Proceedings ArticleDOI
Thermoelectric micro modules for spot cooling of high density heat sources
V. Semenyuk
- pp 391-396
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TLDR
In this article, a series of short-legged thermoelectric (TE) micro modules with TE legs 0.2 and 0.3 mm were developed with an aluminum nitride ceramic.Abstract:
The paper represents further progress in the development of short-legged thermoelectric (TE) micro modules for cooling high power density electronic components. Theoretical analysis and experimental study are conducted to define an available temperature lowering and maximum heat flux densities for short-legged coolers with different kinds of substrates. Temperature differences exceeding 70 K are obtained with TE leg lengths down to 0.2 mm. A new series of micro modules with TE legs 0.2 and 0.3 mm long is developed with an aluminum nitride ceramic.read more
Citations
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Proceedings ArticleDOI
Hot spot cooling using embedded thermoelectric coolers
TL;DR: In this paper, the authors proposed an embedded thermoelectric cooling (eTEC) approach to reduce the temperature of highly localized, high heat flux hot spots generated by today's advanced processors.
Journal ArticleDOI
On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators
Ali Shakouri,Yan Zhang +1 more
TL;DR: An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given in this article, where key parameters affecting micro cooler performance are described.
Journal ArticleDOI
Thermoelectric water-cooling device applied to electronic equipment
TL;DR: In this paper, the authors investigated the thermal performance of a thermoelectric water-cooling device for electronic equipment and developed a novel analytical model of thermal analogy network to predict the thermal capability.
Proceedings ArticleDOI
Thermoelectric micro devices: current state, recent developments and future aspects for technological progress and applications
Abstract: Due to their unique expected properties thermoelectric microdevices, thermogenerators as well as Peltier coolers, are of high demand for different applications namely for telecommunication purposes. Thus worldwide efforts are undertaken to expand the technology for thermoelectric devices into the field of typical microsystem technologies including aspects of advanced low dimensional high ZT materials. Favourite material systems are up to now the bismuthtelluride (V-VI) compounds and the silicon/germanium (IV-IV) alloys. Recent results prove the capability to implement low dimensional material of both material systems into microsystem devices and demonstrate wafer based microelectronic technologies for the fabrication of thermoelectric devices even for the non CMOS bismuthtelluride related compounds. Thus this survey will present the state of the art in a summary of recent results together with an more extended description of the MicroPelt/spl reg/ approach as an example for a wafer based fabrication concept close to microelectronics manufacturing. Strengths and weaknesses of the different presented technological concepts will be discussed under some viewpoints.
Journal ArticleDOI
On-chip high speed localized cooling using superlattice microrefrigerators
TL;DR: In this paper, a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators was proposed for on-chip temperature control, removing hot spots inside ICs.
References
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Proceedings ArticleDOI
Thermoelectric microcoolers for thermal management applications
J.-P. Fleurial,Alexander Borshchevsky,Margaret A. K. Ryan,W. Phillips,E. Kolawa,T. Kacisch,R. Ewell +6 more
TL;DR: In this paper, a thermoelectric microcooler is proposed to operate at temperatures at or even below the ambient temperature of the heat sink, resulting in increased reliability and efficiency.
Proceedings ArticleDOI
Thick-film thermoelectric microdevices
J.-P. Fleurial,G.J. Snyder,Jennifer Herman,P. H. Giauque,W.M. Phillips,Margaret A. K. Ryan,P. Shakkottai,Elzbieta Kolawa,M.-A. Nicolet +8 more
TL;DR: In this article, the authors report on the progress in developing techniques for obtaining 10-50 /spl mu/m thick films of p- and n-type Bi/sub 2/Te/sub 3/ alloys by electroplating through a thick photoresist template on top of patterned multilayer metallizations.
Proceedings ArticleDOI
Thermal management of power electronics using thermoelectric coolers
J.W. Vandersande,J.-P. Fleurial +1 more
TL;DR: In this article, the results of a solid state power amplifier (MMIC) cooled using a diamond/cooler combination are presented and discussed, and it has been determined that the highest cooling power densities will be achieved with thin film coolers with cooler leg lengths on the order of 20 to 50 microns.
Proceedings ArticleDOI
Novel high performance thermoelectric microcoolers with diamond substrates
V.A. Semeniouk,J.-P. Fleurial +1 more
TL;DR: In this paper, the authors implemented the concepts discussed in previous papers in novel miniature thermoelectric coolers (TECs) with diamond substrates, which achieved a maximum temperature difference of 67 K and heat flux densities of 70 W/cm/sup 2/ at cold junctions.
Proceedings ArticleDOI
Miniature thermoelectric coolers for semiconductor lasers
Vladimir A. Semenyuk,Tatyana V. Pilipenko,Grant C. Albright,Leonid A. Ioffe,William H. Rolls +4 more
TL;DR: In this paper, the problem of matching thermoelectric coolers and semiconductor lasers with respect to heat flow densities and electrical currents is discussed, and the solution of this problem is accomplished by the reduction of thermoelement dimensions to the submillimeter level.