P
Puqi Ning
Researcher at Chinese Academy of Sciences
Publications - 104
Citations - 2605
Puqi Ning is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Power module & Insulated-gate bipolar transistor. The author has an hindex of 23, co-authored 104 publications receiving 2285 citations. Previous affiliations of Puqi Ning include National Transportation Research Center & Oak Ridge National Laboratory.
Papers
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Journal ArticleDOI
A High Power Density Single-Phase PWM Rectifier With Active Ripple Energy Storage
TL;DR: In this paper, the minimum ripple energy storage requirement is derived independently of a specific topology, and the feasibility of the active capacitor's reduction schemes is verified based on the minimum energy requirement, which can effectively reduce the energy storage capacitance.
Proceedings ArticleDOI
A high power density single phase PWM rectifier with active ripple energy storage
TL;DR: In this paper, the authors proposed an active ripple energy storage method that can effectively reduce the energy storage capacitance, and the feed-forward control method and design considerations are provided.
Proceedings ArticleDOI
Study of Energy Storage Capacitor Reduction for Single Phase PWM Rectifier
TL;DR: In this article, the minimum ripple energy storage requirement is derived independent of a specific topology, and the feasibility of the active capacitor's reduction schemes is verified by simulation and experimental results.
Journal ArticleDOI
A High-Temperature SiC Three-Phase AC - DC Converter Design for > 100/spl deg/C Ambient Temperature
Ruxi Wang,Dushan Boroyevich,Puqi Ning,Zhiqiang Wang,Fei Wang,Paolo Mattavelli,Khai D. T. Ngo,Kaushik Rajashekara +7 more
TL;DR: In this article, a detailed design process for an HT SiC three-phase PWM rectifier that can operate at ambient temperatures above 100°C is described, and an edge-triggered HT gate drive is also proposed to drive the designed power module.
Journal ArticleDOI
SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment
TL;DR: In this article, a high-temperature wirebond package for multichip phase-leg power module using SiC devices was designed, developed, fabricated, and tested.