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John W. Hutchinson

Researcher at Harvard University

Publications -  460
Citations -  80021

John W. Hutchinson is an academic researcher from Harvard University. The author has contributed to research in topics: Fracture mechanics & Plasticity. The author has an hindex of 129, co-authored 419 publications receiving 74747 citations. Previous affiliations of John W. Hutchinson include Technical University of Denmark & Ohio State University.

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Crack patterns in thin films

TL;DR: In this article, a two-dimensional model of a film bonded to an elastic substrate is proposed for simulating crack propagation paths in thin elastic films and the existence of spiral paths is demonstrated.
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Preliminary assessment of sandwich plates subject to blast loads

TL;DR: In this paper, the authors investigated whether metal sandwich plates with sufficiently strong cores are able to sustain substantially larger blast loads than monolithic solid plates of the same material and total mass, and demonstrated the potential for superior strength and energy absorbing capacity of the sandwich plates compared with solid plates having the same mass.
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Effects of non-planarity on the mixed mode fracture resistance of bimaterial interfaces

TL;DR: In this paper, the effects of non-planarity on the fracture resistance locus of interfaces has been investigated using a simple model of contacting facets along the crack surface, which resist the motion of the crack surfaces by means of friction and locking and thereby modify the energy release rate at the crack front.
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Model for the robust mechanical behavior of nacre

TL;DR: In this article, a model for the inelastic behavior, measured in tension, along the axis of the aragonite plates was developed, based on observations for abalone nacre that the deformation is associated with periodic dilatation bands.
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Mechanics-based scaling laws for the durability of thermal barrier coatings

TL;DR: In this paper, the basic scaling relations are identified and used to gain some understanding of the relative importance of the various mechanisms that arise for application scenarios with minimal thermal cycling, based on stresses that develop because of TGO growth strains in combination with thermal expansion misfit.