We present a comprehensive and up-to-date compilation of band parameters for all of the nitrogen-containing III–V semiconductors that have been investigated to date. The two main classes are: (1) “conventional” nitrides (wurtzite and zinc-blende GaN, InN, and AlN, along with their alloys) and (2) “dilute” nitrides (zinc-blende ternaries and quaternaries in which a relatively small fraction of N is added to a host III–V material, e.g., GaAsN and GaInAsN). As in our more general review of III–V semiconductor band parameters [I. Vurgaftman et al., J. Appl. Phys. 89, 5815 (2001)], complete and consistent parameter sets are recommended on the basis of a thorough and critical review of the existing literature. We tabulate the direct and indirect energy gaps, spin-orbit and crystal-field splittings, alloy bowing parameters, electron and hole effective masses, deformation potentials, elastic constants, piezoelectric and spontaneous polarization coefficients, as well as heterostructure band offsets. Temperature an...

Band parameters for nitrogen-containing semiconductors

In the past several years, research in each of the wide‐band‐gap semiconductors, SiC, GaN, and ZnSe, has led to major advances which now make them viable for device applications. The merits of each contender for high‐temperature electronics and short‐wavelength optical applications are compared. The outstanding thermal and chemical stability of SiC and GaN should enable them to operate at high temperatures and in hostile environments, and also make them attractive for high‐power operation. The present advanced stage of development of SiC substrates and metal‐oxide‐semiconductor technology makes SiC the leading contender for high‐temperature and high‐power applications if ohmic contacts and interface‐state densities can be further improved. GaN, despite fundamentally superior electronic properties and better ohmic contact resistances, must overcome the lack of an ideal substrate material and a relatively advanced SiC infrastructure in order to compete in electronics applications. Prototype transistors have been fabricated from both SiC and GaN, and the microwave characteristics and high‐temperature performance of SiC transistors have been studied. For optical emitters and detectors, ZnSe, SiC, and GaN all have demonstrated operation in the green, blue, or ultraviolet (UV) spectra. Blue SiC light‐emitting diodes (LEDs) have been on the market for several years, joined recently by UV and blue GaN‐based LEDs. These products should find wide use in full color display and other technologies. Promising prototype UV photodetectors have been fabricated from both SiC and GaN. In laser development, ZnSe leads the way with more sophisticated designs having further improved performance being rapidly demonstrated. If the low damage threshold of ZnSe continues to limit practical laser applications, GaN appears poised to become the semiconductor of choice for short‐wavelength lasers in optical memory and other applications. For further development of these materials to be realized, doping densities (especially p type) and ohmic contact technologies have to be improved. Economies of scale need to be realized through the development of larger SiC substrates. Improved substrate materials, ideally GaN itself, need to be aggressively pursued to further develop the GaN‐based material system and enable the fabrication of lasers. ZnSe material quality is already outstanding and now researchers must focus their attention on addressing the short lifetimes of ZnSe‐based lasers to determine whether the material is sufficiently durable for practical laser applications. The problems related to these three wide‐band‐gap semiconductor systems have moved away from materials science toward the device arena, where their technological development can rapidly be brought to maturity.

Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

Spontaneous generation of complex order in apparently simple systems is both arresting and potentially useful1,2,3,4,5,6,7,8,9,10,11. Here we describe the appearance of complex, ordered structures induced by the buckling of thin metal films owing to thermal contraction of an underlying substrate. We deposit the films from the vapour phase on a thermally expanded polymer (polydimethylsiloxane, PDMS). Subsequent cooling of the polymer creates compressive stress in the metal film that is relieved by buckling with a uniform wavelength of 20–50 micrometres. The waves can be controlled and orientated by relief structures in the surface of the polymer, which can set up intricate, ordered patterns over large areas. We can account qualitatively for the size and form of the patterned features in terms of the non-uniform stresses developed in the film near steps on the polymer substrate. This patterning process may find applications in optical devices such as diffraction gratings and optical sensors, and as the basis for methods of strain analysis in materials.

Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer

Magnetron sputtering: a review of recent developments and applications

Atomic-scale control and manipulation of the microstructure of polycrystalline thin films during kinetically limited low-temperature deposition, crucial for a broad range of industrial applications, has been a leading goal of materials science during the past decades. Here, we review the present understanding of film growth processes—nucleation, coalescence, competitive grain growth, and recrystallization—and their role in microstructural evolution as a function of deposition variables including temperature, the presence of reactive species, and the use of low-energy ion irradiation during growth.

Microstructural evolution during film growth

Structure and properties of TiN coatings

Metastable single‐phase, NaCl‐structure, polycrystalline Ti0.5Al0.5N alloy films have been shown to exhibit much better high‐temperature (750–900 °C) oxidation resistance than polycrystalline TiN films grown under similar conditions. The Ti0.5Al0.5N alloys, ≂3 μm thick, were deposited at temperatures between 400 and 500 °C on stainless‐steel substrates by dc magnetron sputter deposition in mixed Ar+N2 discharges with an applied negative substrate bias Vs of either 0 or 150 V. Oxidation in pure O2 initially occurred at a rate that varied parabolically with time. The oxide overlayers consisted of two partially crystalline sublayers, the upper one Al‐rich and the lower one Ti‐rich, with no measurable N concentrations in either. Inert‐marker transport experiments showed that oxidation proceeded by the simultaneous outward diffusion of Al to the oxide/vapor interface and inward diffusion of O to the oxide/nitride interface. The oxidation rate constant K increased with oxidation temperature Tox at a rate much h...

Oxidation of metastable single‐phase polycrystalline Ti0.5Al0.5N films: Kinetics and mechanisms

The preferred orientation of polycrystalline TiN films grown by ultrahigh‐vacuum reactive‐magnetron sputter deposition on amorphous SiO2 at 350 °C in pure N2 discharges was controllably varied from (111) to completely (002) by varying the incident ion/metal flux ratio Ji/JTi from 1 to ≥5 with the N+2 ion energy Ei maintained constant at ≂20 eV (≂10 eV per incident accelerated N). All samples were slightly over‐stoichiometric with N/Ti=1.02±0.03. Films deposited with Ji/JTi=1 initially exhibit a mixed texture with competitive columnar growth which slowly evolves into a nearly complete (111) texture at film thicknesses greater than 1 μm. However, films grown with Ji/JTi≥5 exhibit an essentially complete (002) preferred orientation from the earliest observable stages. The normalized XRD (002) intensity ratio in thick layers increased from ≂0 to 1 as Ji/JTi was varied from 1 to ≥5. Both (111) and (001) interplanar spacings remained constant as a function of film thickness yielding a lattice constant of 0.4240...

Development of preferred orientation in polycrystalline TiN layers grown by ultrahigh vacuum reactive magnetron sputtering

Mechanisms of reactive sputtering of titanium nitride and titanium carbide II: Morphology and structure

The mechanical properties of (001)‐, (011)‐, and (111)‐oriented MgO wafers and 1‐μm‐thick TiN overlayers, grown simultaneously by dc magnetron sputter deposition at 700 °C in a mixed N2 and Ar discharge, were investigated using nanoindentation. A combination of x‐ray‐diffraction (XRD) pole figures, high‐resolution XRD analyses, and Auger electron spectroscopy was used to show that all TiN films were single crystals with N/Ti ratios of 1.0±0.05. The nanoindentation measurements were carried out using a three‐sided pyramidal Berkovich diamond indentor tip operated at loads ranging from 0.4 to 40 mN. All three orientations of MgO substrates, as‐received, exhibited identical hardness values as determined using the Oliver and Pharr method. After a 1 h anneal at 800 °C, corresponding to the thermal treatment received prior to film growth, the measured hardness of MgO(001) was 9.0±0.3 GPa. All TiN films displayed a completely elastic response at low loads. Measured hardness values, which decreased with increasin...

J.-E. Sundgren

Papers

Structure and properties of TiN coatings

Oxidation of metastable single‐phase polycrystalline Ti0.5Al0.5N films: Kinetics and mechanisms

Development of preferred orientation in polycrystalline TiN layers grown by ultrahigh vacuum reactive magnetron sputtering

Mechanisms of reactive sputtering of titanium nitride and titanium carbide II: Morphology and structure

Nanoindentation studies of single‐crystal (001)‐, (011)‐, and (111)‐oriented TiN layers on MgO