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Scalably Nanomanufactured Atomically Thin Materials‐Based Wearable Health Sensors
Ruifang Zhang,Jing Jiang,Wenzhuo Wu +2 more
- pp 2100120
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The article was published on 2021-11-23 and is currently open access. It has received 11 citations till now.read more
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Element-Doped Mxenes: Mechanism, Synthesis, and Applications.
TL;DR: In this article , the authors comprehensively and critically discuss the syntheses, properties, and emerging applications of the growing family of heteroatom-doped MXenes materials, and present future opportunities and challenges for the study and application of multifunctional high-performance MXenes.
Journal ArticleDOI
Stress-deconcentrated ultrasensitive strain sensor with hydrogen-bonding-tuned fracture resilience for robust biomechanical monitoring
Yizhuo Yang,Wenjie Tang,Jinyi Wang,Ruiqiang Li,Ping Yang,Shisheng Chen,Yuehui Yuan,Jing-feng Xu,Xueyang Ren,Shancheng Yu,Hao Wu,Yunfan Zhou,Leili Zhai,Xiaodong Shao,Zenan Chen,Benhui Hu +15 more
TL;DR: In this article , a stress-deconcentrated ultra-sensitive strain (SDUS) sensor with ultrahigh sensitivity (gauge factor up to 2.3 × 106) and a wide working range (0% −50%) via incorporating notch-insensitive elastic substrate and micro-crack-tunable conductive layer was developed.
Journal ArticleDOI
Recent advances in multifunctional materials for gas sensing applications
TL;DR: A comprehensive overview of the recent achievements in the application of sensors for different gas detection and indicates the current challenges and future outlooks in this field is provided in this paper , where a wide discussion of various materials-based gas sensors in near future can be attached to the Internet of Things to develop more rigid and highly sensitive gas leakage detectors to avoid accident risks and health threats.
Journal ArticleDOI
Curvilinear soft electronics by micromolding of metal nanowires in capillaries
TL;DR: In this paper , a micromolding-based method is reported for scalable printing of metal nanowires, which enables complex and highly conductive patterns on soft curvilinear and uneven substrates with high resolution and uniformity.
Journal ArticleDOI
High Throughput In–Situ Temperature Sensor Array with High Sensitivity and Excellent Linearity for Wireless Body Temperature Monitoring
Lei Chen,Xingye Yao,Xingchi Liu,Zewei Luo,Changqing Ye,Chen-Yong Huang,Chaolun Wang,Chunhua Cai,Liangjian Lyu,Xing Wu,Hengchang Bi +10 more
TL;DR: In this paper , a flexible temperature sensor based on a porous graphene/polydimethylsiloxane sensing layer is developed, which exhibits high sensitivity of 5.203%°C−1 for temperature sensing between 30 and 70°C, and excellent linearity (R2
References
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Ultrafast optical reduction of graphene oxide sheets on colorless polyimide film for wearable chemical sensors
TL;DR: In this paper, the reduction of graphene oxide sheets was achieved by intense pulsed light irradiation on a highly transparent and thermally stable polyimide substrate, which exhibited improved chemical sensing characteristics, which are promising in wearable chemical sensors for real-time environmental monitoring.
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A simple and scalable graphene patterning method and its application in CdSe nanobelt/graphene Schottky junction solar cells
Yu Ye,Lin Gan,Lun Dai,Yu Dai,Xuefeng Guo,Hu Meng,Bin Yu,Zujin Shi,Kuanping Shang,Guogang Qin +9 more
TL;DR: The results suggest that both the developed graphene patterning method and the as-fabricated CdSe NB/graphene Schottky junction solar cells have reachable application prospects.
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Salt-Assisted Synthesis of 2D Materials
Liang Huang,Zhimi Hu,Hongrun Jin,Jiabin Wu,Kaisi Liu,Zheheng Xu,Jun Wan,He Zhou,Jiangjiang Duan,Bin Hu,Jun Zhou +10 more
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Rapid replication of master structures by double casting with PDMS
TL;DR: A simple approach to inverse a given microstructure multiple times by means of PDMS-based soft lithography utilising hydroxypropylmethylcellulose (HPMC) as non texturing release agent is presented.
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Large-area integration of two-dimensional materials and their heterostructures by wafer bonding
Arne Quellmalz,Xiaojing Wang,Simon Sawallich,Burkay Uzlu,Martin Otto,Stefan Wagner,Zhenxing Wang,Maximilian Prechtl,Oliver Hartwig,Siwei Luo,Georg S. Duesberg,Max C. Lemme,Kristinn B. Gylfason,Niclas Roxhed,Göran Stemme,Frank Niklaus +15 more
TL;DR: This work reports a generic methodology for large-area integration of 2D materials by adhesive wafer bonding that avoids manual handling and uses equipment, processes, and materials that are readily available in large-scale semiconductor manufacturing lines.