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Journal ArticleDOI

Residual Stress Determination by Hole Drilling Combined with Optical Methods

Drew V. Nelson
- 28 Jan 2010 - 
- Vol. 50, Iss: 2, pp 145-158
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TLDR
In this article, an overview of the use of eight different optical methods with hole drilling to determine residual stresses is provided, including brittle and photoelastic coatings, Moire interferometers, holographic interferometry, electronic speckle pattern interferometrics, interferometric strain rosette, digital image correlation and shearography.
Abstract
An overview is provided of the use of eight different optical methods with hole drilling to determine residual stresses. The methods considered are: brittle and photoelastic coatings, Moire interferometry, holographic interferometry, electronic speckle pattern interferometry, interferometric strain rosette, digital image correlation and shearography. A number of applications are summarized, such as the use of hole drilling with holographic interferometry to investigate stresses in rock structures accessed by deep boreholes and to determine manufacturing-induced residual stresses in fillets of small radii.

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Citations
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Journal ArticleDOI

Relaxation Methods for Measuring Residual Stresses: Techniques and Opportunities

TL;DR: Relaxation methods, also called "destructive" methods, are commonly used to evaluate residual stresses in a wide range of engineering components and are very frequently the preferred choice because of their versatility and reliability as discussed by the authors.
Journal ArticleDOI

Recent progress in residual stress measurement techniques

TL;DR: A review of several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing, is presented in this paper, where some promising trends for mechanical release method are also analyzed.
Journal Article

Measuring residual stresses by hole-drilling and coherent optics techniques: a numerical calibration

TL;DR: In this article, the displacement calibration constants derived from the results of an extensive numerical analysis were proposed to enable a uniform residual stress field to be determined, whatever the displacement component detected.
Journal ArticleDOI

Recent Applications of Moiré Interferometry

TL;DR: Moire interferometry has been a valuable experimental technique for the understanding of the mechanical behavior of materials and structures as mentioned in this paper, but less emphasis has been placed on the development of the technique and more towards applications.
Journal ArticleDOI

A state-of-the-art review of micron-scale spatially resolved residual stress analysis by FIB-DIC ring-core milling and other techniques

TL;DR: In this article, the micro-scale ring-core focused ion beam-digital image correlation technique is used for quantifying absolute in-plane residual stresses, which can provide great improvements in understanding the complex interactions between microstructure, mechanical state, mode(s) of failure and structural integrity.
References
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Book

Theory of elasticity

TL;DR: The theory of the slipline field is used in this article to solve the problem of stable and non-stressed problems in plane strains in a plane-strain scenario.
Book

Holographic Interferometry

Book

Holographic and Speckle Interferometry: A Discussion of the Theory, Practice and Application of the Techniques

TL;DR: In this article, the authors present a technique for shape measurements using holographic and speckle pattern interferometry techniques, based on the concept of correlation interferometrics.
Book

Handbook of Measurement of Residual Stresses

Jian Lu
TL;DR: In this paper, the authors describe a sequence of residual stress measurements made to determine a Handbook on Stiffness & Damping in Mechanical Design, which can be used to compare different methods of measuring residual stress.
Book ChapterDOI

Advances in Two-Dimensional and Three-Dimensional Computer Vision

TL;DR: Two-dimensional image correlation has been widely used for deformation measurements in a variety of applications including fracture mechanics, biomechanics, constitutive property measurement in complex materials, model verification for large, flawed structures and nondestructive evaluation as discussed by the authors.
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