Journal ArticleDOI
Experimental constitutive relations for the high temperature deformation of a PbSn eutectic alloy
B.P. Kashyap,G.S. Murty +1 more
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TLDR
In this article, the high temperature steady state deformation behavior of PbSn eutectic alloy was investigated over wide ranges of grain size (9.7 − 32.0 μm), temperature (298 − 443 K) and strain rate (10 −7 − 10 −2 s −1 ), after stability of microstructure and strength had been achieved through prior tensile deformation.About:
This article is published in Materials Science and Engineering.The article was published on 1981-10-01. It has received 149 citations till now. The article focuses on the topics: Superplasticity & Eutectic system.read more
Citations
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Journal ArticleDOI
Constitutive relations for tin-based-solder joints
R. Darveaux,Kingshuk Banerji +1 more
TL;DR: In this article, extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb5Sn, and 95Pb6Sn solder assemblies were collected to properly account for the effects of grain size and intermetallic compound distribution.
Journal ArticleDOI
The mechanical properties of superplastic materials
TL;DR: The relationship between stress and strain rate is often sigmoidal in superplastic materials, with a low strain rate sensitivity at low and high strain rates (regions I and III, respectively) and a high strain rate sensitive at intermediate strain rate (region II) where the material exhibits optimal super-plasticity as discussed by the authors.
Journal ArticleDOI
Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
TL;DR: In this paper, a unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging.
Journal ArticleDOI
Constitutive relation and creep-fatigue life model for eutectic tin-lead solder
S. Knecht,L.R. Fox +1 more
TL;DR: In this article, a constitutive equation for a typical SnPb eutectic or near-eutective solder joint is developed, based on empirical data in shear and generalized to three dimensions.
Proceedings ArticleDOI
Constitutive behaviour of lead-free solders vs. lead-containing solders-experiments on bulk specimens and flip-chip joints
TL;DR: In this paper, two lead-free solders (sn96.5Ag3.5, Sn95.8Cu0.7, Sn63Pb37 Sn59Pb40Agl) were investigated and compared with each other in order to give an estimation of the reliability enhancement of the new leadfree soldering technology.
References
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Journal ArticleDOI
Diffusional Viscosity of a Polycrystalline Solid
TL;DR: In this article, it is suggested that mosaic boundaries and boundaries between grains of nearly the same orientation may not serve as sources or sinks of the diffusion currents, in which case the creep rate will depend only on the configuration of grain boundaries having a sizable orientation differen...
Journal ArticleDOI
A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials
TL;DR: In this article, the authors discussed the mechanism of creep in polycrystalline alumina based on the differences between the lattice and boundary diffusion models and showed that the boundary diffusion model is more stable than lattice diffusion model, while the grain size dependence and the numerical constant are greater.
Journal ArticleDOI
Diffusion-accommodated flow and superplasticity
M.F. Ashby,R. A. Verrall +1 more
TL;DR: In this article, a new mechanism for superplastic deformation is described and modelled, which differs fundamentally from Nabarro-Herring and Coble creep in a topological sense: grains switch their neighbors and do not elongate significantly.
Journal ArticleDOI
Grain-boundary sliding and its accommodation during creep and superplasticity
TL;DR: In this paper, the roles of grain-boundary sliding (GBS) and of other creep mechanisms in creep and fine-grain superplasticity are presented in relation to a model based on the division of grains into their central cores and peripheral “mantles.
Journal ArticleDOI
The rate controlling mechanism in superplasticity
TL;DR: In this paper, a model for superplastic deformation is proposed that is based on grain boundary sliding and is controlled by the rate of deformation of the grain interior, and a comparison is made of the proposed model and the various creep mechanisms in order to reveal the ranges of conditions over which each mechanism predominates and how the various mechanisms are related one to another.
Related Papers (5)
Constitutive relation and creep-fatigue life model for eutectic tin-lead solder
S. Knecht,L.R. Fox +1 more