Environment-Friendly Electronics: Lead-Free Technology
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This article is published in Journal of Electronic Packaging.The article was published on 2005-12-01 and is currently open access. It has received 118 citations till now.read more
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Journal ArticleDOI
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Yi Li,Ching-Ping Wong +1 more
TL;DR: In this article, the authors discuss the materials, applications and recent advances of electrically conductive adhesives as an environmental friendly solder replacement in the electronic packaging industry, and discuss the potential of ECAs to replace tin-lead metal solders in all applications.
Journal ArticleDOI
A review of mechanical properties of lead-free solders for electronic packaging
Hongtao Ma,Jeffrey C. Suhling +1 more
TL;DR: In this article, a review of the available data in the field and give rise to the possible factors including room temperature effects, which causes the large discrepancies of data for both lead-free and SnPb solders.
Proceedings ArticleDOI
The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints
TL;DR: In this paper, the effects of elevated temperature isothermal aging on the mechanical behavior and reliability of lead free solders were explored by performing stress-strain and creep tests on SAC405 and SAC305 samples that were aged for various durations (0-6 months).
Proceedings ArticleDOI
Reliability of the aging lead free solder joint
TL;DR: In this article, a novel specimen preparation procedure has been developed where the solder uniaxial test specimens are formed in high precision rectangular cross-section glass tubes using a vacuum suction process.
Journal ArticleDOI
Review Of Recent Advances In Electrically Conductive Adhesive Materials And Technologies In Electronic Packaging
TL;DR: In this paper, double and triple-layered Anisotropic Conductive Films (ACF) were developed to meet fine pitch interconnection, low-temperature curing and strong adhesion requirements.
Related Papers (5)
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
Yi Li,Ching-Ping Wong +1 more