Journal ArticleDOI
Thermal properties of diamond/copper composite material
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TLDR
The composite of diamond and copper have a potential for a heat spreading substrate with high performance and high reliability because not only its thermal conductivity is high but its coefficient of thermal expansion can be tailored according to a semiconductor material of electronics devices.About:
This article is published in Microelectronics Reliability.The article was published on 2004-02-01. It has received 344 citations till now. The article focuses on the topics: Diamond & Material properties of diamond.read more
Citations
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Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications
TL;DR: In this article, a vapour deposited molybdenum coating on SiC powders has been used to improve the bonding strength and thermo-physical properties of the composites, using atomized Cu(X) alloys with minor additions of carbide formers.
Journal ArticleDOI
Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles
TL;DR: In this paper, an effective way to apply a vapor deposited chromium coating onto diamond particles was used to overcome the interface problem, and the results showed that the densification, interfacial bonding and thermal conductivity of coated composites were evidently enhanced compared to that of uncoated composites.
Journal ArticleDOI
On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites
Ludger Weber,Reza Tavangar +1 more
TL;DR: In this article, the evolution of thermal conductivity and the coefficient of thermal expansion as a function of the alloying content of boron and chromium in the copper matrix in Cu-X/diamond composites is presented.
Journal ArticleDOI
Thermal Conductivity of Diamond Composites
S. V. Kidalov,F. M. Shakhov +1 more
TL;DR: In this paper, the authors present a review of the results reached by now in studying the possibility of developing composites in diamond-containing systems with a view of obtaining materials with a high thermal conductivity.
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Recent advanced thermal interfacial materials: A review of conducting mechanisms and parameters of carbon materials
TL;DR: In this paper, the authors introduce the thermal conduction mechanism in the bulk polymer, crystalline particles, and carbon-based polymer composites, and review recent studies of carbon nanotube- or graphene-based interfacial thermal materials.
References
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Book
A Treatise on Electricity and Magnetism
TL;DR: The most influential nineteenth-century scientist for twentieth-century physics, James Clerk Maxwell (1831-1879) demonstrated that electricity, magnetism and light are all manifestations of the same phenomenon: the electromagnetic field as discussed by the authors.
Book
Introduction to Ceramics
TL;DR: In this paper, the authors present a model for the development of the MICROSTRUCTURE in CERAMICS based on phase transformation, glass formation and glass-Ceramics.
Journal ArticleDOI
Nonmetallic crystals with high thermal conductivity
TL;DR: The diamond has the highest known thermal conductivity at 300k K at room temperature as discussed by the authors, and is the only non-metallic crystal with thermal conductivities of > 1 W/cmK at 300K.
Journal ArticleDOI
The Elastic and Thermo-elastic Properties of Composite Media
TL;DR: In this article, the gross bulk and shear moduli of a composite material consisting of a suspension of grains or a compact of grains are derived from an analysis of the dilatation and bulk stress for average spherical grains when the composite as a whole is subjected to some small temperature change.
Related Papers (5)
On the influence of active element content on the thermal conductivity and thermal expansion of Cu-X (X = Cr, B) diamond composites
Ludger Weber,Reza Tavangar +1 more