Open AccessJournal Article
Packaging of electronics for high temperature applications
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This article is published in The International journal of microcircuits and electronic packaging.The article was published on 1997-01-01 and is currently open access. It has received 14 citations till now. The article focuses on the topics: Electronics.read more
Citations
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Journal ArticleDOI
Integrated motor drives: state of the art and future trends
Robert Abebe,Gaurang Vakil,Giovanni Lo Calzo,Tom Cox,Simon Lambert,Mark Johnson,Chris Gerada,Barrie Mecrow +7 more
TL;DR: In this paper, a review of existing IMD technologies and their thermal effects on the IMD system is presented, along with potential converter topologies for an IMD like the matrix converter, two-level bridge, three-level neutral point clamped and multiphase full bridge converters.
Journal ArticleDOI
Reliable use of commercial technology in high temperature environments
TL;DR: In this article, the reliability of PEMs in the range from 125°C to 300°C, well outside the manufacturer's suggested temperature limits, has been investigated and it has been shown that the plastic encapsulant itself begins to lose its ability to insulate leads at temperatures greater than 250°C.
Proceedings ArticleDOI
Reliability of commercial plastic encapsulated microelectronics at temperatures from 125°C to 300°C
TL;DR: In this paper, the reliability of PEMs in the range from 125/spl deg/C to 300/spl/C, well outside the manufacturer's suggested temperature limits, was investigated.
Dissertation
Contribution à l'intégration des convertisseurs de puissance en 3D
TL;DR: In this article, an integration tridimensionnelle d'un convertisseur est souhaitee pour realiser celle-ci, une connectique sur des puces semi-conductrices sans brasure and basee sur des micro poteaux electrodeposes is presented.
Dissertation
Innovative Thermal Management of Electronics Used in Oil Well Logging
TL;DR: In this paper, the authors present a survey of existing Patents and present a prototype of a new cooling system based on the concept of phase change material container, which is used in the work of this paper.