Journal ArticleDOI
Additively Manufactured Flow Manifolds Enable High Performance Direct Cooling for High Density Power Electronics
Aniket Ajay Lad,Ashrit Tayade,Muhammad Jahidul Hoque,Mohammad Hazzaz Mahmud,Fei Diao,Yuheng Wu,Yue Zhao,Juan Carlos Balda,William P. King,Nenad Miljkovic +9 more
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This article is published in Social Science Research Network.The article was published on 2022-01-01. It has received 1 citations till now. The article focuses on the topics: Electronics & Power electronics.read more
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High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
Aniket Ajay Lad,Muhammad Jahidul Hoque,Shamar Christian,Yue Zhao,Juan Carlos Balda,William P. King,Nenad Miljkovic +6 more
TL;DR: In this paper , the authors developed a liquid cooled thermal management solution for discrete semiconductor packages using polymer-metal hybrid cooling structure design and integration, which achieved a maximum heat rejection capability of 225 W per single MOSFET package, an equivalent to 75 W/cm2 heat flux dissipation using single phase cooling.
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Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink
Weilin Qu,Issam Mudawar +1 more
TL;DR: In this paper, the authors investigated the pressure drop and heat transfer characteristics of a single-phase micro-channel heat sink, which consisted of an array of rectangular micro-channels 231 lm wide and 713 lm deep.
Journal ArticleDOI
Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities
TL;DR: The performance of power electronic systems, especially in terms of efficiency and power density, has continuously improved by the intensive research and advancements in circuit topologies, control schemes, semiconductors, passive components, digital signal processors, and system integration technologies.
Journal ArticleDOI
Fluid flow and heat transfer in wavy microchannels
TL;DR: In this paper, Wang et al. used the Poincare section to analyze the fluid mixing in three-dimensional wavy microchannels with rectangular cross-sections and found that the quantity and the location of the vortices may change along the flow direction, leading to chaotic advection.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.