Addition of lignin affect the thermal stability of silicon materials?
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The addition of lignin to silicon materials has a significant impact on their thermal stability. When lignin is compounded with hydride-functionalized silicones to create elastomers and foams, it results in improved thermal stability. Additionally, the incorporation of nanometer lignin into silicon nitride ceramic matrix enhances the bending strength and fracture toughness of the resulting composite material. Furthermore, modifying lignin with silicon-containing vinyl groups through silylation reactions leads to copolymers with polyacrylonitrile that exhibit suitable rheological behaviors for surface coatings and films, ultimately affecting the thermal properties of the materials. These findings collectively demonstrate that lignin plays a crucial role in enhancing the thermal stability of silicon-based materials through various modification and composite formation processes.
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| Papers (5) | Insight |
|---|---|
| The addition of lignin influences the surface bonding interaction of carbon/silicon nanoparticles, enhancing cohesive strength and improving the thermal stability of silicon materials in composite electrodes. | |
25 Citations | Vinyl silylated lignin enhances thermal stability of silicon materials due to its modified structure, suitable for tough coatings and films, as indicated by NMR, FTIR, TGA, and DSC analyses. |
42 Citations | The addition of lignin to silicone materials improves thermal stability by enhancing flame retardancy, thermal insulation, and thermal stability due to char formation and radical scavenging properties of lignin. |
01 Dec 2021 | The addition of nanometer lignin to silicon nitride ceramics enhances thermal stability due to the formation of nitride-doped graphene quantum dots, improving bending strength and fracture toughness. |
01 Jan 2020 45 Citations | Increasing lignin content in silicon-modified phenolic resin enhances thermal stability. Optimal performance is achieved at 30% lignin substitution and 1% whisker silicon addition, improving mass loss and thermal conductivity. |
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