Journal ArticleDOI
Failure analysis of power modules: a look at the packaging and reliability of large IGBTs
H. de lambilly,H. Keser +1 more
- Vol. 16, Iss: 4, pp 412-417
TLDR
In this article, power cycling tests on power modules consisting of insulated-gate bipolar transistors chips connected in parallel are reported, and the following problems were found to degrade the properties of the modules: (1) Thick wire connections debonded after a low number of cycles because of mechanical strain.Abstract:
Power cycling tests on power modules consisting of insulated-gate bipolar transistors chips connected in parallel are reported. The following problems were found to degrade the properties of the modules: (1) Thick wire connections debonded after a low number of cycles because of mechanical strain. (2) Substrate assemblies deformed due to bimetallic effects, leading to poor thermal contact to the heatsink, and in some cases, to a cracking of electrical interconnects. (3) Soldering of substrates to large copper plates was of poor quality. The high number of large voids created intolerable differences in thermal resistance between the paralleled chips. It appears that the packaging technologies used are insufficient for power modules with paralleled chips when a high number of load cycles is expected. >read more
Citations
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Journal ArticleDOI
Survey on Reliability of Power Electronic Systems
Yantao Song,Bingsen Wang +1 more
TL;DR: A comprehensive review of reliability assessment and improvement of power electronic systems from three levels: 1) metrics and methodologies of reliability assess of existing system; 2) reliability improvement of existing systems by means of algorithmic solutions without change of the hardware; and 3) reliability-oriented design solutions that are based on fault-tolerant operation of the overall systems.
Journal ArticleDOI
Reliability of power cycling for IGBT power semiconductor modules
TL;DR: In this article, a new tin-silver-based solder material was developed, which has both excellent mechanical properties and wettability, and the failure mechanism of power cycling for this newly developed solder material, solder joint failure and aluminum wire bond failure were clearly distinguished.
Journal ArticleDOI
Power Cycling Reliability of Power Module: A Survey
TL;DR: In this article, a detailed statistical review of publications from 1994 to 2015 dealing with power cycling is presented, which reveals the principal trends in power electronic devices and highlights the main reliability issues for which an important lack of knowledge remains.
Journal ArticleDOI
Failure modes and FEM analysis of power electronic packaging
Hua Ye,Minghui Lin,Cemal Basaran +2 more
TL;DR: The failure modes of power electronics devices especially IGBTs are reviewed and a FEM analysis of a multilayered IGBT packaging module under cyclic thermal loading is presented.
Journal Article
Failure modes and FEM analysis of power electronic packaging
Hua Ye,Minghui Lin,Cemal Basaran +2 more
TL;DR: In this article, the failure modes of power electronics devices, especially IGBTs, are reviewed and a FEM analysis of a multilayered IGBT packaging module under cyclic thermal loading is presented.
References
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Journal ArticleDOI
Solder Fatigue Problems in Power Packages
James F. Burgess,R. O. Carlson,Homer Hopson Ii Glascock,Constantine Alois Neugebauer,Harold F. Webster +4 more
TL;DR: In this article, the fatigue of solder connections in power packaging has been investigated and three different types of structures consisting of silicon diodes attached to copper heatsinks have been thermally cycled and the integrity of the bonds compared.
Journal ArticleDOI
Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors
TL;DR: In this article, the structure of the soft-soldered joints in Si power transistors (type 2N3055), which failed electrically during thermal cycling, was characterized using scanning electron microscopy.