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Proceedings ArticleDOI

Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time(C-t) measurement"

Jichoel Bea, +5 more
- 24 Sep 2010 - 
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This article is published in The Japan Society of Applied Physics.The article was published on 2010-09-24. It has received 1 citations till now. The article focuses on the topics: Wafer & Diffusion (business).

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Journal ArticleDOI

High Speep/High-Precision Chip Joining Using Self-Assembly Technology for Three-Dimensional Integrated Circuits

Kang-Wook Lee
TL;DR: Moore et al. as discussed by the authors proposed the MEMS (Mechanical- electrical micro system) (3-dimensional integration) to integrate three-dimensional information in a 3-dimensional IC.
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