Kiyeong Kim

TL;DR: The modeling work shows that plane-wave theory for metal shielding is also applicable to graphene and suggests the feasibility of manufacturing an ultrathin, transparent, and flexible EMI shield by single or few-layer graphene.

TL;DR: In this paper, a TSV noise coupling model is proposed based on a three-dimensional transmission line matrix method (3D-TLM) and a noise isolation technique using a guard ring structure is proposed.

TL;DR: In this article, a power/ground (P/G) TSV array model based on separated P/G TSV and chip-PDN models at frequencies up to 20 GHz is proposed for estimating the PDN impedances of 3D TSV ICs.

TL;DR: In this paper, a new modeling method for estimating the impedance properties in a chip-package hierarchical power distribution network (PDN) is proposed, which decomposes the chip package hierarchical PDN into several structures, independently calculate the decomposed structures, and extract the whole structure's impedance by using a segmentation method.

TL;DR: In this article, a single-ended high-speed through-silicon via (TSV) channel is measured and analyzed in the frequency-domain and the time-domain, and two types of test vehicles are fabricated, consisting of TSVs and interposers.