Journal ArticleDOI
Observation, Analysis, and Simulation of the Hysteresis of Silicon Using Ultra-Micro-Indentation with Spherical Indenters
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In this paper, the authors investigated the hysteretic behavior of silicon under indentation using an ultra-micro-indentation system with an 8.5 μm spherical-tipped indenter.Abstract:
The recently reported hysteretic behavior of silicon under indentation (Clarke et al.1 and Pharret al.2-5) is investigated using an ultra-micro-indentation system with an 8.5 μm spherical-tipped indenter. The onset of “plastic” behavior during loading and hysteresis during unloading was readily observed at loads in excess of 70 mN. Cracking about the residual impression was observed only at loads of 350 mN and higher. An analysis of the data is presented that estimates the following: (1) the initial onset of deformation occurs at a mean pressure of 11.8 ± 0.6 GPa, (2) the mean pressure at higher loads is 11.3 ± 1.3 GPa, and (3) the hysteretic transition on unloading occurs at mean pressures between 7.5 and 9.1 GPa. These values are in good agreement with the accepted literature values for the known silicon transformation pressures. A simulation of the force-displacement data based on the analysis and model is presented and is found to fit the observations very well.read more
Citations
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Effect of phase transformations on the shape of the unloading curve in the nanoindentation of silicon
TL;DR: In this paper, a strong correlation between the shape of the load-displacement curve and the phase transformations occurring within a nanoindentation was reported, which is consistent with the results of high pressure cell experiments.
Journal ArticleDOI
Mechanical deformation in silicon by micro-indentation
TL;DR: In this article, the effects on the final deformation microstructure of the load-unload rates and both spherical and pointed indenters were investigated at maximum loads of up to 250 mN.
Journal ArticleDOI
Comparison of nano-indentation hardness to microhardness
TL;DR: In this article, the authors measured the nano-indentation hardness and micro-hardness in a wide load range (0.1-19600 mN) for five materials.
Journal ArticleDOI
Transmission electron microscopy observation of deformation microstructure under spherical indentation in silicon
TL;DR: In this article, the authors used cross-sectional transmission electron microscopy (XTEM) to study spherical indentation of crystalline silicon and found that a thin layer of polycrystalline material has been identified on the low-load indentation.
References
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Journal ArticleDOI
Indentation fracture: principles and applications
Brian R. Lawn,Rodney Wilshaw +1 more
TL;DR: The basic principles and practical applications of indentation fracture are reviewed in this article, with a focus on the application of fracture fracture in the field of orthogonal fracture repair and alignment.
Journal ArticleDOI
A simple predictive model for spherical indentation
J.S. Field,Michael V. Swain +1 more
TL;DR: In this paper, a simple model is described with which the entire force versus penetration behavior of indentation with a sphere, during loading and unloading, may be simulated from knowledge of the four test material parameters, Young's modulus, Poisson's ratio, flow stress at the onset of full plastic flow and strain hardening index, and the elastic properties of the indenter.
Journal ArticleDOI
The deformation behavior of ceramic crystals subjected to very low load (nano)indentations
TL;DR: In this article, a software-controlled hardness tester (Nanoindenter) operating in the load range 2-60 mN was used to characterize the deformation structures associated with these very small-scale hardness impressions.
Journal ArticleDOI
Crystal data for high-pressure phases of silicon
TL;DR: Crystallographic data are presented in phase I (cubic, diamond), II (tetragonal, ..beta..-Sn), V (simple hexagonal), VII (hexagonal close-packed), and the metastable phase III (body-centered-cubIC (BC8)) and on the coexistence of the phases.
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