Patent
Apparatus for data analysis
Atsuko Yamaguchi,Hiroki Kawada +1 more
TLDR
In this article, edge points are extracted by specifying a height (values indicating a distance from a substrate) on a pattern when edges of the pattern are extracted from a CD-SEM image.Abstract:
Edge points are extracted by specifying a height (values indicating a distance from a substrate) on a pattern when edges of the pattern are extracted from a CD-SEM image. Further, LER values obtained by the extraction or a Fourier spectrum of the LER are obtained. When the same sample is previously observed with the AFM and the CD-SEM, a size of the LER obtained by specifying a height, an auto-correlation distance of the LER, or an index called the spectrum is obtained from results of the AFM observation. Further, theses indices obtained by specifying image processing conditions for detecting the edge points from the CD-SEM observation result are obtained. Also, it is determined that heights providing values when the values are matched correspond to the image processing conditions and then, the edge points are extracted from the CD-SEM IMAGE instead of the AFM observation by using the image processing conditions.read more
Citations
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References
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Journal ArticleDOI
Comparison of metrology methods for quantifying the line edge roughness of patterned features
TL;DR: In this paper, the edge roughness of patterned features in resist and silicon is quantified using atomic force microscopes and scanning electron microscopes. And the parameters that limit the edge coarseness measurement and how they compare to the parameters of critical dimension measurement are discussed.
Patent
Shape roughness measurement in optical metrology
TL;DR: In this article, a statistical function of shape roughness is defined and a statistical perturbation is derived based on the statistical function and superimposed on the initial model to define a modified model of the structure.
Patent
High-accuracy pattern shape evaluating method and apparatus
TL;DR: In this article, the S-dependence of the edge roughness index is analyzed and a term of a dispersion value directly proportional to 1/S is determined as being due to noise.
Patent
Optical measurements of line edge roughness
TL;DR: A method and system for optical measurements of line edge roughness (LER) of patterned structures based on illuminating the structure with incident radiation and detecting a spectral response of the structure, and further applying software and/or hardware utilities for deriving information representative of said line edge Roughness parameter/s from said spectral response as mentioned in this paper.
Patent
Method of measuring a line edge roughness of micro objects in scanning microscopes
Arkady Nikitin,Dmitriy Yeremin +1 more
TL;DR: In this article, a line edge roughness of micro objects is determined in a microscope by corresponding scanning and determination of deviations of points of the edge from a straight line, and the deviation of points from the straight line is used to determine the micro object's roughness.