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Journal ArticleDOI

Gas heating in plasma-assisted sputter deposition

Alberto Palmero, +2 more
- 08 Aug 2005 - 
- Vol. 87, Iss: 7, pp 071501
TLDR
In this paper, the authors present a theoretical framework to deal with an important source of nonhomogeneity in plasma-assisted sputter deposition, which is the gas heating due to the interaction between the background gas and the flow of energetic sputtered particles.
Abstract
We present a theoretical framework to deal with an important source of nonhomogeneity in plasma-assisted sputter deposition. The gas heating due to the interaction between the background gas and the flow of energetic sputtered particles seems to be of significance under realistic deposition conditions. The results illustrate that the decrease of the gas density due to this heating has to be taken into account for a proper description of the deposition process, even when the total pressure in the system remains constant. The Keller–Simmons equation, that describes the deposition rate in a parallel plate reactor, has been studied in the case of such a nonhomogeneous plasma. We determine the conditions for its applicability and find a direct relation between the throw distance, the temperature of the growing film and the cross section of elastic scattering of a sputtered atom on a gas particle.

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Citations
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Journal ArticleDOI

Perspectives on oblique angle deposition of thin films: From fundamentals to devices

TL;DR: In this article, the electron beam assisted evaporation technique is analyzed along with other methods operating at oblique angles, including, among others, magnetron sputtering and pulsed laser or ion beam-assisted deposition techniques.
Journal ArticleDOI

An introduction to thin film processing using high-power impulse magnetron sputtering

TL;DR: In this paper, the authors present a review of the features distinguishing HiPIMS from other deposition methods along with how they influence the deposition conditions, such as the plasma parameters and the sputtered material, as well as the resulting thin film properties.
Journal ArticleDOI

Investigation of optical and electrical properties of ZnO thin films

TL;DR: In this article, the authors used time-resolved photoluminescence measurements to verify that the carrier lifetime increases with working pressure due to the reduction of nonradiative recombination rate.
Journal ArticleDOI

Argon metastables in HiPIMS: time-resolved tunable diode-laser diagnostics

TL;DR: Time-resolved tunable diode-laser absorption spectroscopy measurements were performed on the argon metastable (Ar-m) level 3s(2)3p(5)(P-2(3/2)degrees)4s excited at 801.478 nm, in the dense plasma r...
References
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Book

Handbook of sputter deposition technology

Kiyotaka Wasa, +1 more
TL;DR: A comprehensive overview of sputter deposition technology, a key technology for materials research in the next decade, can be found in this paper, where the authors present an overview of the main applications of sputtering in the microelectronics industry.
Journal ArticleDOI

Calculation of deposition rates in diode sputtering systems

TL;DR: In this paper, the scattering of sputtered atoms by the sputtering gas has been modelled to obtain values for the distances which the atoms travel normal to the target before their energies are reduced to the thermal energy of the gas.
Journal ArticleDOI

Gas density reduction effects in magnetrons

TL;DR: In this paper, the gas density in front of a magnetron cathode has been found to be significantly reduced as a function of magnetron current, due to gas heating and rarefaction resulting from collisions with the sputtered atoms ejected from the cathode surface.
Journal ArticleDOI

Sputtering process model of deposition rate

TL;DR: In this paper, a model of the sputtering process is developed that predicts the deposition rate of a sputtering system with parallel-plate geometry, and the model is valid for magnetic, tuned substrate, driven substrate, and controlled area ratio diode systems.
Journal ArticleDOI

The analysis of background gas heating in direct current sputtering discharges via particle simulation

TL;DR: In this article, a particle-in-cell/Monte Carlo numerical model has been developed to simulate a direct current discharge self-consistently with the motion and thermalization of both energetic charge exchange neutrals and sputtered cathode atoms.