Xiaowu Zhang

TL;DR: In this article, the nonlinear thermal stresses and strains at the interfaces between the copper, silicon, and dielectric have been determined for a wide-range of aspect ratios (of the silicon thickness and the TSV diameter).

TL;DR: In this article, the nonlinear thermal stresses and strains at the interfaces between the copper, silicon, and dielectric have been determined for a wide-range of aspect ratios (of the silicon thickness and the TSV diameter).

TL;DR: In this paper, the effect of Ag content and Ni doping on the microstructures and mechanical properties of solders was investigated for each solder using stain rates of 10−5 ǫ s−1, 10−4 ǒ s− 1, 10 −3 ǔ s− 2, 10¼ s− 3 and 10−1 Ǫ s− 4 ǎ s− 5. The results showed that the elastic modulus, yield stress and ultimate tensile strength increase with increasing strain rate and Ag content, but decrease with increasing temperature

TL;DR: Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).

TL;DR: In this article, the TSV interposer was used to provide high wiring density interconnection, to minimize CTE mismatch to the Cu/low-k chip that is vulnerable to thermal-mechanical stress, and to improve electrical performance due to shorter interconnection from the chip to the substrate.