Journal ArticleDOI
Automatic Inspection System for Printed Circuit Boards
Reads0
Chats0
TLDR
problems and methods in automating visual inspection of printed circuit boards (PCB's) and an algorithm comparing local features of the patterns to be inspected with those of the pattern to be referenced is proposed.Abstract:
The purpose of this correspondence is to present problems and methods in automating visual inspection of printed circuit boards (PCB's). Vertical and diagonal illumination are useful in detecting PCB patterns correctly. An algorithm comparing local features of the patterns to be inspected with those of the pattern to be referenced is proposed. An inspection system using developed technologies is also described.read more
Citations
More filters
Journal ArticleDOI
Automatic PCB Inspection Algorithms
TL;DR: This survey concentrates mainly on image analysis and fault detection strategies; these also include state-of-the-art techniques.
Journal ArticleDOI
Automated inspection of printed circuit boards through machine vision
TL;DR: In this article, an automated visual inspection system for printed circuit boards (PCBs) is presented, which utilizes an elimination-subtraction method which directly subtracts the template image from the inspected image, and then conducts an elimination procedure to locate defects in the PCB.
PatentDOI
Method and apparatus for performing automated circuit board quality inspection
John A. Adams,Paul Axford,Philip H. Bowles,Van Nguyen,Charles Preskitt,Ed Ross,Doug Thompson,Paul Turner,Juan Amoroso,Mike Juha +9 more
TL;DR: In this article, a real-time digital X-ray radiographic inspection of a manufactured circuit board containing solder joints is performed using a multi-axis positioning system between an electronic Xray source and an electronic x-ray imaging system.
Journal ArticleDOI
A tiered-color illumination approach for machine inspection of solder joints
D.W. Capson,S.-K. Eng +1 more
TL;DR: An experimental color vision inspection system for the detection of solder joint flaws on printed circuit boards is described and the performance of the system was tested on samples of commercially manufactured, wave-soldered circuit boards.
Journal ArticleDOI
State of the Art in Defect Detection Based on Machine Vision
TL;DR: A detailed description of the application of deep learning in defect classification, localization and segmentation follows the discussion of traditional defect detection algorithms.
References
More filters
Journal ArticleDOI
Use of the Hough transformation to detect lines and curves in pictures
Richard O. Duda,Peter E. Hart +1 more
TL;DR: It is pointed out that the use of angle-radius rather than slope-intercept parameters simplifies the computation further, and how the method can be used for more general curve fitting.
Journal ArticleDOI
A process for detecting defects in complicated patterns
TL;DR: A defect extraction device was developed that makes it possible to detect the defects in complicated patterns in a real-time mode and has promise in facilitating the automation of tedious visual inspection processes such as those for printed circuit boards.
Journal ArticleDOI
A Method for Automating the Visual Inspection of Printed Wiring Boards
TL;DR: The method employed in this study is based on characterizing 5 × 5 or 7 × 7 element binary patterns derived from the class of PWB's being inspected as good or defective, and the small number of patterns needed to represent virtually all of the normal border patterns suggests a two-stage inspection strategy.
Journal ArticleDOI
An automated mask inspection system—AMIS
TL;DR: In this article, the authors describe an automated mask inspection system (AMIS) used for inspection of step-and-repeat masks used in the fabrication of silicon integrated circuits, which is used to inspect both masters and copies for defects as small as 2 µm and is capable of measuring individual feature linewidths to less than M 1 µm.
Proceedings ArticleDOI
An Automatic Optical Printed Circuit Inspection System
TL;DR: In this paper, a prototype automatic inspection system using minimum linewidth and line clearance criteria is described, which uses linearolid state arrays for sensors and is used to detect nicked conductors.