Substantial developments have been achieved in the synthesis of chemical vapour deposition (CVD) diamond in recent years, providing engineers and designers with access to a large range of new diamond materials. CVD diamond has a number of outstanding material properties that can enable exceptional performance in applications as diverse as medical diagnostics, water treatment, radiation detection, high power electronics, consumer audio, magnetometry and novel lasers. Often the material is synthesized in planar form; however, non-planar geometries are also possible and enable a number of key applications. This paper reviews the material properties and characteristics of single crystal and polycrystalline CVD diamond, and how these can be utilized, focusing particularly on optics, electronics and electrochemistry. It also summarizes how CVD diamond can be tailored for specific applications, on the basis of the ability to synthesize a consistent and engineered high performance product.

https://iopscience.iop.org/article/10.1088/0953-8984/21/36/364221/pdf

Chemical vapour deposition synthetic diamond: materials, technology and applications.

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics with capabilities beyond existing technologies due to its large bandgap, controllable doping, and the availability of large diameter, relatively inexpensive substrates. These applications include power conditioning systems, including pulsed power for avionics and electric ships, solid-state drivers for heavy electric motors, and advanced power management and control electronics. Wide bandgap (WBG) power devices offer potential savings in both energy and cost. However, converters powered by WBG devices require innovation at all levels, entailing changes to system design, circuit architecture, qualification metrics, and even market models. The performance of high voltage rectifiers and enhancement-mode metal-oxide field effect transistors benefits from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. Reverse breakdown voltages of over 2 kV for β-Ga2O3 have been reported, either with or without edge termination and over 3 kV for a lateral field-plated Ga2O3 Schottky diode on sapphire. The metal-oxide-semiconductor field-effect transistors fabricated on Ga2O3 to date have predominantly been depletion (d-mode) devices, with a few demonstrations of enhancement (e-mode) operation. While these results are promising, what are the limitations of this technology and what needs to occur for it to play a role alongside the more mature SiC and GaN power device technologies? The low thermal conductivity might be mitigated by transferring devices to another substrate or thinning down the substrate and using a heatsink as well as top-side heat extraction. We give a perspective on the materials’ properties and physics of transport, thermal conduction, doping capabilities, and device design that summarizes the current limitations and future areas of development. A key requirement is continued interest from military electronics development agencies. The history of the power electronics device field has shown that new technologies appear roughly every 10-12 years, with a cycle of performance evolution and optimization. The older technologies, however, survive long into the marketplace, for various reasons. Ga2O3 may supplement SiC and GaN, but is not expected to replace them.

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Perspective: Ga2O3 for ultra-high power rectifiers and MOSFETS

The direct current characteristics of AlGaN/GaN double-channel HEMTs (DC-HEMTs) are investigated by using 2-D numerical simulations. The output characteristics have been predicted with the drift-diffusion, thermodynamic, hydrodynamic, and hot-electron models, respectively. The prediction by the hydrodynamic model is in good agreement with the experiment. It is demonstrated that the hot-electron effect makes a negligible contribution to the negative differential conductance (NDC) of an AlGaN/GaN DC-HEMT; instead, the NDC effect is caused by the self-heating effect. The transfer and transconductance characteristics of an AlGaN/GaN DC-HEMT are also discussed in detail. Finally, a new In0.18Al0.82N /GaN/AlGaN/GaN DC-HEMT structure is proposed for optimizing AlGaN/GaN DC-HEMTs.

The Study of Self-Heating and Hot-Electron Effects for AlGaN/GaN Double-Channel HEMTs

GaN high electron mobility transistors (HEMTs) are well suited for high-frequency operation due to their lower on resistance and device capacitance compared with traditional silicon devices. When grown on silicon carbide, GaN HEMTs can also achieve very high power density due to the enhanced power handling capabilities of the substrate. As a result, GaN-on-SiC HEMTs are increasingly popular in radio-frequency power amplifiers, and applications as switches in high-frequency power electronics are of high interest. This paper explores the use of GaN-on-SiC HEMTs in conventional pulse-width modulated switched-mode power converters targeting switching frequencies in the tens of megahertz range. Device sizing and efficiency limits of this technology are analyzed, and design principles and guidelines are given to exploit the capabilities of the devices. The results are presented for discrete-device and integrated implementations of a synchronous Buck converter, providing more than 10-W output power supplied from up to 40 V with efficiencies greater than 95% when operated at 10 MHz, and greater than 90% at switching frequencies up to 40 MHz. As a practical application of this technology, the converter is used to accurately track a 3-MHz bandwidth communication envelope signal with 92% efficiency.

High-Frequency PWM Buck Converters Using GaN-on-SiC HEMTs

Formation and characterization of 4-inch GaN-on-diamond substrates

The performance of AlGaN/GaN high-electron-mobility transistors (HEMTs) on diamond and SiC substrates is examined. We demonstrate GaN-on-diamond transistors with periphery WG = 250 mum, exhibiting ft = 27.4 GHz and yielding a power density of 2.79 W/mm at 10 GHz. Additionally, the temperature rise in similar devices on diamond and SiC substrates is reported. To the best of our knowledge, these represent the highest frequency of operation and first-reported thermal and X -band power measurements of GaN-on-diamond HEMTs.

Comparison of GaN HEMTs on Diamond and SiC Substrates

The performance of an AlGaN/GaN high electron mobility transistor (HEMT) on diamond substrate is reported. Presented is a device with a gate footprint LG=40 nm and a periphery WG=100 µm that exhibits fT=85 GHz and fmax=95 GHz. It is believed that this represents the best frequency performance of a GaN-on-diamond HEMT.

Frequency performance enhancement of AlGaN/GaN HEMTs on diamond

A wafer-scale comparison of HEMTs fabricated on as-grown GaN/Si and HEMTs fabricated in parallel on epitaxial layers from the GaN/Si growth integrated with a diamond substrate are presented. Diamond, which offers the highest room-temperature thermal conductivity of any bulk material, is being evaluated as a solution for thermal limitations observed in GaN-based devices. This paper will present electrical and thermal data collected at the wafer scale demonstrating the improvement realized by integration of a high-thermal-conductivity substrate. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

Wafer-scale GaN HEMT performance enhancement by diamond substrate integration

We describe the development and issues related to fabrication, die processing, and packaging GaN-on-diamond high-electron mobility transistors into X-band amplifier modules. We perform thermal resistance measurements on these amplifiers using liquid-crystal thermography and show that they agree with theory and previously published measurements on GaN-on-diamond devices.

Jonathan Felbinger

Papers

Comparison of GaN HEMTs on Diamond and SiC Substrates

Comparison of GaN HEMTs on Diamond and SiC Substrates

Frequency performance enhancement of AlGaN/GaN HEMTs on diamond

Wafer-scale GaN HEMT performance enhancement by diamond substrate integration

GaN-on-diamond field-effect transistors: from wafers to amplifier modules