Showing papers on "Substrate (printing) published in 1991"

High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias

Abstract: A high-density package containing identical multiple IC chips is disclosed. The package is assembled from submodules interleaved with frame-like spacers. Each submodule comprises a rectangular, wafer-like substrate. The substrate has a planar metalization pattern, comprising conductive traces, on its upper surface. A single memory chip is face-bonded to this metalization pattern. Each of the traces extends from beneath a chip bonding pad, with which it is in electrical communication, and runs to the substrate periphery, where it terminates in one or more solderable package interconnection pads (PIP's). Each PIP is associated with a single substrate via, which extends through the pad to the lower surface of the substrate. During package assembly, a spacer is adhesively bonded to the peripheral upper surface of each sub-module, with the frame surrounding the chip. The spacer also has a plurality of vias which are coincident and coaxial with the substrate vias, with the spacer vias being of larger diameter. Each spacer-equipped module is then adhesively bonded to the others to form a stack. The upper-most spacer-equipped module is fitted with a non-metalized (capping) substrate. In order to electrically interconnect the related traces of all sub-modules, the package is placed in a solder bath, and a partial vacuum is applied simultaneously to one end of all tubes formed from the coincident, stacked vias, filling them with molten solder.

An electroenzymatic glucose sensor fabricated on a flexible substrate

Abstract: A glucose-oxidase-based electroenzymatic glucose sensor has been developed using thin-/thick-film processing techniques. We believe that this processing scheme will overcome a major impediment to the successful movement of the devices from the research laboratory to the marketplace by removing the difficulty of fabricating large numbers of reproducible and economical sensors. Several hundred sensors have been fabricated and tested in vitro. The sensors respond linearly to glucose, are stable for 72 h, are oxygen independent and have a 90 s response time. The sensors have also responded appropriately during preliminary glucose tolerance tests performed in rabbits.

Compact high density interconnect structure

Abstract: An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate Substrates of either of these types may be stacked to form a three-dimensional structure Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof

Thin film electrical component

Abstract: A biocompatible thin film electrical component is configured for use in a human body or other ionic liquid environment. A polyimide substrate is bonded to a glass carrier plate sized for handling by automatic equipment and a multiple-layer metal conductor is deposited on the substrate and patterned to define an electrical circuit or biosensor. The polyimide and the glass establish a bond therebetween that withstands handling yet is broken using biocompatible releasing agents and techniques. The polyimide substrate and glass carrier plate preferably have similar thermal expansion properties to reduce the likelihood of fracture and delamination problems during release of the substrate from the carrier plate. An insulation layer covers the metal conductor and, in one embodiment, is made of a polyimide having a cure temperature lower than the temperature at which interdiffusion occurs in the metal layers in the conductor.

Magnetic field generating substrate and ink jet head equipped therewith

Abstract: PURPOSE: To prolong the life of an ink jet head by providing a plurality of electromagnets on a substrate. CONSTITUTION: On a magnetic field generating substrate having a plurality of electromagnets 302-308 arranged on a substrate 301, a film 310 having a thin film magnet 311 is stuck together, and a nozzle plate 313 is provided on the film 310 by keeping a given distance. The form of the film 310 is changed by the repulsion of the magnet 311 and the electromagnets 302-308 disposed under the magnet 311, so that pressure fluctuation is generated in an ink 315 on the film 310 and ink drops are discharged from an ink discharge outlet. COPYRIGHT: (C)1992,JPO&Japio

Substrate for packaging a semiconductor device

Abstract: of the Disclosure A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.

Abrasion wear resistant polymeric substrate product

Abstract: A substantially optically transparent coated substrate product (1) with a highly adherent, abrasion-resistant diamond-like hard carbon coating (4) is disclosed. The substrate product is comprised of a polymeric substrate (1), and adhesion-mediating polysiloxane polymer layer (2), one or more intermediate layers (3) and an outer layer of diamond-like hard carbon (4). The invention also allows for the production of adherent thin film interference layer coatings (i.e. quarter wavelength stacks and anti-reflection coatings) using diamond-like hard carbon as the high refractive index layer and the interlayer(s) as the low refractive index layer or, alternatively, using diamond-like hard carbon as the low refractive index layer and the interlayer(s) as the high refractive index layer. The substrate product is useful as optical and sunglass lenses.

Latent-image control of lithography tools

Abstract: Measurement apparatus and procedure for use with lithographic equipment is provided for the construction of electronic and other devices wherein a photoresist is deposited as a layer upon a substrate. A Nomarski differential interference contrast microscope in conjunction with a scanned image detector is employed to examine verification marks produced by projection of an overlay, such as the mask or reticle, upon the photoresist layer. The projection results in a production of verification marks in the form of a latent image which, while invisible with conventional viewing means, can be viewed by phase-contrast imaging employing differential phase shift. Various characteristics of the resultant image are employed to align secondary verification marks with primary verification marks previously provided on the substrate, and to allow for a checking of line width, dosage, focusing, temperature control, and global alignment. Observation of the photoresist is accomplished with radiation at lower frequency than the exposure radiation, the latter being significantly absorbed, by the photoresist, the photoresist being transparent to the observation radiation to permit reflection from top and bottom surfaces of the photoresist.

Semiconductor device with controlled spread polymeric underfill

Abstract: A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.

Method of forming metal contact pads and terminals on semiconductor chips

Abstract: A method of forming metal contact terminals (35) of a determined size having an insulating substrate (17) with a metal land (18) formed thereon and a passivating layer (19) provided with an opening exposing a part of the metal land by forming intermediate metal contact pad (33') in the contact opening, applying and patterning a photoresist, delineating the intermediate metal contact pad (33') using pattern (31) as an in-situ mask, depositing a lead-tin solder layer (34') over a metal mask to form a solder bump (34') on the final metal contact pad, and reflowing the solder to form a solder ball (34). Thereby achieving the metal contact terminal (35) at the contact pad site. The above method has applicability to the fabrication of contact terminals for high density/high count I/O connections for advanced semiconductor chips that are appropriate for flip-chip (C4) or face-down bonding thereof on metallized ceramic (MC) substrates.

Flexible attachment flip-chip assembly

Abstract: A multiple chip module (MCM) is fabricated by connecting a series of semiconductor chips, in a flip-chip orientation, to a multi-chip substrate with resilient connection pads. The substrate is formed from silicon by placing a layer of SiO2 on the surface. At the locations requiring a resilient connection pad, the SiO2 layer is pierced with a series of closely spaced holes. A cavity is etched out of the silicon below the closely spaced holes. The SiO2 layer is now suspended over the cavity and forms a flexible membrane. A post is formed on top of the flexible membrane. A conductor formed on the substrate has one end supported by the post. One end of the conductor is, therefor, supported by the post and flexible membrane so that a solder bump placed thereon may be used for a demountable connection to a contact pad on a flip-chip.

Cell substrate electrical impedance sensor with multiple electrode array

Abstract: An apparatus and method for monitoring cell-substrate impedance comprises upper and lower substrates each containing strips of metal foil which cross to form well areas. Holes in the upper substrate expose an insulation layer between the upper and lower substrates. Smaller holes in the insulation layer expose the conductive material of the lower substrate. Cylindrical well walls are positioned around each of the holes in the upper substrate and define a cell medium containing well which is exposed to an annular area of conductive foil on the upper substrate, and a small area of conducive foil on the lower substrate. The areas of foil form large and small electrodes which are positioned in an array of wells which can be used to monitor the impedance of various cell cultures under various conditions. A switching device applies currents to the well electrodes and a monitoring device measures the impedance between the electrodes in each well. In this way, cell spreading and motility can be measured.

Apparatus for cooling integrated circuit chips

Abstract: An apparatus for cooling an array of integrated circuit chips mounted on a substrate comprises a thermally conductive cooling plate which has a plurality of integral, substantially parallel, closed-end channels. A cover which may be made of plastic is adapted to seal the periphery of the cooling member and is spaced from the channel-containing surface. The cover has a plurality of integral baffles extending toward the cooling member into and along the length of the channels. The baffles and the channels are spaced from each other to permit passage of a coolant between and through the channels in a flow direction normal to the channels. An inlet and outlet for the coolant are provided on opposite ends of the apparatus, and may be located in the cover. In an alternate embodiment, the cooling plate contains at least two sets of the channels, each set of channels receiving a separate flow of coolant, either in parallel or in series with each other.

Method for applying a hot melt ink to a substrate

Abstract: The present invention provides a process for applying a thermoplastic image forming composition as a series of discrete droplets from a non-contact ink jet printing apparatus to form separate drops on a substrate moving relative to the apparatus, characterized in that the molten composition is thermally stable at the temperature of application and is applied at a temperature in excess of 100° C. The invention can be used to apply the molten composition to a variety of substrates using on-demand or continuous non-contact ink jet application techniques. However, the invention is of especial use in the application of thermoplastic inks to non-porous substrates using an on-demand ink jet printer.

Microporous polyolefin shaped articles with patterned surface areas of different porosity

Abstract: A microporous polyolefin shaped article is provided. The article comprises a polyolefin substrate of substantially uniform thickness having a patterned surface, the patterned surface providing substantially skinless areas having high microporosity and skinned areas of reduced microporosity. A method for preparing the article is also provided.

Method of vapor-growing semiconductor crystal and apparatus for vapor-growing the same

Abstract: A method of growing in vapor phase a semiconductor crystal layer supplies a reaction gas to a portion above the surface of a heated substrate so as to be parallel or obliquely to the substrate, and uses a transparent blow tube widened toward its blow port like a funnel to blow a pressing gas, which is inert with respect to the reaction gas, toward the substrate, thereby bringing the reaction gas into contact with the surface of the substrate.

Method of making a molded field emission electron emitter employing a diamond coating

Abstract: A field emission electron emitter employing a coating of diamond material disposed on a surface of a layer of conductive/semiconductive material is constructed by a method including the steps of implanting carbon ions at a surface of a selectively shaped substrate to function as nucleation sites for the diamond formation A conductive layer is deposited over the diamond and the substrate is removed to leave an electron emitter with a diamond coating

Apparatus for depositing a coating on a substrate

Abstract: An apparatus for depositing a coating on a substrate substantially eliminates the occurrence of oval defects by creating a heated tortuous path through which the source material vapors must travel before depositing on the substrate. In addition, shut-off valves for each of the source materials are positioned in the reaction chamber in close proximity to the substrate, thereby enabling layers of different compositions to be deposited with sharp transitions between adjacent layers. The apparatus may be used to efficiently coat large areas uniformly, and works equally well with either elemental or chemical source materials, or certain combinations of both. The features of the coating apparatus may be embodied in replacement source cells for retrofitting in conventional molecular beam and chemical beam epitaxy units.

Solid ink compositions for thermal ink-jet printing having improved printing characteristics

Abstract: Disclosed is an ink-jet composition including an organic carrier that is solid at 25° C. and liquid at the operating temperature of an ink-jet nozzle and a driver having a critical pressure greater than 10 atmospheres, the carrier and driver being miscible in liquid phase. The ink-jet composition is characterized by a viscosity of less than 15 centipoise at 90° C. and a surface tension of between about 20 to about 25 dynes per centimeter at 90° C. The ink-jet compositions disclosed herein are particularly useful in thermal ink-jet printing using thermally induced vapor bubbles to eject ink droplets from the printer and onto a substrate.

Ceramic bonding method

Abstract: A method of coating and bonding a substrate with particles of a ceramic selected from the group consisting of diamond, carbon, graphite, and graphite or carbon-carbon composite, comprising: providing the substrate and at least one of the ceramic particles; selecting at least a carbide-forming substance consisting principally of an element which is other than Ni, Cr, and Co and is capable of forming a carbide to provide a coating material; applying said coating material onto at least one component of the substrate and the at least one ceramic particle; placing the at least one ceramic particle on the substrate; and heating the product of step (D) at a temperature sufficient to form a liquid-diffusion formed, carbide coating on the at least one ceramic particle. The ceramic particles are then coated with strong, adherent, substantially defect-free, and thermomechanically shock resistant metallized layers which are capable of practical uses over 630° C.

Forming via holes in a multilevel substrate in a single step

Abstract: A method for forming via holes in a multilayer structure in a single step. The invention includes disposing over a base a first layer comprising first metal lines beneath a first dielectric, disposing over the first layer a second layer comprising second metal lines beneath a second dielectric such that a portion of each first metal line is not beneath any second metal line, and forming via holes which extend through the second dielectric to the second metal lines and through the second dielectric and the first dielectric to the portions of the first metal lines. Thereafter conductive metal can be deposited in the via holes. The method is particularly well suited for fabricating copper/polymer substrates.

Substrate assembling device

Abstract: PURPOSE: To obtain a device, by which substrates can be pasted together with sealant with no introduction of dust during assembling work. CONSTITUTION: A table 4, which travels between sealant drawing station S 1 and substrate pasting station S 2 , is provided. Further, first substrate 13 is mounted on a stage 5, which travels on the table 4 normal to the travelling direction of the table 4, so as to emit sealant from an emitter, on which a downward directing nozzle tip is provided, and simultaneously move the stage to normal direction in order to draw pattern in S 1 . Second substrate 14 is horizontally hung with suction table 15 in S 2 . By moving the table 4 to S 2 , the first substrate is arranged below the second substrate. Finally, by narrowing the opposing interval between both the substrates, the substrates are pasted together. COPYRIGHT: (C)1993,JPO&Japio

Method of manufacturing micromechanical devices

Abstract: Micromechanical devices are formed on a substrate using a sacrificial layer deep X-ray lithography process to produce a rotating microrotor which is driven magnetically. The rotor typically has a diameter of a few hundred microns or less and is formed as a free structure which is assembled onto a hub formed on a substrate. Stator pole pieces are formed on the substrate of a ferromagnetic material surrounding the rotor, and are al This invention was made with U.S. government support awarded by the National Science Foundationn (NSF), Grant #EET-88-15285. The U.S. government has certain rights in this invention.

Microwave heating structure

Abstract: The structure includes a layer of flexible electroconductive material normally opaque to microwave radiation and having a plurality of apertures therethrough dimensioned to permit microwave energy to pass through to the interior of the foodstuff and to produce thermal energy at the surface of the foodstuff. Both a microwave shielding effect and a combined microwave energy heating and thermal energy heating effect are obtained, enabling close control of the manner and extent of microwave cooking of the foodstuff to be obtained. The plurality of apertures comprises a first plurality of elongate discrete closed-end apertures and a second plurality of continuous apertures, each of which encloses a discrete rectangular island of the electroconductive material. The layer of flexible electroconductive material is supported by and adhered to a substrate layer of microwave energy transparent material in a multiple layer article of manufacture adapted to be formed into a packaging structure in which a foodstuff may be heated by microwave energy to an edible condition.

High speed optical interconnect

Abstract: An optoelectronic package with direct free space optical communication between pairs of optical transmitters and receivers located on different substrate surfaces in a closely spaced stack of chip carrying substrates is disclosed. The transmitters and receivers are aligned so that a light beam from each transmitter follows an optical path toward its respective receiver. In the stack of substrates, the transmitters and receivers are mounted on the surfaces of the substrates, many of which are separated by intervening substrates. These intervening substrates have vias, holes or transparent regions, or other optical means, at locations along the optical paths connecting the transmitters and receivers. Lenses or other concentrating means, where required, are adjacent to a transmitter so that its diverging light is focused on the intended receiver. Substrates are aligned so that the light from transmitters shines through the optical means in intervening substrates to the receivers. Means for removing heat from the substrates are included.

Provision of substrate pillars to maintain chip standoff

Abstract: Pillars are formed on a substrate at the same time as electrical circuit components are formed thereon and of the same materials used to form the circuit, the pillars serving to maintain standoff of an integrated circuit chip during bonding of solder bumps on the chip underside to the formed substrate circuit. The pillars are provided without extra materials and steps, under the existing alignment requirements for providing the circuit components, during the applying of a series of discontinuous layers, e.g., by screen printing, onto the substrate to form the circuit, by also applying portions of the series of layers as stacked layers in spaced island areas to form the pillars at otherwise unused substrate sites.

Liquid crystal display device having a driving circuit inside the seal boundary

Abstract: A liquid crystal display device comprises first and second substrates disposed to face each other, first and second electrodes formed on the both substrates to opposed to each other and forming a display region, signal leads formed on the second substrate and connected to the second electrodes, a seal surrounding the display region between the substrates and connecting together the substrates, a driving circuit provided between outer edges of the display region and those of the seal and connected to the leads, for generating a driving signal and supplying the signal to the wires in response to externally input display data, and a liquid crystal material sealed in a space surrounded by the substrates and seal.

Multiple integrated circuit module which simplifies handling and testing

Abstract: A multi-chip module (26) used to interconnect and house a plurality of integrated circuits (10). The module (26) employs an intermediate structure referred to, herein, as a bridge chip (12). The bridge chip (12) connects the integrated circuit (10) to the module substrate (19). The integrated circuit (10) is attached to the bridge chip (12) and forms a composite structure (18) which can be burned-in and tested as an individual unit. The bridge chip (12) has interconnects to bring out the inputs and outputs of the integrated circuit (10). The composite structure (18) is mounted to the module substrate (19) such that, the integrated circuit (10) has a thermal pathway to the module substrate (19), and the bridge chip (12) connects to the module substrate (19). The module substrate (19) has interconnects to connect the plurality of composite structures (18).

Optical interconnection of circuit packs

Abstract: Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.

LPCVD process for depositing titanium films for semiconductor devices

Abstract: The present invention describes a CVD process to deposit a titanium film at a high deposition rate that has excellent uniformity and step coverage while avoiding gas phase nucleation and coating of the reactor chamber walls. The vapor of a heated liquid titanium source enters a modified, plasma enhanced, cold wall reaction chamber and is mixed with H2 as it reaches a wafer substrate surface. As the gas vapors reach the heated wafer substrate a chemical reaction of TiCl4 +2H2 →Ti+4HCl is triggered, thereby depositing a uniform titanium film upon the substrate surface. The deposition rate is further enhanced by the presence of rf plasma above the substrate's surface.