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Patent

Offset drain fermi-threshold field effect transistors

TLDR
In this article, offset drain Fermi threshold field effect transistor (Fermi-FET) is introduced to introduce a drift region between the drain region and the FermI-Fet channel that can provide high voltage and/or high frequency FETs.
Abstract
An offset drain Fermi-threshold field effect transistor (Fermi-FET) includes spaced apart source and drain regions in an integrated circuit substrate, and a Fermi-FET channel in the integrated circuit substrate, between the spaced apart source and drain regions. A gate insulating layer is on the integrated circuit substrate between the spaced apart source and drain regions, and a gate electrode is on the gate insulating layer. The gate electrode is closer to the source region than to the drain region. Stated differently, the drain region is spaced farther away from the gate electrode than the source region. The offset drain Fermi-FET can introduce a drift region between the drain region and the Fermi-FET channel that can provide the high voltage and/or high frequency Fermi-FETs, while retaining the Fermi-FET advantages in the channel.

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Citations
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TL;DR: In this article, improved fin-type field effect transistor (FinFET) structures and associated methods of manufacturing the structures are discussed, and an improved FinFET drive current is optimized by configuring the fin-FET asymmetrically to decrease fin resistance between the gate and the source region and to decrease capacitance in the drain region.
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References
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Patent

Fermi threshold field effect transistor

TL;DR: In this paper, the authors proposed a Fermi threshold FET with a threshold voltage that is independent of oxide thickness, channel length, drain voltage, and substrate doping, which can be manufactured using relaxed ground-rules to provide low cost, high yield devices.
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Contoured-tub fermi-threshold field effect transistor and method of forming same

TL;DR: In this article, a Fermi-threshold field effect transistor includes a contoured-tub region of the same conductivity type as the source, drain and channel regions and having nonuniform tub depth.
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Mis type semiconductor device

TL;DR: In this paper, a window is etched through an SiO 2 film 21 on a p-type Si 1 to produce n-layers 2 and 3 and an n-layer 10 by a diffusion.