Journal ArticleDOI
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
Abstract:
The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints were examined. A clear dependence of the thermomechanical fatigue response of these solder joints on Sn grain orientation was observed (Sn has a body centered tetragonal crystal structure). Fabricated joints tend to have three orientations in a cyclic twin relationship, but among the population of solder balls, this orientation triplet appears to be randomly oriented. In thermally cycled joints, solder balls with dominant Sn grains having the particular orientation with the c-axis nearly parallel to the plane of the substrate were observed to fail before neighboring balls with different orientations. This results from the fact that the coefficient of thermal expansion of Sn in the basal plane (along the alpha-axis) is half the value along the c-axis; joints observed to be damaged had the maximum coefficient of thermal expansion mismatch between solder and substrate at the joint interface, as well as a tensile stress modes during the hot part of the thermal cycle. Localized recrystallization was observed in regions of maximum strain caused by differential expansion conditions, and its connection with crack nucleation is discussed.read more
Citations
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Journal ArticleDOI
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
TL;DR: The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability, and the level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements.
Journal ArticleDOI
The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints
Thomas R. Bieler,Bite Zhou,Lauren Blair,A. Zamiri,Payam Darbandi,Farhang Pourboghrat,Tae-Kyu Lee,Kuo Chuan Liu +7 more
TL;DR: In this paper, a low-stress plastic ball grid array (PBGA) package design at different stages of cycling history is compared with preliminary experiments using higher-stress package designs.
Journal ArticleDOI
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
TL;DR: In this article, the recrystallization behavior of Sn-Ag-Cu solder joints was examined in three different TMF conditions for five different ball grid array component designs, and a TMF damage accumulation model was proposed.
Journal ArticleDOI
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
TL;DR: In this paper, the authors provide a review on the properties of intermetallic compounds formed between Sn-based solders and Cu substrates during the packaging of integrated circuits (ICs), with a focus on identification of crystal structure and possible phase transformations of Cu 6 Sn 5 in real solder joints.
Proceedings ArticleDOI
Characterization of aging effects in lead free solder joints using nanoindentation
Mohammad Hasnine,Muhannad Mustafa,Jeffrey C. Suhling,Barton C. Prorok,Michael J. Bozack,Pradeep Lall +5 more
TL;DR: In this paper, a nano-mechanical testing of single SAC305 lead free solder joints extracted from PBGA assemblies has been performed using polarized light microscopy and electron back scattered diffraction (EBSD) techniques.
References
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TL;DR: In this paper, the authors present data on the elastic properties of single crystals collected from the literature through mid-1970 and the elastic property of isotropic aggregates which are calculated according to the schemes of Voigt and Reuss for all materials, and Hashin and Shtrikman for materials with cubic symmetry.
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Current issues in recrystallization: a review
Roger D. Doherty,D.A. Hughes,F.J. Humphreys,John J. Jonas,D. Juul Jensen,Michael E. Kassner,Wayne E. King,Terry R. McNelley,H.J. McQueen,Anthony D. Rollett +9 more
TL;DR: The current understanding of the fundamentals of recrystallization is summarized in this paper, which includes understanding the as-deformed state, nucleation and growth, the development of misorientation during deformation, continuous, dynamic, and geometric dynamic recystallization, particle effects, and texture.
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TL;DR: A comprehensive source of information on metallographic techniques and their application to the study of metals, ceramics and polymers, this work is thoroughly referenced and well-illustrated with an extensive collection of micrographs and macrographs as discussed by the authors.