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TL;DR: In this article, a substrate conformal imprint lithography (SCIL) technique is proposed for the fabrication of photonic crystal structures with SCIL technique on Suss MA6 mask aligner, which can be enhanced to nanoimprint with resolution of down to sub-10nm on an up to 6 inch area without affecting the established conventional optical lithographic processes on the machine.
135 citations
Journal Article•
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TL;DR: The paper presents the improvements, as well as the calibration, on state-of-the-art of measurement made using vector network analysers.
Abstract: The paper presents the improvements, as well as the calibration, on state-of-the-art of measurement made using vector network analysers.
122 citations
TL;DR: Telecentric illumination and ability to precisely control the illumination light allows to introduce resolution enhancement technologies (RET) like customized illumination, optical proximity correction (OPC) and source-mask optimization (SMO) in mask aligner lithography.
Abstract: A new illumination system for mask aligner lithography is presented. The illumination system uses two subsequent microlens-based Kohler integrators. The second Kohler integrator is located in the Fourier plane of the first. The new illumination system uncouples the illumination light from the light source and provides excellent uniformity of the light irradiance and the angular spectrum. Spatial filtering allows to freely shape the angular spectrum to minimize diffraction effects in contact and proximity lithography. Telecentric illumination and ability to precisely control the illumination light allows to introduce resolution enhancement technologies (RET) like customized illumination, optical proximity correction (OPC) and source-mask optimization (SMO) in mask aligner lithography.
83 citations
Patent•
26 Mar 2004TL;DR: In this paper, a method for calibrating a vectorial network analyzer having n measurement ports and at least 2n measurement locations (n>1) by successive measurement of the reflection and transmission parameters at different two-port calibration standards, which are connected between the measurement ports in any desired order and must all have a transmission path, and three different n-port calibrations which are not permitted to show transmission and by calculation of error coefficient and scattering matrix [Sx] with the 10-term or 7-term multiport method
Abstract: The invention relates to a method for calibrating a vectorial network analyzer having n measurement ports and at least 2n measurement locations (n>1) by successive measurement of the reflection and transmission parameters at different two-port calibration standards, which are connected between the measurement ports in any desired order and must all have a transmission path, and three different n-port calibration standards, which are connected between the measurement ports in any desired order and which are not permitted to show transmission and by calculation of error coefficient and scattering matrix [Sx] with the 10-term or 7-term multiport method An object of the invention is to propagate a method for calibrating these vectorial network analyzer used for multiport measurement which permits a calibration with increased precision and considerable reproducibility of measurement
58 citations
30 Oct 2009
TL;DR: The major adhesives and processes used for 3D TSV thin wafer handling are reviewed, thermal and other performance data on the materials and processes are provided and a first order estimate of process related thermal performance is established using a common analytical method.
Abstract: This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.
54 citations
Authors
Showing all 291 results
| Name | H-index | Papers | Citations |
|---|---|---|---|
| Ralf Keller | 28 | 192 | 2511 |
| Reinhard Völkel | 17 | 50 | 2034 |
| Holger Heuermann | 13 | 79 | 540 |
| Brian M. Erwin | 12 | 36 | 698 |
| Andrej Rumiantsev | 10 | 52 | 394 |
| Michael Hornung | 10 | 17 | 389 |
| Uwe Vogler | 9 | 31 | 329 |
| Martin Eisner | 9 | 23 | 566 |
| Peter Dress | 9 | 47 | 238 |
| Hiroyuki Ishida | 8 | 26 | 281 |
| Uwe Dietze | 8 | 39 | 190 |
| Claus Dietrich | 7 | 45 | 217 |
| Gregory George | 7 | 15 | 201 |
| Marc Hennemeyer | 7 | 15 | 212 |
| Markus Gabriel | 7 | 20 | 144 |