Journal ArticleDOI
Relation of neutron to ion damage annealing in Si and Ge
F. L. Vook,H. J. Stein +1 more
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In this paper, structural measurements of Si and Ge were compared and interpreted in terms of the annealing of identified defects, and it was shown that the center temperatures for both Ge and Si were approximately 0.35 and 0.5 times the melting temperature.Abstract:
Structural measurements of neutron and ion damage annealing in Si and Ge are compared and interpreted in terms of the annealing of identified defects. Either or both of two prominent isochronal annealing stages above room temperature in neutron irradiated Si are exhibited by X-ray, electron microscope, infrared, and electrical measurements. It is shown that the same two annealing stages are observed in Rutherford scattering measurements of ion implanted Si. Two similar prominent annealing stages are also observed for structural measurements of neutron and ion irradiated Ge. For both Ge and Si the center temperatures for the two annealing stages are approximately 0.35 and 0.5 times the melting temperature. The annealing kinetics and activation energies for the lower temperature stage in Si are correlated with the kinetics and activation energies obtained by analyzing previously reported results on the effects of the substrate temperature and the ion irradiation rate. From a comparison of the time ...read more
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Book ChapterDOI
Ion implantation in semiconductors
TL;DR: In this paper, the authors review some of the general features of the characteristics of implanted layers in terms of depth distribution, radiation damage, and electron activity in compound semiconductors, particularly GaAs.
Ion Implantation in Semiconductors
James W. Mayer,József Gyulai +1 more
TL;DR: In this paper, the authors review some of the general features of the characteristics of implanted layers in terms of depth distribution, radiation damage, and electron activity in compound semiconductors, particularly GaAs.
Journal ArticleDOI
A model for the formation of amorphous Si by ion bombardment
F. F. Morehead,B. L. Crowder +1 more
TL;DR: In this paper, a phenomenological model was proposed to account for the variation of the critical dose required to produce a continuous amorphous layer by ion bombardment with ion, target, temperature, and, with minor additional assumptions, dose rate.
Journal ArticleDOI
Ion-beam-induced amorphization and recrystallization in silicon
TL;DR: In this paper, the most significant experimental observations related to ion-beam-induced amorphization in Si and the models that have been developed to describe the process are described and analyzed.
Journal ArticleDOI
Defects in silicon
TL;DR: In this paper, it is shown that polycrystalline silicon contains various impurities including oxygen, carbon, boron and possibly hydrogen, and the defects and impurities often show a nonhomogeneous distribution in the form of helical swirls.
References
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Journal ArticleDOI
On the number of atoms displaced by implanted ions or energetic recoil atoms
TL;DR: In this paper, the validity of the Kinchin-Pease formula is examined on the basis of recent progress in the theory of collision cascades and irradiation experiments on semiconductors and metals.
Journal ArticleDOI
Ion implantation of silicon and germanium at room temperature. Analysis by means of 1.0-MeV helium ion scattering
TL;DR: In this paper, the orientation dependence of the backscattered yield of 1.0-MeV helium ions has been used to investigate the lattice characteristics of silicon and germanium implanted at room temperature with 40-...
Journal ArticleDOI
Ion implantation of silicon. I. Atom location and lattice disorder by means of 1.0-MeV helium ion scattering
TL;DR: In this paper, the orientation dependence of the backscattering yield of a 1.0-MeV helium beam was investigated by studying the implantation behavior of Sb in silicon.