Estimation of filament temperature and adhesion development in fused deposition techniques

TLDR: In this paper, an analytical solution to the transient heat conduction developing during filament deposition in Fused Deposition Techniques (FDT), which is coupled to a routine that activates or deactivates all relevant local boundary conditions depending on part geometry, operating conditions and deposition strategy, is presented.

About: This article is published in Journal of Materials Processing Technology.The article was published on 2017-07-01 and is currently open access. It has received 180 citations till now. The article focuses on the topics: Protein filament & Deposition (phase transition).

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Table 1 Process parameters and material properties.

Table 2 Material properties of ABS FA 4475.

Fig. 5. Geometry and deposition sequence used to illustrate the results of the calculations (dimensions in mm).

Fig. 6 shows the filament temperature at various instants of he deposition process (an animated view of cooling can be creted). Clearly, the newest filament segment or elementary length s always the hottest one and cools down gradually, although the ffect of the physical contacts is difficult to perceive in this repreentation. The phenomenon is better seen in Fig. 7, which depicts he time evolution of the temperature of filament segments 1–9 t a vertical xx plan distant 0.05 m from the origin (see Fig. 5). As a ew filament segment is deposited, the temperature of the adjacent egments increases and so their cooling is delayed. The physical ontacts can alter local filament temperatures by as much as 18 ◦C.

Fig. 15. Temperature evolution with time (at x = 40 mm) of a filament segment deposited on top of another (die set to 200 ◦C and 220 ◦C).

Fig. 7. Time evolution of the temperature of filament segments 1–9 for the geometry and deposition sequence illustrated in Fig. 5, at a vertical xx plan distant 0.05 m from the origin.