International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Wave propagation and group velocity

By L I Sedov London: Cleaver-Hume Press Ltd Pp xvi + 363 Price 105s This is really two separate books within the same pair of covers First of all Chapters 1-3, some 145 pages, are devoted to the discussion of similarity and dimensional, methods and their application to a variety of problems in mechanics and fluid mechanics

http://iopscience.iop.org/article/10.1088/0031-9112/11/6/008/pdf

Similarity and Dimensional Methods in Mechanics

Vorlesungen uber theoretische Physik Von Prof. Arnold Sommerfeld. Band 1: Mechanik. Vierte, neubearbeitete Auflage. Pp. xii + 276. 18 D. marks. Band 2: Mechanik der deformierbaren Medien. Pp. xv + 376 + 4 plates. 18 D. marks. Band 3: Elektrodynamik. Pp. xvi + 368. 18 D. marks. Band 6: Partielle Differentialgleichungen der Physik. Pp. xiii + 332. 18 D. marks. (Wiesbaden: Dieterich'sche Verlagsbuchhandlung, 1947–1949.)

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Lectures on Theoretical Physics

A new prototype triboelectric nanogenerator with superhydrophobic and self-cleaning features is invented to harvest water drop energy based on a sequential contact electrification and electrostatic induction process. Because of the easy-fabrication, cost-effectiveness, and robust properties, the developed triboelectric nanogenerator expands the potential applications to harvesting energy from household wastewater and raindrops.

Harvesting Water Drop Energy by a Sequential Contact-Electrification and Electrostatic-Induction Process

A distributed behavioral model of two-level 1:n (1-input and n-outputs) asymmetrical interconnect tree network is explored Based on circuit approach, theoretic analysis illustrating the mechanism of the underlying model extraction is described The asymmetrical tree model is yielded from an innovative single input multiple output/single input single output (SIMO/SISO) transform For predicting the signal responses each outbranch of the tree, the voltage transfer function (VTF) corresponding to any electrical path from the input to the output node under interest is mathematically expressed To verify the relevance of the behavioral method proposed, 1:3 asymmetrical two-level distributed tree network was designed in microstrip planar circuit Then, numerical validations were performed both in the frequency- and time-domains It was pointed out that good accordance between the VTF frequency responses of tested tree signal paths from DC to 4GHz was confirmed The behavioral two-level model developed is benefited not only in term of simplicity and computation speed but also to its flexibility to complex shape of asymmetrical interconnect trees The model could be useful for the high-speed electronic circuit manufacturers for predicting the signal integrity through interconnect PCB trees

Distributed model of two-level asymmetrical PCB interconnect tree

Facing to the incessant increase of data processing speed, the microelectronic interconnections play an important role during the design of the integrated system. As the interconnection signal delays dominate widely gate delays, accurate interconnection model is needed. Indeed, direct mathematical calculation of distributed interconnection transient responses is generally very complicated. For this reason, one proposes to develop a numerical modeling method of prediction of the signal integrity (SI) propagating though the distributed interconnection lines. For that, the microelectronic interconnect lines are assumed as comprised of periodical lumped L-cells cascaded. Via L-cell transfer matrix analysis, it is established how to determine the equivalent global transfer function versus the lumped cell element number n. To verify the relevance of developed model, RC-line with mm-length excited by square-wave-pulse with 10 Gbits/s rate was investigated in function of n and the interconnect line per unit length parameters. As results, transient responses perfectly well-correlated to the SPICE-computations were found with relative errors lower than 5% for n higher than 20. In addition, values of propagation delays and signal attenuations closed to SPICE-models were evidenced for various interconnection network parameters. The computation-time for the execution of the proposed method algorithm was only of tens µs.

Numerical modeling of high-speed microelectronic interconnects for the signal integrity analysis

A signal integrity (SI) analysis of high voltage rectangular short pulses for the atom- probe system is explored in this paper. The operated RF transient pulse is considered for exciting on material sample inside an ultra-high vacuum (UHV) cryogenic chamber. The ns- duration pulse signal is injected into the cryogenic analysis chamber through the transmitting system mainly constituted by a microstrip interconnect line ended by optical controlled nonlinear load. The whole system frequency characterization is performed based on the S- parameter measurements. As expected, a challenging ultra-short rectangular shape pulse is exhibited by the pulser. Promising experimental results with the improvement of ion mass spectrum is demonstrated with the designed RF pulser.

http://iopscience.iop.org/article/10.1088/1757-899X/120/1/012006/pdf

RF Pulse Signal Integrity Analysis for Nonlinear Ended Microstrip Line Atom-Probe Tomography

Analytical modeling of H‐shape distributed topology with bandpass negative group delay behavior

The via ground (GND) structure constitutes one of the most useful elements for designing high performance printed circuit boards (PCBs). The electrical interconnections with vias become key regular solutions for the implementation of various electronic functions. However, so far, the vias are never being used for designing negative group delay (NGD) circuit. To answer this curious question, an original study on the design feasibility of low-pass NGD function with via ground is introduced in the present paper. After the topological description, the NGD analysis in function of the via parameters is established. The design equations allowing to synthesize the via in function of NGD function specifications are formulated. The developed NGD theory is verified with comparisons between calculations and simulations with a commercial tool. As expected, NGD value in order of hundred-picoseconds over hundred-megahertz cut-off frequencies is obtained with good agreement between the theoretical model and simulation. Furthermore, time domain analyses confirm that the via NGD structure enables to generate output signals in time-advance of arbitrary waveform input signals presenting limited bandwidth.

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Blaise Ravelo

Papers

Distributed model of two-level asymmetrical PCB interconnect tree

Numerical modeling of high-speed microelectronic interconnects for the signal integrity analysis

RF Pulse Signal Integrity Analysis for Nonlinear Ended Microstrip Line Atom-Probe Tomography

Analytical modeling of H‐shape distributed topology with bandpass negative group delay behavior

Innovative Theory of Low-Pass NGD via-Hole-Ground Circuit