numerical aperture (NA) exposure tool and investigated as many as 10 types of defects designed on the PDM for each pattern layer.
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