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Journal ArticleDOI

A new generation of CMOS-compatible high frequency micro-inductors with ferromagnetic cores: Theory, fabrication and characterisation

Klaus Seemann, +2 more
- 01 Jul 2006 - 
- Vol. 302, Iss: 2, pp 321-326
TLDR
In this paper, a new generation of CMOS-compatible micro-inductor prototypes with magnetic cores were realized, characterised as well as theoretically modelled in a frequency range up to 4 GHz, a frequency where, e.g., mobile communication and global positioning systems (GPS) are operated.
About
This article is published in Journal of Magnetism and Magnetic Materials.The article was published on 2006-07-01. It has received 32 citations till now. The article focuses on the topics: Magnetic core & Inductor.

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Citations
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Journal ArticleDOI

ε-Fe2O3: An Advanced Nanomaterial Exhibiting Giant Coercive Field, Millimeter-Wave Ferromagnetic Resonance, and Magnetoelectric Coupling

TL;DR: In this paper, the physicochemical properties of the e-polymorph of Fe2O3 have been investigated, and a combination of various experimental techniques brings essential and valuable information, with regard to understanding the physicochemic properties of e-Polymorphs.
Journal ArticleDOI

Applications of ferro-nanofluid on a micro-transformer.

TL;DR: Experimental results reveal that the presence of the ferrofluid increases the inductance of coils and the coupling coefficient of transformer; however, it also increases the resistance owing to the lag between the external magnetic field and the magnetization of the material.
Journal ArticleDOI

Soft magnetic FeCoTaN film cores for new high-frequency CMOS compatible micro-inductors

TL;DR: In this paper, annealed soft magnetic films with magnetic resonance frequencies in the GHz range determined by frequency-dependent permeability measurements were used to deposit FeCoTaN-films by reactive R.F.-magnetron sputtering and plasma beam as well as reactive ion etching.
Journal ArticleDOI

Facile fabrication of true three-dimensional microcoils inside fused silica by a femtosecond laser

TL;DR: In this paper, a facile method for the fabrication of on-chip 3D microcoils inside fused silica is presented. But the main fabrication process involves two steps: (1) creating 3D helical microchannels inside fused silicon using an improved femtosecond laser irradiation assisted by chemical etching (FLICE) technology and (2) conductive treatment by injecting metal gallium into the helical channels.
References
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Journal ArticleDOI

The modeling, characterization, and design of monolithic inductors for silicon RF IC's

TL;DR: In this paper, the results of a comprehensive investigation into the characteristics and optimization of inductors fabricated with the top-level metal of a submicron silicon VLSI process are presented.
Journal ArticleDOI

A new strip line broad-band measurement evaluation for determining the complex permeability of thin ferromagnetic films

TL;DR: In this paper, a new method for determining the frequency dependent complex permeability of thin magnetic films, designed for measurements up to 5 GHz, is presented, which is carried out by a one-port permeameter based on a short-circuited strip line.
Journal ArticleDOI

Microfabrication and characteristics of magnetic thin-film inductors in the ultrahigh frequency region

TL;DR: In this paper, a thin-film inductor for 1 GHz-drive mobile communication handset application has been demonstrated in a 370 μm×370 μm square four turn spiral of line/space with 0.1-μm-thick slitted Fe61Al13O26 film with Cr underlayer.
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The current distribution and AC resistance of a microstrip structure

TL;DR: In this article, an analysis of the AC resistance in a microstrip structure for any metallization thickness by deriving the current distribution over the strip cross section is presented, and the analysis uses the separation of variables technique and the Green's function method.
Journal ArticleDOI

Soft ferromagnetic thin films for high frequency applications

TL;DR: In this paper, the fabrication and characterization of different amorphous and nanocrystalline films with special respect to a possible integration into standard semiconductor processes is described and compared.
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