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Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets

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TLDR
In this article, the output of a continuously pumped, Q-switched, Nd:YAG laser is converted to provide ultraviolet light for forming vias in targets (40) having metallic layers (64,68) and a dielectric layer (66).
Abstract
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in targets (40) having metallic layers (64,68) and a dielectric layer (66) The invention employs a first laser output of high power density to ablate the metallic layer and a second laser output of a lower power density to ablate the dielectric layer The parameters of the output pulses (62) are selected to facilitate substantially clean, sequential drilling or via formation These parameters typically include at least two of the following criteria: power density first above and then below the ablation threshold of the conductor, wavelength less than 400 nm, a temporal pulse width shorter than about 100 nanoseconds, and a repetition rate of greater than about one kilohertz The ability to generate ultraviolet light output pulses at two power densities facilitates the formation of depthwise self-limiting blind vias in multilayer targets, such as a target composed of a layer dielectric material covered on either surface by a layer of metal

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Citations
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References
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Book ChapterDOI

Ultraviolet Laser Ablation of Organic Polymer Films

R. Srinivasan
- 01 Sep 1989 - 
TL;DR: When a pulse (~ 14 nsec half width) of laser radiation of 193 nm wavelength with a fluence above a threshold value falls on a polymer film, the material at the irradiation site is spontaneously etched away to a depth of 1000 A or more.
Patent

Ultraviolet laser system and method for forming vias in multi-layered targets

TL;DR: In this paper, the output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light for forming vias (72, 74) in multi-layered targets (40).
Patent

Laser beam scanning method for forming via holes in polymer materials

TL;DR: In this article, the surface of a polymer dielectric layer is scanned repeatedly with a high energy continuous wave laser in a pattern to create via holes of desired size, shape and depth.
Patent

Far UV patterning of resist materials

TL;DR: In this article, a technique for the fabrication of devices and circuits using multiple layers of materials, where patterned layers of resists are required to make the device or circuit, is described by the selective removal of portions of the resist layer by ablative photodecomposition.
Journal ArticleDOI

Spectroscopic and fast photographic studies of excimer laser polymer ablation

P. E. Dyer, +1 more
TL;DR: The time dependence of the expansion for various environmental gas pressures has been studied in this way as discussed by the authors, showing that at low pressures (< 0.5 mb) the expansion approaches a free expansion into a vacuum, while at 15 mb the time dependence is close to that predicted by an ideal blast wave model, suggesting that a significant fraction of the luminous species detected spectroscopically may be created in the shock front at the plume/environmental gas interface.
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