Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

A review of Ga2O3 materials, processing, and devices

J. Y. Tsao,* S. Chowdhury, M. A. Hollis,* D. Jena, N. M. Johnson, K. A. Jones, R. J. Kaplar,* S. Rajan, C. G. Van de Walle, E. Bellotti, C. L. Chua, R. Collazo, M. E. Coltrin, J. A. Cooper, K. R. Evans, S. Graham, T. A. Grotjohn, E. R. Heller, M. Higashiwaki, M. S. Islam, P. W. Juodawlkis, M. A. Khan, A. D. Koehler, J. H. Leach, U. K. Mishra, R. J. Nemanich, R. C. N. Pilawa-Podgurski, J. B. Shealy, Z. Sitar, M. J. Tadjer, A. F. Witulski, M. Wraback, and J. A. Simmons

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Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges

Substantial developments have been achieved in the synthesis of chemical vapour deposition (CVD) diamond in recent years, providing engineers and designers with access to a large range of new diamond materials. CVD diamond has a number of outstanding material properties that can enable exceptional performance in applications as diverse as medical diagnostics, water treatment, radiation detection, high power electronics, consumer audio, magnetometry and novel lasers. Often the material is synthesized in planar form; however, non-planar geometries are also possible and enable a number of key applications. This paper reviews the material properties and characteristics of single crystal and polycrystalline CVD diamond, and how these can be utilized, focusing particularly on optics, electronics and electrochemistry. It also summarizes how CVD diamond can be tailored for specific applications, on the basis of the ability to synthesize a consistent and engineered high performance product.

https://iopscience.iop.org/article/10.1088/0953-8984/21/36/364221/pdf

Chemical vapour deposition synthetic diamond: materials, technology and applications.

Two layers of protection films are formed such that a sheet resistance at a portion directly below the protection film is higher than that at a portion directly below the protection film. The protection films are formed, for example, of SiN film, as insulating films. The protection film is formed to be higher, for instance, in hydrogen concentration than the protection film so that the protection film is higher in refractive index the protection film. The protection film is formed to cover a gate electrode and extend to the vicinity of the gate electrode on an electron supplying layer. The protection film is formed on the entire surface to cover the protection film. According to this configuration, the gate leakage is significantly reduced by a relatively simple configuration to realize a highly-reliable compound semiconductor device achieving high voltage operation, high withstand voltage, and high output.

Compound semiconductor device and method of manufacturing the same

GaN high electron mobility transistors (HEMTs) are well suited for high-frequency operation due to their lower on resistance and device capacitance compared with traditional silicon devices. When grown on silicon carbide, GaN HEMTs can also achieve very high power density due to the enhanced power handling capabilities of the substrate. As a result, GaN-on-SiC HEMTs are increasingly popular in radio-frequency power amplifiers, and applications as switches in high-frequency power electronics are of high interest. This paper explores the use of GaN-on-SiC HEMTs in conventional pulse-width modulated switched-mode power converters targeting switching frequencies in the tens of megahertz range. Device sizing and efficiency limits of this technology are analyzed, and design principles and guidelines are given to exploit the capabilities of the devices. The results are presented for discrete-device and integrated implementations of a synchronous Buck converter, providing more than 10-W output power supplied from up to 40 V with efficiencies greater than 95% when operated at 10 MHz, and greater than 90% at switching frequencies up to 40 MHz. As a practical application of this technology, the converter is used to accurately track a 3-MHz bandwidth communication envelope signal with 92% efficiency.

High-Frequency PWM Buck Converters Using GaN-on-SiC HEMTs

The performance of AlGaN/GaN high-electron-mobility transistors (HEMTs) on diamond and SiC substrates is examined. We demonstrate GaN-on-diamond transistors with periphery WG = 250 mum, exhibiting ft = 27.4 GHz and yielding a power density of 2.79 W/mm at 10 GHz. Additionally, the temperature rise in similar devices on diamond and SiC substrates is reported. To the best of our knowledge, these represent the highest frequency of operation and first-reported thermal and X -band power measurements of GaN-on-diamond HEMTs.

Comparison of GaN HEMTs on Diamond and SiC Substrates

We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on ~ 130-?m-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured fT ·LG product of 12.5 GHz ·?m is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties.

Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

This letter is a first report on the operation of AlGaN/GaN high-electron mobility transistors (HEMTs) atomically attached to a CVD diamond substrate. This technology demonstration shows the feasibility of producing GaN based devices on polycrystalline CVD diamond substrates to maximize heat extraction from devices operating at high power by situating the diamond substrates in the immediate proximity of the transistor channel. Such an approach offers tremendous opportunity for efficient and effective heat management of high power devices. We demonstrate the ability to preserve the electrical properties of Al-GaN/GaN HEMTs throughout the GaN-on-diamond atomic attachment process and report on the fabricated DC and small-signal HEMT characteristics.

AlGaN/GaN HEMT on Diamond Technology Demonstration

The performance of an AlGaN/GaN high electron mobility transistor (HEMT) on diamond substrate is reported. Presented is a device with a gate footprint LG=40 nm and a periphery WG=100 µm that exhibits fT=85 GHz and fmax=95 GHz. It is believed that this represents the best frequency performance of a GaN-on-diamond HEMT.

J. Wasserbauer

Papers

Comparison of GaN HEMTs on Diamond and SiC Substrates

Comparison of GaN HEMTs on Diamond and SiC Substrates

Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

AlGaN/GaN HEMT on Diamond Technology Demonstration

Frequency performance enhancement of AlGaN/GaN HEMTs on diamond