Book ChapterDOI
Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds
M. H. Shirangi,B. Michel +1 more
- pp 29-69
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TLDR
In this article, a comprehensive investigation of the mechanism of moisture diffusion in epoxy molding compounds (EMCs) is presented, where the results from moisture diffusion tests during absorption, desorption, and re-sorption of various EMC samples are presented.Abstract:
Epoxy molding compounds (EMCs) are widely used as encapsulation materials for protecting the semiconductor chips of plastic encapsulated microcircuits (PEMs) against harsh environments and mechanical forces such as impact and pressure. Since PEMs are usually exposed to humid conditions during their storage and service life, they absorb moisture, which causes many reliability problems such as popcorn cracking and interfacial delamination during the solder reflow process. This chapter presents a comprehensive investigation of the mechanism of moisture diffusion in EMCs. The results from moisture diffusion tests during absorption, desorption, and re-sorption of various EMC samples are presented. The gravimetric results showed a non-Fickian behavior of the moisture diffusion in the EMCs. This non-Fickian behavior was found to induce a non-reversible effect by causing some residual moisture content upon baking these plastic parts. The gravimetric moisture diffusion results can be correlated to moisture-induced hygroscopic swelling and adhesion loss. Hygroscopic swelling of EMC and its reversibility was investigated using both bulk EMC samples and bi-material beams. Moreover, the effect of moisture on the adhesion of EMC/Cu interface was studied using a fracture mechanics approach. Two mechanisms of adhesion loss upon moisture diffusion can be observed. Some of the adhesion loss due to small amount of moisture content may be recovered via a proper annealing. However, upon long-term storage in humid conditions, where the second phase of non-Fickian behavior is activated at the interface, none of the adhesion loss can be recovered after baking the samples.read more
Citations
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References
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Journal ArticleDOI
Moisture Absorption and Desorption of Composite Materials
Chi-Hung Shen,George S. Springer +1 more
TL;DR: In this paper, a series of tests using unidirectional and π/4 Graphite T-300 Fiberite 1034 composites were performed in the temperature range 300-425 K with the material submerged both in moist air (humidity 0 to 100%) and in water.
Journal ArticleDOI
A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
TL;DR: In this paper, a finite element approach has been used to characterize trends in the stress intensities and center point displacement with specimen dimensions, elastic properties, and crack length with finite element approaches.
Journal ArticleDOI
Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials
TL;DR: In this paper, the authors present results of experiments in which the thermal expansion and swelling behavior of an epoxy resin system and two graphite/epoxy composite systems exposed to water were measured.
Journal ArticleDOI
A discussion of the molecular mechanisms of moisture transport in epoxy resins
TL;DR: Soles et al. as mentioned in this paper examined the role of electron density heterogeneities, or nanovoids, in the moisture-transport process of amine-cured epoxy resins.
Journal ArticleDOI
Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive
TL;DR: In this article, the diffusion, swelling and thermal characteristics of a rubber toughened epoxy adhesive were investigated in the presence of water immersion and water immersion at 50°C.