Journal ArticleDOI
Reliable use of commercial technology in high temperature environments
TLDR
In this article, the reliability of PEMs in the range from 125°C to 300°C, well outside the manufacturer's suggested temperature limits, has been investigated and it has been shown that the plastic encapsulant itself begins to lose its ability to insulate leads at temperatures greater than 250°C.About:
This article is published in Microelectronics Reliability.The article was published on 2000-08-01. It has received 34 citations till now.read more
Citations
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Journal ArticleDOI
Light emitting diodes reliability review
Moon-Hwan Chang,Diganta Das,Prabhakar V. Varde,Prabhakar V. Varde,Michael Pecht,Michael Pecht +5 more
TL;DR: This paper provides the groundwork for an understanding of the reliability issues of LEDs across the supply chain and identifies the relationships between failure causes and their associated mechanisms, issues in thermal standardization, and critical areas of investigation and development in LED technology and reliability.
Journal ArticleDOI
Degradation modeling of mid-power white-light LEDs by using Wiener process.
TL;DR: The results demonstrate that a joint failure distribution of LED devices could be modeled by simply considering their lumen maintenance and color shift as two independent variables, and the mean time to failure (MTTF) has been obtained, indicating the feasibility of the proposed method.
Journal ArticleDOI
Degradation Physics of High Power LEDs in Outdoor Environment and the Role of Phosphor in the degradation process.
Preetpal Singh,Cher Ming Tan +1 more
TL;DR: Differences in the coefficient of thermal expansion between the molding part and the lens material as well as the heat generated by the phosphor layer are found to account for the major differences in the degradation mechanisms observed.
Journal ArticleDOI
Degradation of optical materials in solid-state lighting systems
TL;DR: In this paper, degradation mechanisms of optical materials, used in the light emitting diode (LED)-based products, are reviewed, and a review of the degradation mechanisms used in LED lighting is presented.
Journal ArticleDOI
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures
TL;DR: The mechanical strength of aluminium to gold–palladium (AuPd) degraded seriously at temperatures above 200 °C due to intermetallic formation, and standard plastic encapsulated microcircuits (PEMs) are an interesting alternative due to low price and high availability.
References
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Journal ArticleDOI
Foreword contributions from the 50th electronic components and technology conference
Journal ArticleDOI
Some aspects of the growth of diffusion layers in binary systems
TL;DR: In this paper, it was shown that the application of Fick's First law to polyphase diffusion in binary systems leads to simple but rigorous expressions for the interface positions as functions of time and temperature.
Proceedings ArticleDOI
Purple Plague Revisited
TL;DR: In this article, the formation of gold-aluminum systems at 200°C to 460°C using butt-welded diffusion couples was studied and the effect of silicon on intermetallic formation was also investigated.
Proceedings ArticleDOI
Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices
TL;DR: In this paper, the presence of halogenated organic residues among some of the experimental materials was found to cause increased gold-aluminum wire-bond failure through degradation of the intermetallic.