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Open AccessJournal ArticleDOI

Working-fluid selection for minimized thermal resistance in ultra-thin vapor chambers

TLDR
In this paper, a resistance-network-based model is used to develop a simple analytical relationship for the vapor chamber thermal resistance as a function of the working fluid properties, operating power, and geometry.
About
This article is published in International Journal of Heat and Mass Transfer.The article was published on 2017-03-01 and is currently open access. It has received 38 citations till now. The article focuses on the topics: Working fluid & Compressed fluid.

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Citations
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A review of the thermal performance of vapor chambers and heat sinks: Critical heat flux, thermal resistances, and surface temperatures

TL;DR: In this paper , a review of published articles on the thermal performance enhancements of a vapor chamber, which is one of the most-studied two-phase liquid-vapor-based cooling system for high heat-flux-dissipating systems in the last few decades, is presented.
Journal ArticleDOI

A review of the thermal performance of vapor chambers and heat sinks: Critical heat flux, thermal resistances, and surface temperatures

TL;DR: In this paper, a review of published articles on the thermal performance enhancements of a vapor chamber, which is one of the most-studied two-phase liquid-vapor-based cooling system for high heat-flux-dissipating systems in the last few decades, is presented.
Journal ArticleDOI

Simultaneous wick and fluid selection for the design of minimized-thermal-resistance vapor chambers under different operating conditions

TL;DR: In this article, the authors used a simplified thermal-resistance network-based vapor chamber model to explore selection of working fluids and wick structures that offer the minimum overall thermal resistance as a function of the vapor chamber thickness and heat input.
Journal ArticleDOI

Thermal characteristics of silicon wafer-based TVCs(Thin Vapor Chambers) with disk-shape using DI water

TL;DR: In this article, an analytical model based on the modified liquid pressure drop through a micro-pin-fin wick and the capillary limit was developed to determine the maximum heat transfer rate, the maximum temperature, and the thermal resistances of TVCs.
Journal ArticleDOI

Performance and Manufacturing of Silicon-Based Vapor Chambers

TL;DR: In this article, the authors provide an overview on the evolution of silicon vapor chambers in terms of fabrication strategies and performance characterization, focusing on opportunities and challenges associated with using silicon as the vapor chamber envelope material rather than more traditional metal-based vapor chambers.
References
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Journal ArticleDOI

Experimental study of biporous wicks for high heat flux applications

TL;DR: In this article, the authors compared three monoporous and 19 biporous wicks and found that the monoporous wick can reach higher critical heat flux (CHF) than thin biporous Wicks because they developed evaporating menisci not only on top surface of wick but also inside the wick.
Journal ArticleDOI

A numerical model for transport in flat heat pipes considering wick microstructure effects

TL;DR: In this article, a transient, three-dimensional model for thermal transport in heat pipes and vapor chambers is developed, where the Navier-Stokes equations along with the energy equation are solved numerically for the liquid and vapor flows.
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Frequently Asked Questions (1)
Q1. What have the authors contributed in "Working-fluid selection for minimized thermal resistance in ultra-thin vapor chambers" ?

A working fluid is sought in this case that provides the minimal thermal resistance while ensuring a capillary limit is not reached at the target operating power.