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Alexandros Margomenos

Researcher at HRL Laboratories

Publications -  72
Citations -  1653

Alexandros Margomenos is an academic researcher from HRL Laboratories. The author has contributed to research in topics: Microstrip & Wafer. The author has an hindex of 18, co-authored 72 publications receiving 1515 citations. Previous affiliations of Alexandros Margomenos include Toyota Motor Engineering & Manufacturing North America & University of Michigan.

Papers
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Journal ArticleDOI

Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications

TL;DR: In this article, the authors report state-of-the-art high frequency performance of GaN-based high electron mobility transistors (HEMTs) and Schottky diodes achieved through innovative device scaling technologies such as vertically scaled enhancement and depletion mode (E/D mode) AlN/GaN/AlGaN double-heterojunction HEMT epitaxial structures.
Journal ArticleDOI

Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects

TL;DR: In this article, the measured and calculated propagation constant of coplanar waveguide (CPW) on low resistivity silicon (1 /spl Omega/spl middot/cm) with a micromachined polyimide interface layer is presented.
Patent

Three dimensional integrated automotive radars and methods of manufacturing the same

TL;DR: In this article, a low-cost, compact radar for adaptively forming beams and independently steering the beams to improve the noise and sensitivity of the radar is presented, which includes a printed circuit board, a low cost multi-layer organic substrate, and a three dimensional (3D) radio frequency (RF) front end that is flood mounted on the substrate.
Proceedings ArticleDOI

92–96 GHz GaN power amplifiers

TL;DR: In this article, the authors report the test results of a family of 92-96 GHz GaN power amplifiers (PA) with increasing gate peripheries (150 µm to 1200 µm).
Journal ArticleDOI

Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS

TL;DR: In this article, a hermetic silicon micromachined on-wafer dc-to-40 GHz packaging scheme for RF microelectromechanical systems (MEMS) switches is presented.