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Proceedings ArticleDOI

Thermal resistance of snap-in type aluminum electrolytic capacitor attached to heat sink

Till Huesgen
- pp 1338-1345
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TLDR
In this paper, the cooling performance of aluminum electrolytic capacitors is improved by attaching the capacitors to a heat sink, and two different configurations are investigated: Heat removal through the base of the capacitor and heat removal through its sidewalls, both methods provide significantly reduced thermal resistances, approximately 66% lower compared to direct air cooling by natural convection.
Abstract
Aluminum electrolytic capacitors are standard components in power electronic equipment. Their performance and lifetime strongly depends on their operation temperature. Hence, controlling their temperature is essential for reliable operation of the equipment. For standard snap-in type capacitors, which are common in low power converters (<∼20 kW), direct air cooling is the standard solution. This paper presents ways to improve the cooling performance by attaching the capacitor to a heat sink. Two different configurations are investigated: Heat removal through the base of the capacitor and heat removal through its sidewalls. When applied with an aluminum heat sink in natural convection, both methods provide significantly reduced thermal resistances, approximately 66% lower compared to direct air cooling by natural convection.

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Citations
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Reliability of Capacitors for DC-Link Applications in Power Electronic Converters—An Overview

TL;DR: This review serves to provide a clear picture of the state-of-the-art research in this area and to identify the corresponding challenges and future research directions for capacitors and their dc-link applications.

Reliability of Capacitors for DC-Link Applications in Power Electronic Converters

Huai Wang, +1 more
TL;DR: In this article, the authors present a review on the improvement of reliability of dc link in power electronic converters from two aspects: reliability-oriented dc-link design solutions; and conditioning monitoring of DC-link capacitors during operation.
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Environmental friendly technology for aluminum electrolytic capacitors recycling from waste printed circuit boards.

TL;DR: The present study provides an environmentally friendly and industrial application potential strategy to recycle AECs to promote e-waste recycling industry.
Proceedings ArticleDOI

Transient thermal modeling of aluminum electrolytic capacitors under varying mounting boundary conditions

TL;DR: In this article, the lifetime of aluminum electrolytic capacitors is mainly determined by their operating temperature, and a finite element model of a radial type capacitor, which is mounting boundary condition independent, is developed.
Proceedings ArticleDOI

A method for hotspot temperature estimation of aluminum electrolytic capacitors

TL;DR: In this paper, the authors proposed a hotspot temperature estimation method based on the linear dependence between capacitance and temperature of electrolytic capacitors, which is verified experimentally that the temperature estimation error of the proposed method is well below 5 K.
References
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Proceedings ArticleDOI

Thermal modeling of aluminum electrolytic capacitors

TL;DR: In this paper, a comprehensive thermal model for screw-terminal aluminum electrolytic capacitors is developed, and the test methodology and data upon which the model is based are discussed.
Journal ArticleDOI

Shelf-Life Evaluation of Aluminum Electrolytic Capacitors

TL;DR: In this article, an accelerated shelf-life aging test was conducted for 3000 h at 85°C on three types of aluminum electrolytic capacitors from four vendors, and the effects of accelerated conditioning on capacitance value, effective series resistance (ESR), and leakage current at 1 V, 2 V, and rated voltage were reported.

Predicting Operating Temperature and Expected Lifetime of Aluminum-Electrolytic Bus Capacitors with Thermal Modeling

TL;DR: In this article, the authors present the results of a Finite Element Analysis (FEA)-based par- tial differential equation solution and the results from the three-loop thermal circuit model.
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