Showing papers on "Electrical connection published in 2020"

Maximum power enhancement under partial shadings using modified Sudoku reconfiguration

Abstract: Partial shading is one of the important factors in reducing maximum power generation from PV (Photovoltaic) arrays. Maximum power generation can be improved by selecting PV array in Total-Cross-Tied (T-C-T) connection. But still maximum power generated from T-C-T can be improved by distribution of shading over various rows. Due to distribution of shading, the current entering the node increases and results in improved maximum power generation. This can be done effectively by using Sudoku reconfiguration techniques. These techniques are economical, since they don't require any sensors and switching networks. This technique only changes the physical location of PV panel but electrical connection between the panels remains same. This paper proposes a Modified Sudoku reconfiguration pattern which enhances the maximum power from T-C-T connected PV array. Further, theoretical calculation of row current and power output have been done for existing and proposed topologies under various shading patterns. The performance of proposed pattern has been analyzed and compared using the specifications like Global Maximum Power (GMP), Fill Factor (FF), mismatch losses, and efficiency. From the results, it can be concluded that the Modified Sudoku reconfiguration enhances the GMP under all shading conditions.

Fan-out Wafer Level Packaging of GaN Components for RF Applications

Abstract: Driven by 5G or radar applications there is an increasing market for GaN device for RF power applications. GaN component packaging is done today mainly by wire bonding in combination with expensive ceramic based packaging solutions. Cost efficient Fan-out Wafer Level Packaging (FOWLP) is considered a promising solution for GaN devices offering short and low inductance interconnects, high miniaturization, good thermal solutions, potential lower cost and the possibility of integrating passive components and structure in the package and redistribution layer.However, GaN packaging also bears some challenges which have to be considered when developing new packaging technologies. GaN devices are typically quite thin in the range of 100 μm and have fragile air bridge structure on the active die side. Both aspects have to be taken into account for FOWLP concerning pick-and-place assembly, compression molding and debonding from thermal release tape. Also the influence of the redistribution layer (RDL) on the air bridges and RF performance have to be analyzed. Au is used as pad and component backside metallization. Here a good adhesion must be guaranteed to the interface materials involved. Access to the backside metallization of the GaN device is required for thermal dissipation and electrical connection if needed. The thermal concept is an important factor as the junction temperature should not exceed certain values. Besides the limits of the component itself the polymers involved as the dielectric material and the epoxy molding compound will degrade under long-term high temperature load and thus will cause reliability issues. In contrast to Si dies, the backside of the GaN device cannot be accessed by backgrinding because the metallization must not be damaged or removed. Here new solutions for backside connections during FOWLP packaging and compression molding are required.The paper will describe the technology development of a GaN based power amplifier in Fan-out Wafer Level Packaging technology. For the GaN backside access two different approaches have been evaluated, first the attachment of a Cu heatsink on the GaN backside before molding followed by a backgrinding step into the Cu heatsink and second the drilling of vias through the mold to the GaN backside followed by direct metallization of the vias for thermal and possible electrical connection. The thermal release tape used has been carefully selected and the process steps pickand-place assembly, compression molding and debonding have been optimized to avoid any damage of GaN die and air bridges. Influences of the packaging materials on the RF performance of the die have also been tested. Finally the different technology blocks developed have been combined to build a GaN based power amplifier in FOWLP.

Laser welding of laser-structured copper connectors for battery applications and power electronics

Abstract: The electrification of the automobile industry leads to an increasing demand for high-performance energy storage systems. The more complex the battery pack, the more complex the electronic components will become. Very high currents have to be transported in a short time and very fast electrical switching processes have to be made possible. These requirements have an effect on the required quality of the electrical connection. Furthermore, a joining process is required that offers short cycle times and a high degree of automation. Laser micro welding with fibre lasers (1070 nm) meets the requirements placed on joining technology. Due to the high beam quality, very small spot diameters and thus very high intensities can be achieved. Copper materials of high purity are used to achieve the high conductivity of the electrical connection. This material, in turn, poses a great challenge to the welding process, since the reflectance for the beam sources mentioned is above 95%. This paper presents a way of significantly reducing the reflectance for copper connectors and thus making the joining process more efficient. For this purpose, the copper connectors are first pre-processed with an ultrashort pulse laser process, which significantly increases the surface area. In a second step, bead-on-plate welds are carried out on the structured surfaces and the absorption coefficient is determined during the welding process with the aid of a double integrating sphere assembly in comparison to a bare copper sample.

A Multiprobe Inductive Coupling Method for Online Impedance Measurement of Electrical Devices Distributed in Multibranch Cables

Abstract: The online impedance serves as a key parameter to evaluate the operating status and health condition of many critical electrical assets. The inductive coupling approach is a superior method to extract the online impedances of the electrical assets, as it does not have any physical electrical connection to the energized electrical asset under test. However, the existing setup of the inductive coupling approach usually uses two inductive probes, with one as an injecting inductive probe (IIP) and the other as a receiving inductive probe (RIP), and consequently, it is unable to simultaneously measure the online impedances of electrical devices distributed in multibranch cables. In addition to the prevalent two-probe setup, a method involving a three-probe setup, with one IIP and two RIPs, has also been reported. However, its applicability is limited to the simultaneous measurement of the online impedances of electrical devices distributed in two-branch cables. Also, the three-probe setup ignores the parasitic components of IIP and RIPs, which may affect the accuracy of online impedance measurement. To overcome the aforementioned limitations, this article proposes a multiprobe inductive coupling method for the simultaneous measurement of the online impedances of electrical devices distributed in more than two branches of cables. The measurement setup of the proposed method consists of one IIP, multiple RIPs depending on the number of devices to be measured, and a computer-controlled signal generation and acquisition system. Using a circuit with three branches as a test sample, the accuracy and the reliability of the proposed method have been verified by experiments.

Electrical Contact Resistance of Connector Response to Mechanical Vibration Environment

Abstract: Contact resistance is an important barometer for service life and reliability of electrical connectors, which are widely used in electrical and electronic system. Long and harsh mechanical vibration stress would result in the function failure of electrical contact. In this article, the electrical contact resistance (ECR) of a typical connector is accurately recorded in real time with the four-wire method under mechanical vibration environment. Furthermore, the relationship between the ECR and vibration stress (including frequency and acceleration) is investigated explicitly. To better understand the physical mechanism of the ECR fluctuation and degradation, the vibration transmission path and associated dynamic response model of the connector are built. Finally, the main influencing factors on the ECR under mechanical vibration stress are summarized systematically.

Semiconductor light-emitting device

Abstract: Disclosed is a semiconductor light-emitting device The semiconductor light-emitting device comprises a substrate (012) and a multi-layer structure on the substrate (012), wherein the multi-layer structure successively comprises a second electrical connection layer (010), an insulating layer (009), a first electrical connection layer (008) and a semiconductor light-emitting sequence starting from a substrate (012) side; the semiconductor light-emitting sequence comprises a first conduction type semiconductor layer (004), a light-emitting layer (003) and a second conduction type semiconductor layer (002); a first electrode (013) for external wire bonding is electrically connected to the first conduction type semiconductor layer (004) by means of the first electrical connection layer (008); a second electrode (014) for external wire bonding is electrically connected to the second conduction type semiconductor layer (002) by means of the second electrical connection layer (010); the semiconductor light-emitting sequence, the first electrode (013) and the second electrode (014) are located at the same side of the substrate; the second electrical connection layer (010) comprises a first part (0101) and a second part (0102); the first part (0101) is located at one side of the insulating layer (009); the second part (0102) extends from the first part (0101) at one side of the insulating layer (009) to penetrate through the insulating layer (009) to reach the same side of the first electrical connection layer (008) and is connected to the second electrode (014); and the second part of the second electrical connection layer (010) is not arranged at a central position below the second electrode (014)

Electrical connection box

Abstract: Provided is an electrical connection box into which a greater number of fuses can be inserted without increasing its size. An electrical connection box for a vehicle includes: an insertion housing into which multiple fuses are to be inserted through an open port on one side; multiple fuse terminals for connecting the fuses in the insertion housing to a substrate; a plate-shaped holding member that opposes the insertion housing from a side opposite to the one side of the insertion housing, and holds the multiple fuse terminals; and a case member that includes a flat plate portion for covering the multiple fuse terminals and has a notch that is formed in the covering portion, the holding member being arranged inside of the notch.

A Rotating Double Layer Capacitive Slip Ring Concept for Power & Heat Transfer in Machines using an Ionic Conducting Working Fluid

Abstract: Doubly fed induction machines, wound field synchronous machines and DC homopolar machines all require a slip ring connection to the rotor conductors. This connection inherently limits the performance and/or lifespan of these machines. Noncontact methods, such as brushless exciters and high frequency wireless power transfer, have been used to support some of these machines types but can be physically large and/or overly reliant on power electronics. Additionally, these methods do not support the cooling of the rotor conductors since they are purely electrical structures. This paper proposes a rotating electric double layer capacitor, or supercapacitor, to form a noncontact, slip-ring-like, AC electrical connection between the stator and rotor while simultaneously providing a rotor cooling platform. Here, a double layer capacitor is formed between a hydrostatic bronze bushing and the rotating shaft via flowing electrolytic liquid. The flowing electrolyte also serves as a heat transfer mechanism to remove heat from the shaft. Experimental results demonstrate increases in coupling capacitance and throughput A/Hz over prior work by factors of 100,000 and 100, respectively. The ability to simultaneously cool the shaft is demonstrated and measured as well.

Modular electrical wiring system and methods therefor

Abstract: A modular electrical wiring system, methods and components thereof, for connecting electrical devices to structural wiring. The system may include a base modular unit having a first electrical connection feature and one or more dependent modular units each having an electrical device, a first electrical connection feature and second electrical connection feature electrically and mechanically interconnectable with a first electrical connection feature of another modular unit. The modular units are may be assembled sequentially along a first axis by being rapidly interconnectable with adjacent modular units by relative movement therebetween in a direction perpendicular to the first axis. When modular units are connected in a mechanical series, electrical devices in the modular units may be functionally electrically in series or parallel, depending on the internal wiring of the upstream modular unit. Modular devices may have a switch to provide a choice between a series or parallel connection.

Search for additional criteria to estimate the electrical connection state under the impact of currents of different value

Abstract: The paper reports on search for additional criteria to estimate the electrical connection state in the operating mode characterized by abrupt change in electric current parameters. The results obtained in the course of theoretical studies are based on the use of methods of mathematical and experimental modeling of thermal processes in electrical connections of a traction power supply system. New criteria for estimating the state of the electrical connection for cyclic traction load have been found out. Investigation of the defectiveness ratio in the "heating-cooling" cycle makes it possible to estimate the current state of the electrical connection under service conditions.

Electrical connection box

Abstract: An electrical connection box mounted on a vehicle and used for connecting a plurality of on-board loads to an on-board power supply, comprising: a box main body that is provided with an opening at a side and that accommodates an electrical component for the connecting; a cover body that covers the opening and that is provided with a protrusion portion protruding outward beyond the opening; an insertion hole that is provided a side wall of the box main body and that allows for insertion of an electric wire to be connected to the electrical component; and an extension portion that extends outward from a portion of the protrusion portion corresponding to the insertion hole and that bends arcuately.

Packaging method and packaging structure

Abstract: The invention provides a packaging method and a packaging structure. The packaging method includes: firstly, bonding a first wafer with a first electrical connection end point and a first device assembly and a second wafer with a second electrical connection end point and a second device assembly in a wafer-level packaging mode; carrying out cutting to form a step-shaped wafer, wherein the secondelectrical connection endpoints and the first electrical connection endpoints in the wafer are distributed in a stepped manner; bonding the wafer to a third wafer with a third electrical connection end point and a third device assembly, wherein the wafer exposes the third electrical connection end point, so that the first electrical connection endpoint, the second electrical connection endpoint and the third electrical connection endpoint are sequentially distributed in a step shape, the manufacturing process difficulty and the packaging cost of the rewiring structure can be reduced, a three-dimensional packaging scheme of integrated packaging of multiple devices can be achieved, and the product integration degree can be improved.

Modular smart quick connect device for electrical fixtures

Abstract: A socket and plug are used to connect an electrical fixture with electrical power supply wiring, and for mounting the fixture on a support. The socket has internal cavities with electrically conductive contact terminals which establish an electrical connection between the electrical power supply wiring and the socket. A plug is rigidly fixed to a fixture, and is inserted into the socket. The plug has male connectors electrically connected to the fixture and engageable with the conductive terminals within the socket. A releasable latch is carried on the combination of the plug and the socket for releasably mounting the fixture on the support. A hub surrounds the plug and socket, and houses a plurality of sensor modules releasably connectable to a periphery of the hub. The sensor modules each include an electronic device operative to generate or transmit electronic data.

The real demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the electrical connection for the potential application in a vertical 3D integrated technology

Abstract: High-quality and the large area Carbon Nano-Tube (CNTs) is grown by Chemical Vapor Deposition (CVD) method in different trench structures for the potential applications on the vertically three-dimension integrated circuits (3DICs). It’s unique material properties, including Resistivity (p), thermal conductivity (k), coefficient of thermal expansion (CTE), and Young’s modulus (E) make it viable for the potential applications in the monolithic 3D vertically integrated technologies. Besides the well-known lower p in CNTs for the easier electron carrier transport, the higher k-value in CNTs— which is ~4500 Wm-1K-1 and 10x higher than Cu— results in the better thermal dissipation (~I5°C reduction) for the reduction of self-heating effect in the high dense 3D devices. On the other hand, the near-zero/negative CTE of -2xlO-6 K-1 and ultra-high E-value of 1000 GPa in CNTs is also found to reduce the residual stress and furtherly enhance the acceptable device layout area (by 80% keep-out zone reduction) in the 3D vertically integrated devices significantly. The prototype and full process flow for the CNTs as the vertical connection material for the 3D integrated technologies is demonstrated successfully. In summary, the growth of high-quality CNTs in the trench structure with a good electrical and mechanical material properties, and the development of an advanced key- module process for the monolithic 3D vertically integrated technologies provide a useful solution for the future high- performance and high-dense 3D integrated devices.

Impact of the Ball Grid Array Connection Failures on Signal Integrity

Abstract: Ball grid arrays (BGA) are widely used in micro assemblies to provide both the mechanical connection between the chip substrate and the circuit board, and the electrical connection between the chip circuit and the peripheral matching circuit. Connection failures of a ball grid array may result in deterioration of signal integrity and low communication quality. In the present work, the impact of a degraded ball grid array connection on high-frequency characteristics was studied. A 3-D electromagnetic field model and an equivalent circuit model of a degraded ball grid array were developed. The electrical performance of the degraded ball grid array was analyzed and simulated. It was found that the 3-D electromagnetic field model results were in good agreements with the predicted behaviors from equivalent circuit model simulations. The characteristics of the ball grid array for different degradation levels were then compared and analyzed. This research serves to provide a better understanding of the effects of ball grid array deterioration on signal performance for application in fault detection strategies for electronic systems.

Online Network Partition for Voltage Control in Power Systems with Large Penetration of Renewable Energy

Abstract: Network partition is the basis of voltage control, aiming at reducing load of communication devices and calculation modules, whilst solving var-voltage problems on the spot in larger and larger complex power networks. Power systems with large penetration of renewable energy such as solar or wind energy have time-variant operation characteristics and network partition in such networks requires efficiency and less running time to keep up with the changes. Generally, partition methods are mostly based electrical connection between buses and clustering methods, whose aim is to cluster buses that have similar voltage reaction characteristics into the same set. There are many ways to obtain electrical connection and partition networks, and their effects and efficiency vary from one to another. In this paper is proposed a practical method to do the computation of electrical connection while partitioning the power network into smaller sub-graphs online in less CPU time than traditional power network partitioning methods. Its aim is to optimize the index of partition, as well as to minimize inter-zone connection while maximizing intra-zone connection, fitting the partition results with different operation characteristics of renewable energy sources. The method to do the calculation of electrical connection matrix is based on a modified method of sensitivity while the partition method is based on the widely applied concept modularity and community detection algorithm.

Battery management device and method

Abstract: A battery management device according to the present invention may comprise: a sensing unit releasably mountable at a battery system, and when mounted at the battery system, configured to measure a voltage of a cell assembly provided in a battery pack electrically connected in parallel with another battery pack; a self-discharge circuit including a balance resistance connected in parallel on a charge/discharge path of the cell assembly, and a balancing switch connecting or disconnecting an electrical connection between the cell assembly and the balancing resistance; and a processor operably connected to the sensing unit and the self-discharge circuit.

Integrated coaxial notch antenna feed

Abstract: A novel system for supporting a plurality of notch antenna elements is disclosed. This system allows the creation of higher power ultra-wideband step notch arrays. The system also provides electrical connection to each of the notch antenna elements via respective coaxial cables or other direct connections. These coaxial cables connect to coaxial connectors disposed on a substrate that supports the notch antenna elements. Each coaxial connector is in electrical communication with one of the notch antenna elements. By replacing the printed circuit board traditionally used, higher power can be supplied to the notch antenna elements.

Architecture and processes to enable high capacity memory packages through memory die stacking

Abstract: Embodiments include electronic packages and methods of forming such packages. An electronic package includes a memory module comprising a first memory die. The first memory die includes first interconnects with a first pad pitch and second interconnects with a second pad pitch, where the second pad pitch is less than the first pad pitch. The memory module also includes a redistribution layer below the first memory die, and a second memory die below the redistribution layer, where the second memory die has first interconnects with a first pad pitch and second interconnects with a second pad pitch. The memory module further includes a mold encapsulating the second memory die, where through mold interconnects (TMIs) provide an electrical connection from the redistribution layer to mold layer. The TMIs may be through mold vias. The TMIs may be made through a passive interposer that is encapsulated in the mold.

Quick-locking detonation assembly of a downhole perforating tool and method of using same

Abstract: A detonation assembly of a perforating unit of a downhole tool is positionable in a wellbore penetrating a subterranean formation, and includes a charge assembly. The detonation assembly includes a detonator housing positionable in the perforating unit and having an uphole and downhole ends; uphole and downhole connections positioned at the uphole and downhole ends, respectively, of the detonator housing; a detonator positioned in the detonation housing; and a trigger positioned in the detonator housing. The trigger includes a detonation switch and a detonator contact. The detonation switch is communicatively coupled, when in use, between a remote actuator and the detonator contact. The detonator contact is positionable in the downhole connection, and has spring-loaded arms extending through openings in the downhole connection to urge electrical contact with the charge assembly whereby an electrical connection is maintained between the detonator and the charge assembly.

Non-staggered dual Row SMT connector

Abstract: Electrical connector apparatus can have at least two pins, at least one side slot, and at least one latch, facilitating a secure physical connection and a secure electrical connection with a printed circuit board or other unit The electrical connector apparatus can be a non-staggered dual row surface mount terminal connector

Insulation displacement connector

Abstract: A method and apparatus for forming a blind connection between a first wire and a second wire where each of the wires are inserted into a sleeve with the first wire laterally inserted into the sleeve for positioning along the first wire and the second wire axially inserted through the sleeve and into engagement with a stop located outside the sleeve to ensure that the second wire is properly positioned in the sleeve before an unseen electrical connection is formed between the first wire and the second wire

Electric connecting plug, electric connecting device and electric automobile

Abstract: The invention discloses an electric connection plug, an electric connection device and an electric vehicle. The electric connection plug comprises a first fixing plate, a mounting base, an electric connection assembly and a plurality of plugging assemblies, wherein the electric connection assembly and the plurality of plugging assemblies are connected to the mounting base; and the mounting base isin floating connection with the first fixing plate; the electric connection device comprises an electric connection socket and the electric connection plug, and the electric connection assembly and the plurality of plugging assemblies are connected to the electric connection socket; the electric automobile comprises a battery pack, an automobile body and the electric connecting device, the electric connecting plug is connected with the automobile body, and the electric connecting socket is connected with the battery pack. The electric connection plug is advantaged in that water and electricity are connected at the same time, the actual use space is reduced, a problem of the actual installation space is solved, and cost is reduced; and meanwhile, the abnormal phenomena such as electrical connection failure or burnout and the phenomena of liquid outflow and splashing are effectively avoided.

Tamper detection system

Abstract: A payment reader includes a tamper detection system having a first sensor element disposed on a circuit board of the tamper detection circuit; a second sensor element disposed within an interior surface of a housing of the tamper detection circuit; and a guard ring disposed on the circuit board of the tamper detection circuit configured to form an electrical connection with the first sensor element in response to injection of conductive fluid thereby indicating tampering with the tamper detection circuit, wherein the guard ring is configured to be on a plane different from the first sensor element to prevent unintentional activation of the tamper detection circuit.

Front grille storage

Abstract: A storage and charging system for a motor vehicle includes a drawer assembly front portion comprising a portion of the front grille. The drawer assembly is movable between open and closed positions by an actuator and provides a storage space that may be used for a charging cable. An electrical connection is disposed within the drawer assembly and provides an electrical coupling between a charging cable and a battery of the motor vehicle.