Journal ArticleDOI
Forced convective heat transfer from LSI packages in an air-cooled wiring card array
TLDR
In this paper, the authors studied the resistance to heat flow from finned LSI packages to cooling air flow by combining the physical models with the results of heat transfer experiments, flow visualization experiments, and pressure drop measurements.Abstract:
The resistance to heat flow from finned LSI packages to the cooling air flow has been studied by combining the physical models with the results of heat transfer experiments, flow visualization experiments, and pressure drop measurements. Although crude assumptions are employed in analytical modeling, the proposed method of prediction of heat transfer and pressure drop has proved useful to cooling system designers. A notable finding is the advantage obtained by placing the packages in a staggered arrangement on the card. This reduces the local air temperature rise by as much as 70% over the conventional in-line arrangement, where the fan power is given as a constraint.read more
Citations
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Book ChapterDOI
Thermal Control of Electronic Equipment and Devices
G. P. Peterson,Alfonso Ortega +1 more
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Journal ArticleDOI
Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages
Journal ArticleDOI
Free stream cooling of a stack of parallel plates
TL;DR: In this paper, the authors address the fundamental heat transfer augmentation question of how to arrange a stack of parallel plates (e.g., fins of heat sink, printed circuit boards) in a free stream such that the thermal resistance between the stack and the stream is minimum.
Book ChapterDOI
Heat Transfer in Electronic Packages
TL;DR: In this paper, it was shown that the transistor, with its relatively low power requirements, would greatly minimize, if not totally eliminate, all cooling concerns, and such thoughts, however, were short lived, as engineers sought to improve performance, cost, and reliability by packaging greater numbers of circuits in an ever smaller space.
Journal ArticleDOI
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection
TL;DR: In this paper, the authors investigated heat transfer from an in-line 1 x 10 array of discrete heat sources, flush mounted to protruding substrates located on the bottom wall of a horizontal flow channel.
References
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Book
Boundary layer theory
TL;DR: The flow laws of the actual flows at high Reynolds numbers differ considerably from those of the laminar flows treated in the preceding part, denoted as turbulence as discussed by the authors, and the actual flow is very different from that of the Poiseuille flow.
Journal ArticleDOI
Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment
TL;DR: In this article, a multi-faceted experimental investigation has been carried out to study heat transfer and pressure drop for airflow in arrays of heat generating rectangular modules deployed along one wall of a flat rectangular duct.
Laminar Flow Forced Convection Heat Transfer and Flow Friction in Straight and Curved Ducts - A Summary of Analytical Solutions
Ramesh K. Shah,A. L. London +1 more
TL;DR: Theoretical laminar flow solutions for heat transfer and flow friction are of importance in the development of compact heat exchangers as discussed by the authors, generally the higher the degree of compactness, the lower is the Reynolds number and the greater is the relevance of the theory solutions.
Journal ArticleDOI
An Elementary Analysis for Predicting the Momentum- and Heat- Transfer Characteristics of a Hydraulically Rough Surface
TL;DR: In this paper, a simple model is presented which approximates the turbulent shear flow over a well-defined rough surface as a series of attached and separated flow regions, and an elementary analysis applied to the model provides values for the well-known momentum and heat-transfer roughness functions R(h+ ) and g(h+, Pr), respectively.