Journal ArticleDOI
Milling and separation of the multi-component printed circuit board materials and the analysis of elutriation based on a single particle model
TLDR
In this paper, the use of mechanical means to separate the metallic and non-metallic components present in printed circuit boards (PCBs) was examined and the separation efficiency was analyzed in terms of composition, particle size and operating condition of the elutriation flow rate.About:
This article is published in Powder Technology.The article was published on 2008-04-09. It has received 40 citations till now. The article focuses on the topics: Separation process & Elutriation.read more
Citations
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Journal ArticleDOI
Recovery of metals and nonmetals from electronic waste by physical and chemical recycling processes
TL;DR: It seems that hydrometallurgical route will be a key player in the base and precious metals recoveries from e-waste, along with purification and refining.
Journal ArticleDOI
Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers
Luciana Harue Yamane,Viviane Tavares de Moraes,Denise Crocce Romano Espinosa,Jorge Alberto Soares Tenório +3 more
TL;DR: The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers.
Journal ArticleDOI
Thermogravimetric analysis and kinetic study on large particles of printed circuit board wastes.
Cui Quan,Aimin Li,Ningbo Gao +2 more
TL;DR: Experimental results show that large particle has a pyrolysis reaction retardancy compared to fine one, and the distributed activation energy model was used to study the pyroglysis kinetics.
Journal ArticleDOI
Status of electronic waste recycling techniques: a review.
TL;DR: The composition of different PCBs and their harmful effects are discussed, various techniques in common use for recycling the most important metals from the metallic fractions of e-waste are illustrated, and the recovery of metals from e-Waste material after physical separation through pyrometallurgical, hydrometalurgical, or biohydromet allurgical routes is discussed.
Journal ArticleDOI
Printed circuit boards: A review on the perspective of sustainability
TL;DR: A literature review onprinted circuit boards is presented, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards.
References
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Journal ArticleDOI
Drag coefficient and terminal velocity of spherical and nonspherical particles
A. Haider,Octave Levenspiel +1 more
TL;DR: In this paper, explicit equations for the drag coefficient and for the terminal velocity of falling spherical and nonspherical particles are developed for the CD and ut. The goodness of fit of these equations to the reported experimental data is evaluated and compared with that of other recently proposed equations.
Journal ArticleDOI
Mechanical recycling of waste electric and electronic equipment: a review.
Jirang Cui,Eric Forssberg +1 more
TL;DR: The physical and particle properties of WEEE are presented and it is expected that a mechanical recycling process will be developed for the upgrading of low metal content scraps.
Journal ArticleDOI
Electronic waste recycling: A review of U.S. infrastructure and technology options
Hai-Yong Kang,Julie M. Schoenung +1 more
TL;DR: In this article, various recycling technologies for the glass, plastics, and metals found in e-waste are discussed and compared on the basis of available technologies, resources, and material input-output systems.
Journal ArticleDOI
A comparison of electronic waste recycling in Switzerland and in India
TL;DR: In this paper, the authors present an insight into the disposal of end-of-life appliances in both countries, including appliance collection and the financing of recycling systems as well as the social and environmental aspects of the current practices.
Journal ArticleDOI
Mechanical separation-oriented characterization of electronic scrap
Shunli Zhang,Eric Forssberg +1 more
TL;DR: In this paper, the authors evaluate the amenability of mechanical separation processes for electronic scrap and show that a high quality copper concentrate can be expected by density-based separation techniques, which can be used in separating metals from plastics, light plastics from glass fiber reinforced resins and aluminum from heavy metals.
Related Papers (5)
Mechanical recycling of waste electric and electronic equipment: a review.
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Recycling of non-metallic fractions from waste printed circuit boards: a review.
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