Showing papers on "Electroless nickel plating published in 2018"

Solvent extraction of nickel ions from electroless nickel plating wastewater using synergistic green binary mixture of D2EHPA-octanol system

Abstract: A study on the synergistic green solvent extraction of nickel ions from real electroless nickel plating wastewater using an organic phase containing a binary mixtures of Di (2-ethylhexyl) phosphoric acid (D2EHPA) and octanol in palm oil was conducted. The effects of diluent composition, synergist, carrier and stripping agent types and its concentrations were experimentally investigated and the optimum conditions were determined. Results revealed that both D2EHPA and octanol acted as a carrier and synergist, respectively. A significant synergistic effect occurred when the octanol helped destroy the dimer structure of D2EHPA for cation exchange mechanism with nickel ions, hence improving the nickel ions extraction up to 90% with the maximum distribution ratio of 8.8 under optimum condition of 0.7M D2EHPA and 15% (v/v) octanol in palm oil. Afterwards, the stripping experiment showed that nickel ions could be recovered from the loaded mixture of carrier using 1.0M nitric acid solutions. Besides, the slope analysis method showed that the nickel ions were extracted from weak acidic electroplating feed solution as nickel-D2EHPA-octanol complex and recovered as nickel nitrate complex in the stripping phase. Thus, it can be concluded that the green synergistic formulation containing binary mixtures of D2EHPA-octanol system is one of the promising approaches as well as a green and efficient separation method for nickel ions extraction from the real electroless nickel plating wastewater.

Establishing Environment Friendly Surface Treatment for AZ91 Magnesium Alloy for Subsequent Electroless Nickel Plating

Abstract: Asystematic study was made to develop the non-chromate and non-fluoride surface treatment for the AZ91 alloy to enable an adherent and corrosion resistant electroless nickel (EN) coating. The performance of the surface treatments is substantiated by the EN coating, in a single and two (duplex) layers on the prior surface pretreated AZ91 alloy, in the subsequent bath. The surface treatment in a solution containing cerium nitrate and subsequent single layer EN coating exhibited good adhesion and an excellent corrosion resistance in 0.5% NaCl solution. The duplex EN layer improved both corrosion as well as adhesion resistance. A remarkable long term (100h exposure) corrosion resistance, assessed using electrochemical impedance spectroscopy (EIS), was shown by the duplex EN coating with an outer layer produced in a bath of pH similar to 5. In contrast, the duplex coating with an outer EN layer obtained in a bath of pH similar to 10.5 failed within 4h of exposure. The porosity index of the coating in the order of 10(-6) appears critical for achieving an excellent corrosion resistance. The adhesion resistance, as indicated by the critical load for coating delamination, was successively increased from 5.2 to 10.39N using different pretreatment processes. The adhesion resistance was influenced by the agglomerate particle size and coating thickness. (C) 2018 The Electrochemical Society.

Nickel deposition on Kevlar fabric modified with aminopropyltrimethoxysilane in supercritical fluid via electroless plating

Abstract: Kevlar fabric was pretreated with aminopropyltrimethoxysilane (APTMS) through supercritical carbon dioxide (scCO2) process before electroless nickel plating. APTMS pretreated Kevlar fibers were characterized by element distribution and contact angle. Deposition rate, deposit weight, surface morphology, crystal structure, surface resistance, electromagnetic interference shielding effectiveness (SE) and magnetic properties of electroless nickel plated Kevlar fabric were investigated. The results show that APTMS is evenly covered on Kevlar fibers after pretreatment. Nickel coatings on the Kevlar fibers are dense and uniform after nickel plating. Surface resistance and electromagnetic interference SE of the nickel plated Kevlar fabric via scCO2 processes arrives at 1.33 Ω/sq and 13–19 dB at frequencies ranging from 2 to 18 GHz. The saturation magnetization of Ni coated Kevlar fabric reaches 207.52 memu/g.

Conformal Electroless Nickel Plating on Silicon Wafers, Convex and Concave Pyramids, and Ultralong Nanowires.

Abstract: Nickel (Ni) plating has garnered great commercial interest, as it provides excellent hardness, corrosion resistance, and electrical conductivity. Though Ni plating on conducting substrates is commonly employed via electrodeposition, plating on semiconductors and insulators often necessitates electroless approaches. Corresponding plating theory for deposition on planar substrates was developed as early as 1946, but for substrates with micro- and nanoscale features, very little is known of the relationships between plating conditions, Ni deposition quality, and substrate morphology. Herein, we describe the general theory and mechanisms of electroless Ni deposition on semiconducting silicon (Si) substrates, detailing plating bath failures and establishing relationships between critical plating bath parameters and the deposited Ni film quality. Through this theory, we develop two different plating recipes: galvanic displacement (GD) and autocatalytic deposition (ACD). Neither recipe requires pretreatment of the Si substrate, and both methods are capable of depositing uniform Ni films on planar Si substrates and convex Si pyramids. In comparison, ACD has better tunability than GD, and it provides a more conformal Ni coating on complex and high-aspect-ratio Si structures, such as inverse fractal Si pyramids and ultralong Si nanowires. Our methodology and theoretical analyses can be leveraged to develop electroless plating processes for other metals and metal alloys and to generally provide direction for the adaptation of electroless deposition to modern applications.

Completely Aqueous Route for Metallization of Structural Polymeric Materials in Micro-Electro-Mechanical Systems

Abstract: A one-step aqueous diazonium-based process has been proved efficient with respect to the covalent grafting of aminophenyl layers onto KMPR photoresist polymer. In contact with acidic palladium chloride solution for only a few minutes, the positively charged protonated aminophenyl groups on the modified KMPR surface can electrostatically immobilize PdCl42− complexes. This KMPR surface functionalized with palladium-aminophenyl complex activators enables initialize the subsequent autocatalytic deposition of nickel (electroless nickel plating) and leads to a formation of adhesive nickel-boron film onto KMPR substrate. Our proposed green chemistry strategy for the metallization of KMPR photoresist polymer via the diazonium reduction suggests an opportunity to benefit from the incomparable physico-chemical properties of KMPR by integrating it within MEMS structures. The obtained 60 nm thick and compact nickel‑boron alloy (93:7 by weight), evidenced through SEM, AFM and XPS techniques, can be used as a conductive seed layer for direct electrolytic deposition of copper. Consequently, a vacuum-free process for copper filling of mechanical features etched inside the KMPR layer has been demonstrated.

Influence of the anionic part of the stabilizer on electroless nickel-boron plating

Abstract: Selectivity and smooth operation of electroless nickel plating require that a stabilizing agent is used. It operates by blocking catalytic activity on unwanted germination sites and regulating the activity of the substrate. In the case of alkaline electroless nickel-boron plating systems, which use sodium (or potassium) borohydride as reducing agent, lead and thallium salts are the most popular stabilizers. However, there is little knowledge about the way the stabilizer acts. In this study, 4 different lead-based stabilizers (tungstate, sulphate, nitrate and chloride) have been used, all other things left constant, in electroless nickel-boron plating baths. The thickness, composition, roughness, morphology, hardness and structure of all the obtained coatings have been investigated. Chloride led to thinner deposits and the boron content varied between 5.5 wt.% for lead tungstate and 6.5 wt.% for lead nitrate and lead sulphate, with a lead content between 0.2 and 0.25 wt.%. Coatings obtained with a ...

Improvement of the Wear Resistance of Ferrous Alloys by Electroless Plating of Nickel

Abstract: The electroless nickel (Ni) and composite nickel – nanodiamond (Ni+DND) coatings are investigated in this study. The method EFTTOM-NICKEL for electroless nickel plating with nanosized strengthening particles (DND 4-6 nm) is applied for the coating deposition. The coatings are deposited on ferrous alloys samples. The wear resistance of the coatings is performed by friction wear tests under 50-400 MPa loading conditions – in accordance with a Polish Standard PN-83/H-04302. The microstructure observations are made by optic metallographic microscope GX41 OLIMPUS and the microhardness is determined by Vickers Method. Tests for wear resistance, thickness and microhardness measurements of the coatings without heat treatment and heat treatment are performed. The heat treatment regime is investigated with the aim to optimize the thermal process control of the coated samples without excessive tempering of the substrate material. The surface fatigue failure is determined by contact fatigue test with the purpose to establish suitable conditions for production of high performance materials.

Electroless composite nickel coatings strengthening with TiN nanoparticles plated on ductile cast iron

Abstract: Electroless nickel (Ni) and composite nickel coatings (Ni+TiN) are investigated in this study. EFFTOM -Nickel Method for electroless nickel plating is applied. Nanosized TiN particles (50nm) are used as a strengthening material. The coatings are plated on ductile cast iron samples. The wear tests of the coatings by the classic model TABER ABRASER “disc to disc” are carried out. The observation of the samples microstructure by means of an optical metallographic microscope GX41 OLIMPUS and the microhardness measurements by Knoop Method are performed. The wear resistance, the thickness and microhardness of the samples before and after thermal processing at 290°C, 6 h are defined.

Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process

Abstract: The electroless nickel immersion gold process often produces defects, such as pinholes and black pads that can cause brittle fractures at the interface between the solder and metal pad. Contamination in electroless Ni plating solutions with increasing metal turn over (MTO) is believed to be one of the causes of the formation of surface defects. MTO means indirectly Ni bath life, with ‘‘0 MTO’’ indicating a freshly plating bath and ‘‘2 MTO’’ an aged plating bath, which is supplemented twice with the initial amount of metallic salts and the reducing agent. In this study, surface defects on the Ni-plated layer were investigated to understand the correlation between the MTO solutions and defect factors by solder resist (SR) dissolution. The characteristics of the contaminated MTO solutions were analyzed by total organic carbon and liquid chromatography mass spectrometry (LC-MS). LC-MS detected the component (melamine) of the hardener of the SR at 2.14 ppm in the 2 MTO, and 2.52 ppm in the 2.5 MTO solutions. Electroless nickel plating was conducted in a 0 MTO solution with hardener addition. Pinholes were observed in solutions containing more than 2 ppm of a hardener. In particular, the content of phosphorus in the defective area was higher than that in the non-defective area. Consequently, as the MTO solution increased, the hardener was dissolved in the Ni solution, which caused defects in the nickel surface layer, such as pinholes and black pads.

Effect of ultrasonic vibration on activation-electroless nickel plating on Nylon 12 powders

Abstract: In this work, the electroless nickel plating on Nylon 12 (PA12) powders was developed. The effect of ultrasonic vibration on activation-electroless plating on PA12 powders were investigated systematically using scanning electron microscopy and X-ray diffraction. Results showed amine groups attached on the surface of KH550-modified PA12 powders. The surface structure of modified powders could adsorb the tin and palladium ions, which used as catalyst for the Ni plating. Ultrasonic vibration-assisted activating would facilitate the adsorption of Pd atoms on the surface of PA12 powders, however, hinder nickel atoms plated on the PA12 surface. When the PA12 powders were plated with and without ultrasonic vibration, the palladium content of activated powders were 0.15 and 0.04%, the nickel content of plated powders were 4 and 10%, amorphous shells and nickel particles plated on the surface of PA12 powders, respectively.

Device and method for achieving uniformity of electroless nickel plating layer

Abstract: The invention relates to a device and method for achieving the uniformity of an electroless nickel plating layer. The device comprises an electroless nickel plating tank, an automatic chemical addingapparatus is arranged on the outer side of the electroless nickel plating tank, a chemical adding tube of the automatic chemical adding apparatus is arranged on the side wall of the electroless nickelplating tank, and a stirrer is arranged in the electroless nickel plating tank. The method includes the following steps that 1, after the electroless nickel plating tank prepares a plating solution,the stirrer is started and a filter pump is started; 2, the tank wall of the electroless nickel plating tank is provided with an anode protection device; 3, a work piece is fed into the work area of the electroless nickel plating tank, nickel plating is started, and at the same time, the automatic chemical adding apparatus is started to maintain the concentration of the main salt of the bath solution. The device and method can provide the uniformity of the temperature and concentration in the electroless nickel plating tank so that the concentration of each component of the electroless nickelplating solution can be maintained in the normal process range, thus the uniformity of the electroless nickel plating layer is achieved.

Effect of Nickel-plating on Laser Welding of Aluminum Packages for Microwave module

Abstract: The effect of Nickel-plating on laser welding process of aluminum packages were studied in this paper. The laser welding of nickel -plating aluminum alloy was characterized by analyzing different welding parameters and different types of nickel-plated. Then by X-ray fluorescence thickness tester, optical microscope, scanning electron microscope, micro-section and micro-hardness, the weld morphology of nickel-plated aluminum alloy packages and the change of micro-hardness from the weld to the matrix were analyzed. The results show that, under appropriate welding parameters, nickel-plated aluminum packages could achieve laser welding. Different types of nickel plating was different for the effect of laser welding, electroplated nickel aminosulfamate and electroless NiP (less than 10%P) were smaller effects of laser welding and its laser welding was feasible. The electroless NiP (greater than 10%P) was easy to weld cracks, holes and other defects, affecting the sealing performance of aluminum package. Metallographic analysis also showed that the weld penetration of nickel-plated aluminum was greater than 0.5mm and the microstructure of its weld was compact and no internal cracks and other defects, with microstructure between the weld and the matrix the changing from the fine grains gradually into columnar grain. The micro-hardness results showed that the hardness became smaller along the direction of the heat-affected zone, indicating that the nickel element on its weld played the role of enhancement. At the same time, the reliability of validation results also show that both nickel and electroless nickel plating samples at temperature and humidity and mechanical stress, the sealing performance did not change, you can ensure reliability.

A surface modified 20Cr steel bipolar plate material and a preparation method thereof

Abstract: The invention relates to a surface modified 20Cr steel bipolar plate material and a preparation method thereof. 20Cr steel is taken as a substrate, that substrate is ground and polis before being treat, and then the substrate is subjected to ion nitriding, electroless nickel plating, nitride coat deposited by PVD technology and the like to prepare a composite multilayer film of 20Cr steel/nitriding/nickel plating/CrN or CrMoN. Under the simulated PEMFC environment, the corrosion resistance and surface contact resistance of the surface modified 20Cr steel bipolar plate meet the American DOE 2020 standard, and the adhesion between the film and the substrate is greater than 45N. The corrosion resistance and surface contact resistance of the surface modified 20Cr steel bipolar plate meet the American DOE 2020 standard. 316L stainless steel material can be replace by a common carbon steel sheet by adopting that method of the invention, and the production cost of the bipolar plate is reduce.

A pretreating-activating solution for an electroless nickel plating a method for electroless plating a thin-nickel and a method for surface-treating using the same and a printed circuit board comprising an electroless thin-nickel

Abstract: According to the present invention, there is provided a pretreating-activating solution for electroless nickel plating including a palladium compound, ammonium salt, a pH adjuster, a copper ion elution inhibitor, and an EO/PO copolymer represented by the following formula (1) as a stabilizer, an ultra-thin electroless Ni plating method using the same, resultant ultra-thin electroless Ni plating, and a printed circuit board including the same. The ultra-thin electroless Ni plating manufactured through an improved Thin-ENEPIG process according to the present invention and the printed circuit board including the same (1) has no void or erosion at the interface between a copper surface and the ultra-thin electroless Ni plating (Thin-Ni), (2) has a reduced stress because it has the form of an amorphous soft Ni plating film, (3) has no circuit spread in the microcircuit, (4) has no surface defect such as pinholes and skip plating in the surface of the final microcircuit (Au plated layer), (5) is highly reliable and excellent in performance and physical properties such as solderability, wire bonding properties, surface uniformity, and corrosion resistance, and (6) addresses problems of the related art by means of a total Ni/Pd/Au plating thickness of 0.5 to 0.7 micrometers, and thus (7) can be utilized in manufacturing a printed circuit board having a very fine pattern with a line/space of 20 to 10 micrometers/20 to 10 micrometers and an ultra fine pattern with a line/space of 10 micrometers/10 micrometers or less.

Magnetic Helical Microswimmers Made by Spirulina through Electroless Nickel Plating

Abstract: We present a simple technique to fabricate magnetic helical microswimmers with excellent surface quality and swimming performance. These were obtained through depositing a nickel film on the Spirulina biotemplates by electroless nickel plating. The morphology and coating composition of the as-prepared microswimmers were analyzed. Homogeneous and compact nickel coating was successfully deposited on the helical biotemplates, and Ni element could reach ~95wt%. Its magnetic property was also characterized. Moreover, a controlled rotating magnetic field was applied to manipulate such a microswimmer in deionized water. Its motion behavior was further analyzed, indicating that such microswimmers could be actuated and steered precisely at low Reynolds numbers. The magnetic helical microswimmers may have potential biomedical applications such as targeted drug delivery and cell manipulation.

Glass wiring board, semiconductor package substrate, semiconductor device, and method for manufacturing semiconductor device

Abstract: PROBLEM TO BE SOLVED: To provide a glass wiring board, a semiconductor package substrate, a semiconductor device and a method for manufacturing the semiconductor device which can suppress the occurrence of delamination between a wiring layer and an insulator layer on a glass even under high- and low- temperature environments.SOLUTION: A glass wiring board according to an embodiment hereof comprises: a glass plate with a through-hole; a wiring pattern which has a wiring layer arranged by laminating one or more kinds of metal layers, an electroless nickel plating layer and an electrolytic copper plating layer in turn so that they are provided just above the glass plate, and in which the metal layer is smaller, in line width, than the electroless nickel plating layer and the electrolytic copper plating layer; an electroless nickel plating layer provided on a wall in the through-hole; and an electrolytic copper plating layer formed on the electroless nickel plating layer in the through-hole.SELECTED DRAWING: Figure 9

Pretreatment of iron-based substrates for electroless plating

Abstract: A method of electrolessly plating an iron-based substrate, including immersing an iron-based substrate in an acidic solution, immersing the iron-based substrate in a basic complexing solution, immersing the iron-based substrate in a catalytic metal solution including a catalytic metal, and immersing the iron-based substrate in an electroless nickel plating solution or an electroless cobalt plating solution.

High hardness electroless nickel plating solution for aluminum alloy and electroless plating process thereof

Abstract: The invention discloses a high hardness electroless nickel plating solution for aluminum alloy. An additive A consists of the following mass concentration raw materials: a 10-20mg/L mixture of nano-copper and a soluble copper salt, 5-10mg/L rhenium sulfate, 5-15mg/L sodium allyl sulfonate, a 5-15mg/L complexing agent, a 5-15mg/L stabilizer, and 5-10g/L sodium hydroxide; an additive B is composed of the following mass concentration raw materials: 5-10mg/L butynediol ethoxylate, 0.2-0.5mg/L N, N-diethylpropynylamine, 0.2-0.5mg/L dibenzenesulfonimide, and 10-20mg/L hydroxymethyl sodium sulfonate.Through screening of the component content of all the raw materials, the inventor accidentally finds that an electroless nickel plating layer with hardness greater than 900Hv can be obtained on the surface of an aluminum alloy matrix by plating, which greatly exceeds the expectation of the technical personnel in the field. At the same time, the electroless nickel plating solution provided by theinvention has a working temperature range and a pH range wider than those of the prior art, thus being more suitable for the needs of large-scale and mass production.

Electroless Nickel Plating and Spark Plasma Sintering of nano ZrO2 for Mechanical Property Enhancement

Abstract: ............................................................................................................................................................................. vi

Method for processing electroless nickel plating wastewater by photoelectrochemistry

Abstract: The invention discloses a method for processing electroless nickel plating wastewater by photoelectrochemistry. The method comprises the following steps: adsorbing and aggregating heavy metal nickel in the electroless nickel plating wastewater by ion exchange resin to obtain wastewater containing hypophosphorous acid radicals; performing elution regeneration on the ion exchange resin to obtain a regeneration liquid containing nickel ions; and performing photoelectrocatalytic oxidation on the wastewater containing the hypophosphorous acid radicals, and performing electroreduction on the regeneration liquid containing the nickel ions to recover the metal nickel. The method disclosed by the invention utilizes the photoelectrocatalytic oxidation technology to realize oxidation of the hypophosphorous acid radicals and synchronous recovery of the high-concentration nickel ions, can effectively oxidize the hypophosphorous acid radicals in the wastewater into orthophosphoric acid radicals, andrealize recovery of phosphorus by adding a precipitating agent; and the method can electroreduce and recover the heavy metal nickel in the oxidation process of the hypophosphorous acid radicals, andhas the advantages of being simple, efficient, economical and easy to apply in engineering.

- aqueous electroless nickel-phosphorus alloy plating bath and method of using the same

Abstract: An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

Chemical Metallization of Insulating Polymeric Surfaces Through Simple Diazonium-Based Covalent Amination

Abstract: Electroless plating or autocatalytic deposition on insulating polymeric substrates via surface amination is currently of potential interest since the grafted amine functionalities significantly decrease the total quantity of noble metal catalyst and offer good adhesion between the polymer substrate and the deposited film. Among various wet-chemical amination strategies available in the literature, diazonium-induced anchoring process appears to be very promising due to many advantages: one-step aqueous chemical process, provides covalent grafting of amine-terminated groups, carried out in open air and at room temperature. This work covers our recent studies on the grafting of aminophenyl and vinylpyridine groups through diazonium chemistry onto various polymers. We discuss the ability of these amine-terminated functionalities towards the chemisorption of acidic palladium chloride activators, which subsequently initiate autocatalytic deposition process. Our studied polymers functionalized with these palladium complexes perfectly suit the subsequent electroless nickel plating process. The covalently grafted amine groups provide excellent adhesion of the deposited nickel film on polymers. SEM, AFM, EDX and XPS techniques are used to characterize the electrolessly deposited metallic film.

Preparation and Performance of Electroless Nickel on HVOF (High-Velocity Oxygen Fuel) Sprayed Inconel 625 Nickel Coating for Corrosion Protection Applications

Abstract: High Velocity Oxy-Fuel (HVOF) spraying is one of the preferred surface engineering technologies that can offer advantages such as user-friendliness and cost-efficiency in mass production of coatings for various applications. While the main applications of the HVOF process are related to wear, corrosion resistance can be one of the important desired features of the surface engineering process. However, the porosity of HVOF sprayed coatings is usually a problem when coatings are used in corrosion applications. Low carbon steel substrates were High-Velocity Oxygen Fuel (HVOF) sprayed with Inconel 625 and then coated with a thin film of electroless nickel (electroless nickel plating). Reference sample without electroless nickel was sprayed at the same time. Characterization of the coatings was made by X-Ray diffraction analyses, microstructural surveys, cross-section and corrosion tests. Results showed that sequential application of HVOF spraying and electroless coating processes provided the multi-layered coating consisting of an inner inconel 625 based layer and an outer Ni-P layer. Electroless Ni-P also caused the remarkable increasing in the corrossion resistance as compared to the as-HVOF sprayed state.

Effect of Electroless Nickel Plating on Properties of Iron Matrix Composites

Abstract: Iron matrix composites are a kind of high-performance, low-cost metal matrix composites. They are the most promising metal matrix composites. In order to overcome the problem of reinforced particles and molten iron not infiltrating, the application of electroless nickel plating can solve it successfully. Based on the principle of electroless nickel plating, this paper studies the erosion and wear resistance of iron matrix reinforced composite. The experimental results show that the electroless nickel plating on the surface of the reinforced particles can achieve better bonding with the iron matrix and improve the infiltration of the matrix. Different particle volume fractions and different particle sizes have a greater influence on the erosion wear resistance of iron matrix composites. The larger the volume fraction of particles, the greater the volume wear, and when the particle volume fraction is the same, the erosion wear of the iron matrix composites increases with particle size.

Nickel colloidal catalyst solution for electroless nickel plating or nickel alloy plating and electroless nickel plating method or nickel alloy plating method

Abstract: PROBLEM TO BE SOLVED: To provide a uniform nickel-based coating by improving temporal stability and practicability for repeated use (repeated usability) of a nickel catalyst solution and plating an electroless nickel or a nickel alloy on a non-conductive substrate having catalyst imparted.SOLUTION: After an adsorption promotion treatment is performed by immersing a non-conductive substrate in a solution including a surfactant, a catalyst is imparted to the non-conductive substrate using a nickel colloidal catalyst solution for electroless nickel plating, the nickel colloidal catalyst solution including (A) a soluble nickel salt, (B) reducer, (C) a predetermined carbohydrate such as glucose, fructose, sorbitol, xylitol, maltitol, and mannitol, which is followed by an electroless nickel plating. Because after a catalyst activity is enhanced by the adsorption promotion treatment, the catalyst is imparted with a nickel catalyst solution having an excellent temporal stability and a repeated usability, and an electroless plating is performed, a uniform nickel coating without uneven precipitation is obtained. A nickel alloy coating having an excellent uniformity is obtained by applying to a nickel alloy plating method instead of above nickel plating method.SELECTED DRAWING: None