다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Freedom of design, mass customisation, waste minimisation and the ability to manufacture complex structures, as well as fast prototyping, are the main benefits of additive manufacturing (AM) or 3D printing. A comprehensive review of the main 3D printing methods, materials and their development in trending applications was carried out. In particular, the revolutionary applications of AM in biomedical, aerospace, buildings and protective structures were discussed. The current state of materials development, including metal alloys, polymer composites, ceramics and concrete, was presented. In addition, this paper discussed the main processing challenges with void formation, anisotropic behaviour, the limitation of computer design and layer-by-layer appearance. Overall, this paper gives an overview of 3D printing, including a survey on its benefits and drawbacks as a benchmark for future research and development.

Additive manufacturing (3D printing): A review of materials, methods, applications and challenges

Recent advances in mechanics and materials provide routes to integrated circuits that can offer the electrical properties of conventional, rigid wafer-based technologies but with the ability to be stretched, compressed, twisted, bent, and deformed into arbitrary shapes. Inorganic and organic electronic materials in microstructured and nanostructured forms, intimately integrated with elastomeric substrates, offer particularly attractive characteristics, with realistic pathways to sophisticated embodiments. Here, we review these strategies and describe applications of them in systems ranging from electronic eyeball cameras to deformable light-emitting displays. We conclude with some perspectives on routes to commercialization, new device opportunities, and remaining challenges for research.

http://science.sciencemag.org/content/sci/327/5973/1603.full.pdf

Materials and mechanics for stretchable electronics

Publisher Summary This chapter describes the mixed mode cracking in layered materials. There is ample experimental evidence that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip. An unloaded crack subsequently subject to a combination of modes I and II will initiate growth by kinking in such a direction that the advancing tip is in mode I. The chapter also elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness. The competition between crack advance within the interface and kinking out of the interface depends on the relative toughness of the interface to that of the adjoining material. The interface stress intensity factors play precisely the same role as their counterparts in elastic fracture mechanics for homogeneous, isotropic solids. When an interface between a bimaterial system is actually a very thin layer of a third phase, the details of the cracking morphology in the thin interface layer can also play a role in determining the mixed mode toughness. The elasticity solutions for cracks in multilayers are also elaborated.

Mixed mode cracking in layered materials

The residual stress state due to a spherical hard-body impact

Performance of sandwich plates with truss cores

We investigate the dynamics of fracture in drying films of colloidal silica. Water loss quenches the nanoparticle dispersions to form a liquid-saturated elastic network of particles that relieves drying-induced strain by cracking. These cracks display intriguing intermittent motion originating from the deformation of arrested crack tips and aging of the elastic network. The dynamics of a single crack exhibits a universal evolution, described by a balance of the driving elastic power with the sum of interfacial power and the viscous dissipation rate of flowing interstitial fluid.

https://weitzlab.seas.harvard.edu/files/weitzlab/files/2006_langmuir_dufresne.pdf

Dynamics of Fracture in Drying Suspensions

Crossing-over is a central feature of meiosis. Meiotic crossover (CO) sites are spatially patterned along chromosomes. CO-designation at one position disfavors subsequent CO-designation(s) nearby, as described by the classical phenomenon of CO interference. If multiple designations occur, COs tend to be evenly spaced. We have previously proposed a mechanical model by which CO patterning could occur. The central feature of a mechanical mechanism is that communication along the chromosomes, as required for CO interference, can occur by redistribution of mechanical stress. Here we further explore the nature of the beam-film model, its ability to quantitatively explain CO patterns in detail in several organisms, and its implications for three important patterning-related phenomena: CO homeostasis, the fact that the level of zero-CO bivalents can be low (the “obligatory CO”), and the occurrence of non-interfering COs. Relationships to other models are discussed.

/pdf/crossover-patterning-by-the-beam-film-model-analysis-and-4zkdht5uf2.pdf

John W. Hutchinson

Papers

The residual stress state due to a spherical hard-body impact

Performance of sandwich plates with truss cores

Dynamics of Fracture in Drying Suspensions

Crossover patterning by the beam-film model: analysis and implications.

Mixed mode fracture mechanics of interfaces