Showing papers on "Copper plating published in 1980"

Reaction of Copper and Copper Oxide with H 2 S

Abstract: The lack of sulfidation of copper in indoor atmospheric corrosion has been attributed to the formation of copper oxide on copper, i.e., the oxide which forms on the copper surface initially inhibits the growth of corrosion (sulfide films) on the surface. A permeation tube apparatus has been constructed with a quartz crystal microbalance (sensitivity ∼10−8g) to elucidate the reaction of copper and copper oxide with . The film composition was measured with ESCA and Auger spectroscopy and the film thickness was measured with the quartz crystal microbalance to avoid the ambiguity of thickness estimation from sputter rate measurements in depth profiling. Results indicate that copper oxides grown in air (several hundred A thick) provide good protection against at low relative humidities, but little protection at high relative humidities. Oxides grown in pure oxygen provide more protection, but still tarnish rapidly at higher relative humidities.

Gasless ion plating process and apparatus

Abstract: There is disclosed a new and improved gasless ion plating apparatus and process which eliminates the prior need for electrically isolating the substrate from the evacuated chamber in which the plating process is performed. In accordance with a disclosed embodiment, one or more substrates to be plated are placed within the chamber. Also within the chamber there is disposed a plating source which includes plating material. The chamber is evacuated and the plating material is heated to vaporize the plating material. Radio frequency energy is applied to the plating source to form a plasma of positively charged plating ions from the vaporized plating material. A positive direct current bias is developed on the plating source relative to the substrates by, for example, applying a direct current positive voltage to the plating source to create an electrical field between the source and substrates for accelerating the plating ions towards the substrates for plating the same.

Composition and method for electrodeposition of copper

Abstract: A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic polysulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths

Electroless copper plating solution

Abstract: An electroless copper plating solution comprising cupric ions, complexing agents, a reducing agent, a pH adjustor, a polyoxyethylene series surface active agent, these being conventionally used, and (i) an inorganic compound containing at least Si or Ge, or (ii) a cationic surface active agent, or (iii) an inorganic compound containing at least Si, Ge or V and a cationic surface active agent, can give plated films with excellent mechanical properties even if operated for a long period of time with excellent stability of the plating solution.

Process for plating polymeric substrates

Abstract: A process for pretreating a substantially non-conductive substrate such as a plateable plastic or plastic article having an electroless metal deposit on the surface thereof which comprises the steps of conditioning the surface of the substrate to effect an increase in the conductivity thereof with a dilute aqueous acidic solution containing controlled effective amounts of copper, acid and a polyether compound followed by an electrolytic acid copper strike employing a more concentrated aqueous electrolyte containing copper, acid and a polyether compound The conditioning and electrolytic copper strike steps can be performed without necessitating any intervening rinse steps to provide a conductive basis for subsequently depositing adherent and uniform electroplates such as decorative acid copper or the like

Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish

Abstract: Disclosed is an improved process for preparing metal plated thermoplastic compositions by electroless metal deposition and subsequent electrolytic plating. This process comprises the sequence of etching a filled thermoplastic resin substrate with dilute acid solution, treating with a sensitizer such as a tin salt, activating with a noble metal salt solution, electroless metal deposition using an electroless copper or nickel plating solution, and electrolytic plating with a metal selected from the group consisting of copper, nickel, chromium, or combinations thereof. The improvement is in the use of a wollastonite filler having an average particle size of less than about 3.5 microns, wherein 95 numerical percent of the particles are smaller than 10 microns in the longest dimension. The resulting electroplated articles exhibit a mirror-like finish and a peel strength of at least about 3 lbs./in. Also disclosed is a nylon-6 plating composition useful in the process containing the above-described wollastonite filler and an organosilane coupling agent.

Mold for continuous casting

Abstract: PURPOSE:To eliminate temperature deviation on the inside circumferential surface of cast part and increase the life times of a mold by applying Ni base material plating thicker on the side line portions than the other on the outside circumferential surface of a square cylindrical matrix matched with the outside circumferential surface shape of cast metal, further applying copper plating and using the thus obtained molding as the casting part. CONSTITUTION:A bottom-less square shell body 1 of a square or rectangle in sectional shape is formed and is laminated thereon with an electrodeposition layer 3 of Ni or Ni alloy by an electrocasting method and if necessary with a Cr plated player 2. The layer 3 of the square shell sideline part 5 is made thicker than the lateral surface adjacent to this. Because of this, the current quantity flowing between the portion opposing to the sideline portion of the casting part of the mandrel being the matrix of the casting part and an opposite anode and the current quantity at the similar lateral surface part at the casting are determined by the adjustment of interanode spacing and/or anode current density. An electrodeposition layer 4 of copper is laminated on this molding and cooling water is flowed in a jacket 6, thence molten metal 9 is continuously poured and is drawn as frozen metal 10 from the under side.

Control apparatus for automatically maintaining bath component concentration in an electroless copper plating bath

Abstract: A control apparatus for automatically controlling at least the concentration of copper-ions, hydroxyl-ions and formaldehyde-ions in an electroless copper plating bath and independently analyzing, displaying and replenishing the concentration of each such ions whereby a sample for each of the ions is discontinuously removed from the plating bath and diluted with a specific amount of water and, independently of one another, the copper-ion concentration is colorimetrically analyzed, displayed and replenished as needed, the hydroxyl-ion concentration is potentiometrically analyzed, displayed and replenished as needed and the formaldehyde-ion concentration is amperometrically analyzed, displayed and replenished as needed.

Process for regenerating chemical copper plating solution

Abstract: During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution. These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

Electroless copper deposition solutions with hypophosphite reducing agent

Abstract: Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a non-formaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140° to 160° F.); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

Thick film copper conductor circuits

Abstract: A method for producing a thick film circuit (30) including a copper conductor pattern (19), thereby obviating the need for expensive precious metal compositions. In the process, a fritted copper paint (16) is applied to a ceramic substrate (18) and fired at a temperature of 850° C. to 950° C. and is oxidized. Concurrently, the paint (16) is adhesively joined to the nonreactive and nonconductive ceramic substrate (18). Next, a resistor paint (20) is applied in overlapping relationship with the air-heated copper conductor pattern (19) and fired at 850° C. to 950° C. The entire unit is then fired in a reducing atmosphere at a temperature of 260° C. to 450° C. to reduce the oxidized copper. The air-fired resistor pattern (21) can either be protected by a coating (40) or unprotected during the reducing atmosphere firing. The essential ingredients of the copper paint (16) are a frit (12) that is non-reducible under a hydrogen atmosphere, a copper powder (10) and a suitable screening agent ( 14). In this new and improved three-step firing process, the copper conductors are compatible with existing ruthenium base resistors.

Method of forming copper conductor

Abstract: A structure of a copper conductor is obtained by oxidizing copper film formed on the surface of a substrate, and by heat treating the same in a reducing atmosphere, whereby only the surface layer portion of the oxidized copper film is reduced to become copper. The copper film of a conductor is formed on the surface of the substrate with the oxidized copper film interposed therebetween. As a result, an adhesion of the copper film to the surface of the substrate is enhanced.

Process for electrodialytically regenerating an electroless plating bath by removing at least a portion of the reacted products

Abstract: A process is provided for regenerating a spent electroless copper plating bath which contains alkali metal salts resulting from the reduction of a water soluble copper salt under copper plating and reducing conditions. The regeneration is effected by means of the electrodialytic transfer of at least a portion of the anions in the spent plating bath through an anionic permselective membrane into the anode compartment of an electrodialytic cell. In the preferred embodiment, hydroxyl ions from the cathode compartment of the electrodialytic cell are concurrently transferred through a second anionic permselective membrane to replace the transferred anions, the replacement taking place in a compartment of the electrodialytic cell located between the two anionic permselective membranes.

Resist ink composition for chemical plating

Abstract: PURPOSE: To provide the titled compsn. which has excellent printability and gives a cured film having excellent adhesiveness, resistance to electroless copper plating solution and heat, etc., by blending an arom. amine hardener and an imidazole hardener in combination with an epoxy resin. CONSTITUTION: 100pts.wt. epoxy resin, 0.1W1.5 equivalents (per one epoxy equivalent of the epoxy resin) of an arom. amine hardener for the epoxy resin such as m-phenylene-diamine, 5W30pts.wt. imidazole hardener for the epoxy resin such as 1-methylimidazole, a filler such as talc, a thixotropic agent such as ultrafine SiO 2 powder, and an org. solvent such as cyclohexanol, are mixed together to produce the desired resist ink compsn. for chemical plating. Said org. solvent is used in such a proportion that the thixotropy index of the resulting resist ink becomes 20W40 and the viscosity of the ink becomes 3,000W 10,000P at 20°C. COPYRIGHT: (C)1982,JPO&Japio

Plated steel material

Abstract: PURPOSE: To suppress the formation of pitting corrosion and prevent the defects in cation electro-deposition coating by applying an Fe-Zn type continuous coating contg. a specific ratio of zinc on the surface of a steel material. CONSTITUTION: An Fe-Zn continuous coating layer consisting of ≤40wt% zinc content is formed on the surface of a steel material. The thickness of the surface layer is practically ≥0.01μm, more preferably ≥0.1μm, and a small amount of one or 2 kinds of Cu, Ni, Cr, Co, Mn, Mo, V, Sn, Cd, etc. may be added with equally good results. The plated steel material consisting of ≥ two plural plating layers having further a plating layer in the inner layer thereof is further preferable. Zinc or zinc type alloy plating consisting essentially of zinc, Al or Al alloy plating consisting essentially of Al, etc. are applicable for the plating of the inner layer. COPYRIGHT: (C)1981,JPO&Japio

Process for the regeneration of electroless plating baths

Abstract: A process is provided for regenerating a spent electroless copper plating bath which contains alkali metal salts resulting from the reduction of a water soluble copper salt under copper plating and reducing conditions. The regeneration is effected by means of the electrodialytic transfer of at least a portion of the anions in the spent plating bath through an anionic permselective membrane (18) into the anode compartment (12) of an electrodialytic cell (10). In the preferred embodiment, hydroxyl ions from the cathode compartment (16) of the electrodialytic cell (10) are concurrently transferred through a second anionic permselective membrane (20) to replace the transferred anions, the replacement taking place in a compartment (14) of the electrodialytic cell (10) located between the two anionic permselective membranes (18,20). E.g., the spent solution to be regenerated is an aqueous solution containing Cu ++ , Na + , OH-, HCOO-, SO 4 --, HCHO and the sodium salt of EDTA.

Electrode Kinetics of Copper Deposition from Copper Cyanide Solution

Abstract: In verdunnten sauren Cu-cyanidlosungen sind sowohl an Pt- als auch an Cu-Elektroden deutliche Grenzstromdichten zu beobachten.

Process for producing copper barrier type, nuclear fuel cladding

Abstract: A copper barrier type, nuclear fuel cladding is produced by forming an oxide layer on the inner wall surface of a tube of zirconium or zirconium alloy and then applying electroless copper plating to the oxide layer with a solution containing at least a copper salt, a complexing agent, a reducing agent, and 2,2'-dipyridyl, or further together with polyalkylene glycol as a plating solution. A good adhesiveness is obtained between the copper barrier layer and the oxide layer.

Method for providing uranium with a protective copper coating

Abstract: The present invention is directed to a method for providing uranium metal with a protective coating of copper Uranium metal is subjected to a conventional cleaning operation wherein oxides and other surface contaminants are removed, followed by etching and pickling operations The copper coating is provided by first electrodepositing a thin and relatively porous flash layer of copper on the uranium in a copper cyanide bath The resulting copper-layered article is then heated in an air or inert atmosphere to volatilize and drive off the volatile material underlying the copper flash layer After the heating step an adherent and essentially non-porous layer of copper is electro-deposited on the flash layer of copper to provide an adherent, multi-layer copper coating which is essentially impervious to corrosion by most gases

Light emitting element

Abstract: PURPOSE:To form a light emitting element which can normally operate even in a chip in which conductive defect exists by covering the conductive defect existing on a nitrided gallium semiinsulating light emitting layer with an insulating layer film different from nitrided gallium CONSTITUTION:A light emitting element having a nitrided gallium semiinsulating lignt emitting layer 3 has a transparent substrate 1, a conductive GaN layer 2, a semiinsulating GaN light emitting layer 3, a positive electrode 4 and pair electrodes (not shown) When a defect 6 is observed after a semiinsulating GaN light emitting layer 3 is formed, one end of GaN layer 2 and facing electrodes are energized therebetween to plate copper to cover copper plating 7 on the defect 6, the defect 6 is then heat treated to form an insulating film 71 An insulating film may be formed by an anodic oxidation method instead of the method of forming the film 71 After the film 71 is formed, a positive electrode 4 is formed

Process for coating copper and copper alloy

Abstract: Copper or copper alloy sheet or foil displaying excellent solderability and high resistance to tarnish is prepared by the provision over its surface of a coating containing a copper salt of an organophosphonic acid. To form the coating, the sheet or foil is immersed for a short time in an aqueous solution containing a phosphonic acid, rinsed and dried, the treatment being combined with or preceded by oxidation of the sheet surface.