Journal ArticleDOI
Joining of sintered silicon carbide using ternary Ag–Cu–Ti active brazing alloy
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TLDR
In this article, the interfacial microstructure was investigated by electron probe microanalysis (EPMA), X-ray diffraction (XRD) and transmission electron microscopy (TEM).About:
This article is published in Ceramics International.The article was published on 2009-12-01. It has received 82 citations till now. The article focuses on the topics: Flexural strength & Brazing.read more
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Recent advances in joining of SiC-based materials (monolithic SiC and SiC f /SiC composites): Joining processes, joint strength, and interfacial behavior
TL;DR: In this paper, the authors reviewed the joining of SiC-based materials by classifying the as-received interlayer materials, involving no interlayer, metallic, glass-ceramic, and organic interlayers.
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Brazing SiC ceramic using novel B4C reinforced Ag–Cu–Ti composite filler
TL;DR: In this paper, a novel B 4 C reinforced Ag-Cu-Ti composite filler was developed to braze SiC ceramics, and the interfacial microstructure of the joints was characterized by scanning electron microscope (SEM), X-ray diffraction (XRD), and transmission electron microscopy (TEM).
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Characterization of silicon carbide joints fabricated using SiC particulate-reinforced Ag–Cu–Ti alloys
TL;DR: In this article, a CVD silicon carbide was brazed to itself using two Ag-Cu-Ti braze alloys reinforced with SiC particulates to control braze thermal expansion and enhance joint strength.
Journal ArticleDOI
Microwave assisted combustion synthesis in the system Ti–Si–C for the joining of SiC: Experimental and numerical simulation results
Roberto Rosa,Paolo Veronesi,Shahoua Han,Valentina Casalegno,Milena Salvo,Elena Colombini,Cristina Leonelli,Monica Ferraris +7 more
TL;DR: In this article, a simplified model was developed with the aim of obtaining a deeper understanding of the here proposed rapid, almost pressureless and localized heating joining method, which demonstrated that joining of SiC can be rapidly obtained with minimization of heat affected zones in the SiC substrates.
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Grain wear of brazed polycrystalline CBN abrasive tools during constant-force grinding Ti–6Al–4V alloy
TL;DR: In this article, the stock removal and tool wear of brazed polycrystalline cubic boron nitride (PCBN) abrasive wheel heads were evaluated by comparison with that of monocrystalline CBN counterparts.
References
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Journal ArticleDOI
Phase reaction and diffusion path of the SiC/Ti system
TL;DR: In this paper, the total diffusion path between SiC and Ti was investigated in detail at 1673 K using Ti foil with a thickness of 50 µm, and at a bonding time of 0.3 ks, TiC at the Ti side and a mixture of Ti5Si3C>>\s and TiC on the SiC side were formed.
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Joining of reaction-bonded silicon carbide using a preceramic polymer
TL;DR: In this paper, the strength of reaction-bonded silicon carbide (RBSiC) joints was determined by four-point bending, shear and indentation tests.
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Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy
TL;DR: In this paper, a pressureless-sintered SiC was brazed to itself using Ag-Cu alloy foil to which titanium had been added, and the results revealed that increasing the titanium addition to the base metal from 2 to 8 wt % improved the wettability greatly, but the bonding generally became weaker.
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Brazing of yttria-stabilized zirconia (YSZ) to stainless steel using Cu, Ag, and Ti-based brazes
TL;DR: In this article, copper and silver-base active metal brazes containing Ti (Cu-ABA, Ticusil, and Ticuni) were tested for oxidation resistance to 750-850°C, and for their effectiveness in joining yttria-stabilized-zirconia (YSZ) to a corrosion-resistant ferritic stainless steel.
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Kinetic and microstructural aspects of the reaction layer at ceramic/metal braze joints
TL;DR: In this article, the formation and stability of the reaction layer when brazing non-oxide ceramic materials were studied, and it was established that the matrix composition of titanium-bearing filler metals affects the ceramic wetting characteristics and reaction layer kinetics.