How does gate-drain distance impact gate-drain capacitance under cold fet in condiitions?5 answersThe gate-drain distance has an impact on the gate-drain capacitance under cold FET conditions. The external parasitic gate-drain capacitance, which is contributed by the layout of the gate and drain nodes routed in the PCB, can significantly affect the switching dynamics during the voltage-rise and voltage fall periods. Additionally, a gate-drain shield can be used to reduce the gate to drain capacitance of a transistor. The capacitance values of the extrinsic gate capacitance (C/sub pg/) and drain capacitance (C/sub pd/) of field-effect transistors (FET's) can be extracted using a capacitive transmission line (CTL) model, which takes into account the distributed nature of the gate and drain regions. The gate-induced-drain-leakage (GIDL) characteristics in metal-ferroelectric-insulator-semiconductor (MFIS)-type negative capacitance fin field-effect transistors (NC-FinFET) can be analyzed using 3-D technology computer-aided design (TCAD) simulations, considering factors such as ferroelectric and silicon body thicknesses, source/drain junction placement, and doping concentration.
How do FET-nanopore sensors overcome the limitations of traditional nanopore sensors?5 answersFET-nanopore sensors overcome the limitations of traditional nanopore sensors by addressing the challenges of sensitivity, selectivity, and the need to tailor the nanopore aperture size to the size of the analyte. Traditional nanopore sensors require high salt concentrations to improve the signal-to-noise ratio, limiting their ability to study a wide range of nanoparticles. FET-nanopore sensors, on the other hand, utilize a polymer electrolyte system that enables the analysis of heterogeneous nanoparticle mixtures at low ionic strength. Additionally, FET-nanopore sensors utilize optimal operation bias conditions to improve gas detection characteristics. By operating the sensor in the linear region rather than the subthreshold region, the standard deviation of the current fluctuation can be significantly reduced, leading to more accurate gas detection. These advancements in FET-nanopore sensors make them versatile platforms for real-time, label-free, and highly sensitive detection of a wide range of bioparticles.
Why MoS2 FETs has insuffiecient Source/Drain doping?5 answersMoS2 FETs have insufficient source/drain doping due to the challenges in achieving stable and controlled doping in these devices. Conventional doping methods based on ion implantation, such as in, are incompatible with 2D MoS2 because they can damage the lattice structures of the material. Surface charge transfer doping (SCTD) has been explored as an alternative approach, as mentioned in, but achieving rationally controlled SCTD on MoS2 has proven difficult. Additionally, the contact scaling behavior in 2D FETs, as discussed inand, has been found to have a significant impact on device performance. Scaled source contacts can limit the drain current, while scaled drain contacts cannot. The quality of the metal-2D interface also affects the transfer length and overall device behavior. Encapsulation techniques using materials like h-BN have been proposed to reduce charge transfer and improve device stability, as mentioned in.
Why top drain has higher cgd than side drain in mosfet?5 answersTop drain MOSFETs have higher Cgd (gate-drain capacitance) than side drain MOSFETs due to certain design features. In top drain MOSFETs, the active trenches have an enlarged width at the top, which results in a thicker oxide layer compared to the gate oxide adjacent to the channel region. This thicker oxide at the top of the trench reduces the gate-drain capacitance (Cgd). Additionally, the thicker oxide at the top of the active trench also reduces the electric field in the drain drift region, further contributing to the reduction in Cgd. On the other hand, side drain MOSFETs do not have this specific design feature, resulting in a different capacitance profile. Therefore, top drain MOSFETs exhibit higher Cgd compared to side drain MOSFETs.
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